The finite element method(FEM) is used to analyze the effects of lead widths and pitches on reliability of soldered joints. The optimum simulation for QFP devices is also researched. The results indicate that when t...The finite element method(FEM) is used to analyze the effects of lead widths and pitches on reliability of soldered joints. The optimum simulation for QFP devices is also researched. The results indicate that when the lead pitches are the same, the maximum equivalent stress of the soldered joints increases with the increasing of lead widths, while the reliability of the soldered joints reduces. When the lead widths are the same, the maximum equivalent stress of the soldered joints doesn't decrease completely with the increasing of lead pitches, a minimum value of the maximum equivalent stress values exists in all the curves. Under this condition the maximum equivalent stress of the soldewed joints is relatively the least, the reliability of soldered joints is high and the assembly is excellent. The simulating results indicate the best parameter: The lead width is 0.2 mm and lead pitch is 0.3 mm (the distance between two leads is 0.1 mm), which are benefited for the micromation of QFP devices now. The minimum value of the maximum equivalent stress of soldered joints exists while lead width is 0.25 mm and lead pitch is 0.35 mm (the distance between two leads is 0.1 mm), the devices can serve for a long time and the reliability is the highest, the assembly is excellent. The simulating results also indicate the fact that the lead width is 0.15 mm and lead pitch is 0.2 mm maybe the limit of QFP, which is significant for the high lead count and micromation of assembly.展开更多
Modularized construction is a new type of prefabricated building system with green environmental protection and excellent performance. There are few studies on the seismic performance of its key connection joint. This...Modularized construction is a new type of prefabricated building system with green environmental protection and excellent performance. There are few studies on the seismic performance of its key connection joint. This paper presents a new type of assembled connection joint for the high-rise modularized construction. Cyclic shear tests of full-scale joints were carried out, and the key indexes of their seismic performances including the hysteretic performance, ductility, and energy dissipation capacity were analyzed and obtained. The results show that the hysteresis loops of longitudinal and lateral cyclic shear tests were both plump in shapes. The ductility coefficients were 4.54 and 4.98, and the energy dissipation coefficients were 1.83 and 1.43, respectively. The test joint had good ductility and energy dissipation capacity. The positions of yield failure of specimens were mainly concentrated in the connection areas between the column and short beam or end-plate. The research can provide the technical reference for the seismic design and engineering application of related modularized constructions.展开更多
基金This project is supported by Provincial Six Kind Skilled Personnel Project of Jiangsu,China(No.06-E-020).
文摘The finite element method(FEM) is used to analyze the effects of lead widths and pitches on reliability of soldered joints. The optimum simulation for QFP devices is also researched. The results indicate that when the lead pitches are the same, the maximum equivalent stress of the soldered joints increases with the increasing of lead widths, while the reliability of the soldered joints reduces. When the lead widths are the same, the maximum equivalent stress of the soldered joints doesn't decrease completely with the increasing of lead pitches, a minimum value of the maximum equivalent stress values exists in all the curves. Under this condition the maximum equivalent stress of the soldewed joints is relatively the least, the reliability of soldered joints is high and the assembly is excellent. The simulating results indicate the best parameter: The lead width is 0.2 mm and lead pitch is 0.3 mm (the distance between two leads is 0.1 mm), which are benefited for the micromation of QFP devices now. The minimum value of the maximum equivalent stress of soldered joints exists while lead width is 0.25 mm and lead pitch is 0.35 mm (the distance between two leads is 0.1 mm), the devices can serve for a long time and the reliability is the highest, the assembly is excellent. The simulating results also indicate the fact that the lead width is 0.15 mm and lead pitch is 0.2 mm maybe the limit of QFP, which is significant for the high lead count and micromation of assembly.
基金Sponsored by the Natural Science Foundation of Shandong Province of China (Grant No. ZR2019MEE047)the National Key Research and Development Project of China (Grant No. 2020YFB1901403)CSCEC Technical and Development Plan (Grant No. CSCEC-2020-Z-35)。
文摘Modularized construction is a new type of prefabricated building system with green environmental protection and excellent performance. There are few studies on the seismic performance of its key connection joint. This paper presents a new type of assembled connection joint for the high-rise modularized construction. Cyclic shear tests of full-scale joints were carried out, and the key indexes of their seismic performances including the hysteretic performance, ductility, and energy dissipation capacity were analyzed and obtained. The results show that the hysteresis loops of longitudinal and lateral cyclic shear tests were both plump in shapes. The ductility coefficients were 4.54 and 4.98, and the energy dissipation coefficients were 1.83 and 1.43, respectively. The test joint had good ductility and energy dissipation capacity. The positions of yield failure of specimens were mainly concentrated in the connection areas between the column and short beam or end-plate. The research can provide the technical reference for the seismic design and engineering application of related modularized constructions.