Copper sheet with grain size of 30-60μm was processed by plastic deformation of asymmetrical accumulative rolling-bonding(AARB)with the strain of 3.2.The effects of annealing temperature and time on microstructural e...Copper sheet with grain size of 30-60μm was processed by plastic deformation of asymmetrical accumulative rolling-bonding(AARB)with the strain of 3.2.The effects of annealing temperature and time on microstructural evolution were studied by means of electron backscattered diffraction(EBSD).EBSD grain mapping,recrystallization pole figure and grain boundary misorientation angle distribution graph were constructed,and the characteristics were assessed by microstructure,grain size,grain boundary misorientation and texture.The results show that ultra fine grains(UFG)are obtained after annealing at 250℃ for 30?40 min.When the annealing is controlled at 250℃for 40 min,the recrystallization is finished,a large number of small grains appear and most grain boundaries consist of low-angle boundaries.The character of texture is rolling texture after the recrystallization treatment,but the strength of the texture is faint.While second recrystallization happens,{110}<1ī2>+{112}<11ī> texture component disappears and turns into{122}<212>cube twin texture component.展开更多
对七道次异步叠轧铜板采用220℃×30 m in和220℃×40 m in两种工艺进行退火,运用背散射电子衍射技术对两种铜板的再结晶程度、织构和晶界特征分布进行了研究。结果表明,经220℃×40 m in退火处理后,铜板的再结晶较完全,其...对七道次异步叠轧铜板采用220℃×30 m in和220℃×40 m in两种工艺进行退火,运用背散射电子衍射技术对两种铜板的再结晶程度、织构和晶界特征分布进行了研究。结果表明,经220℃×40 m in退火处理后,铜板的再结晶较完全,其织构为明显的{100}〈001〉立方织构;而经220℃×30 m in退火处理后,铜板内仍存在晶体缺陷,其织构为{123}〈412〉轧制织构及少量的{100}〈001〉立方织构。晶界特征分布图表明晶界都主要分布在Σ1、Σ3、Σ7、Σ9和Σ11位置上,采用220℃×40 m in退火处理后铜板中各主要晶界的含量明显高于采用220℃×30m in退火后的。展开更多
对七道次异步叠轧铜板采用220℃×30 m in和220℃×40 m in两种退火工艺,运用背散射电子衍射技术(EBSD)对两种铜板的再结晶程度、极图和织构进行了研究.结果表明:采用220℃×40 m in退火工艺的铜板再结晶较完全,其织构为明...对七道次异步叠轧铜板采用220℃×30 m in和220℃×40 m in两种退火工艺,运用背散射电子衍射技术(EBSD)对两种铜板的再结晶程度、极图和织构进行了研究.结果表明:采用220℃×40 m in退火工艺的铜板再结晶较完全,其织构为明显的{100}〈001〉立方织构;而采用220℃×30 m in退火工艺的铜板内仍存在晶体缺陷,其织构为{123}〈412〉轧制织构,及少量的{100}〈001〉立方织构.展开更多
基金Projects(50804018,50564005)supported by the National Natural Science Foundation of ChinaProject(2003E0003Z)supported by the Key Science Foundation of Yunnan Province,China+1 种基金Project(08Y0055)supported by Scientific Research Fund of Yunnan Provincial Education Department,ChinaProject(2008-055)supported by Talents Cultivation Foundation of Kunming University of Science and Technology,China
文摘Copper sheet with grain size of 30-60μm was processed by plastic deformation of asymmetrical accumulative rolling-bonding(AARB)with the strain of 3.2.The effects of annealing temperature and time on microstructural evolution were studied by means of electron backscattered diffraction(EBSD).EBSD grain mapping,recrystallization pole figure and grain boundary misorientation angle distribution graph were constructed,and the characteristics were assessed by microstructure,grain size,grain boundary misorientation and texture.The results show that ultra fine grains(UFG)are obtained after annealing at 250℃ for 30?40 min.When the annealing is controlled at 250℃for 40 min,the recrystallization is finished,a large number of small grains appear and most grain boundaries consist of low-angle boundaries.The character of texture is rolling texture after the recrystallization treatment,but the strength of the texture is faint.While second recrystallization happens,{110}<1ī2>+{112}<11ī> texture component disappears and turns into{122}<212>cube twin texture component.
文摘对七道次异步叠轧铜板采用220℃×30 m in和220℃×40 m in两种工艺进行退火,运用背散射电子衍射技术对两种铜板的再结晶程度、织构和晶界特征分布进行了研究。结果表明,经220℃×40 m in退火处理后,铜板的再结晶较完全,其织构为明显的{100}〈001〉立方织构;而经220℃×30 m in退火处理后,铜板内仍存在晶体缺陷,其织构为{123}〈412〉轧制织构及少量的{100}〈001〉立方织构。晶界特征分布图表明晶界都主要分布在Σ1、Σ3、Σ7、Σ9和Σ11位置上,采用220℃×40 m in退火处理后铜板中各主要晶界的含量明显高于采用220℃×30m in退火后的。
文摘对七道次异步叠轧铜板采用220℃×30 m in和220℃×40 m in两种退火工艺,运用背散射电子衍射技术(EBSD)对两种铜板的再结晶程度、极图和织构进行了研究.结果表明:采用220℃×40 m in退火工艺的铜板再结晶较完全,其织构为明显的{100}〈001〉立方织构;而采用220℃×30 m in退火工艺的铜板内仍存在晶体缺陷,其织构为{123}〈412〉轧制织构,及少量的{100}〈001〉立方织构.
