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Fabrication of Nanoscale Step Height Structure Using Atomic Layer Deposition Combined with Wet Etching 被引量:3
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作者 WANG Chenying YANG Shuming +4 位作者 JING Weixuan REN Wei LIN Qijing ZHANG Yijun JIANG Zhuangde 《Chinese Journal of Mechanical Engineering》 SCIE EI CAS CSCD 2016年第1期91-97,共7页
The current techniques used for the fabrication of nanosteps are normally done by layer growth and then ion beam thinning. There are also extra films grown on the step surfaces in order to reduce the roughness. So the... The current techniques used for the fabrication of nanosteps are normally done by layer growth and then ion beam thinning. There are also extra films grown on the step surfaces in order to reduce the roughness. So the whole process is time consuming. In this paper, a nanoscale step height structure is fabricated by atomic layer deposition (ALD) and wet etching techniques. According to the traceable of the step height value, the fabrication process is controllable. Because ALD technology can grow a variety of materials, aluminum oxide (Al2O3) is used to fabricate the nanostep. There are three steps of Al2O3 in this structure including 8 nm, 18 nm and 44 inn. The thickness of Al2O3 film and the height of the step are measured by anellipsometer. The experimental results show that the thickness of Al2O3 film is consistent with the height of the step. The height of the step is measured by AFM. The measurement results show that the height is related to the number of cycles of ALD and the wet etching time. The bottom and the sidewall surface roughness are related to the wet etching time. The step height is calibrated by Physikaliseh-Technische Bundesanstalt (PTB) and the results were 7.5±1.5 nm, 15.5±2.0 nm and 41.8±2.1 nm, respectively. This research provides a method for the fabrication of step height at nanoscale and the nanostep fabricated is potential used for standard references. 展开更多
关键词 atomic layer deposition ald wet etching step height
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Atomic layer deposition for nanoscale oxide semiconductor thin film transistors:review and outlook 被引量:5
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作者 Hye-Mi Kim Dong-Gyu Kim +2 位作者 Yoon-Seo Kim Minseok Kim Jin-Seong Park 《International Journal of Extreme Manufacturing》 SCIE EI CAS CSCD 2023年第1期153-180,共28页
Since the first report of amorphous In–Ga–Zn–O based thin film transistors,interest in oxide semiconductors has grown.They offer high mobility,low off-current,low process temperature,and wide flexibility for compos... Since the first report of amorphous In–Ga–Zn–O based thin film transistors,interest in oxide semiconductors has grown.They offer high mobility,low off-current,low process temperature,and wide flexibility for compositions and processes.Unfortunately,depositing oxide semiconductors using conventional processes like physical vapor deposition leads to problematic issues,especially for high-resolution displays and highly integrated memory devices.Conventional approaches have limited process flexibility and poor conformality on structured surfaces.Atomic layer deposition(ALD)is an advanced technique which can provide conformal,thickness-controlled,and high-quality thin film deposition.Accordingly,studies on ALD based oxide semiconductors have dramatically increased recently.Even so,the relationships between the film properties of ALD-oxide semiconductors and the main variables associated with deposition are still poorly understood,as are many issues related to applications.In this review,to introduce ALD-oxide semiconductors,we provide:(a)a brief summary of the history and importance of ALD-based oxide semiconductors in industry,(b)a discussion of the benefits of ALD for oxide semiconductor deposition(in-situ composition control in vertical distribution/vertical structure engineering/chemical reaction and film properties/insulator and interface engineering),and(c)an explanation of the challenging issues of scaling oxide semiconductors and ALD for industrial applications.This review provides valuable perspectives for researchers who have interest in semiconductor materials and electronic device applications,and the reasons ALD is important to applications of oxide semiconductors. 展开更多
关键词 atomic layer deposition(ald) oxide semiconductor thin film transistor(TFT)
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Characterization of Cd1-xZnxTe(0≤x≤1) Nanolayers Grown by Atomic Layer Deposition on GaSb and GaAs(001) Oriented Substrates
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作者 Joel Díaz-Reyes Roberto Saúl Castillo-Ojeda José Eladio Flores-Mena 《Journal of Electronic Science and Technology》 CAS CSCD 2019年第2期97-108,共12页
ZnTe, CdTe, and the ternary alloy CdZnTe are important semiconductor materials used widely for the detection of an important range of electromagnetic radiation as gamma ray and X-ray. Although, recently these material... ZnTe, CdTe, and the ternary alloy CdZnTe are important semiconductor materials used widely for the detection of an important range of electromagnetic radiation as gamma ray and X-ray. Although, recently these materials have acquired renewed importance due to the new explored nanolayer properties of modern devices. In addition, as shown in this work they can be grown using uncomplicated synthesis techniques based on the deposition in vapour phase of the elemental precursors. This work presents the results obtained from the deposition of nanolayers of these materials using the precursor vapour on GaAs and GaSb (001) substrates. This growth technique, extensively known as atomic layer deposition (ALD), allows the layers growth with nanometric dimension. The main results presented in this work are the used growth parameters and the results of the structural characterization of the layers by the means of Raman spectroscopy measurements. Raman scattering shows the peak corresponding to longitudinal optical (LO)-ZnTe, which is weak and slightly redshift in comparison with that reported for the ZnTe bulk at 210 cm^-1. For the case of the CdTe nanolayer, Raman spectra presented the LO-CdTe peak, which is indicative of the successful growth of the layer. Its weak and slightly redshift in comparison with that reported for the CdTe bulk can be related with the nanometric characteristic of this layer. The performed high-resolution X-ray diffraction (HR-XRD) measurement allows to study some important characteristics such as the crystallinity of the grown layer. In addition, the HR-XRD measurement suggests that the crystalline quality has dependence on the growth temperature. 展开更多
关键词 Ⅲ-Ⅴ SUBSTRATES atomic layer deposition(ald) defect generation mechanism TERNARY alloy Cd1-xZnxTe Zn and Cd mixture
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ALD法制备Li掺杂NiO_(x)作为HTL提升PSC性能
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作者 罗启仁 刘昌 吴昊 《半导体技术》 CAS 北大核心 2024年第10期885-892,898,共9页
空穴传输层(HTL)是影响钙钛矿太阳能电池性能的主要因素之一。氧化镍(NiO_(x))是广为关注的无机HTL材料。原子层沉积(ALD)法具有厚度精准控制、台阶覆盖性好、薄膜质量高等优势,采用ALD法制备了不同比例锂(Li)掺杂的NiO_(x)薄膜。结果显... 空穴传输层(HTL)是影响钙钛矿太阳能电池性能的主要因素之一。氧化镍(NiO_(x))是广为关注的无机HTL材料。原子层沉积(ALD)法具有厚度精准控制、台阶覆盖性好、薄膜质量高等优势,采用ALD法制备了不同比例锂(Li)掺杂的NiO_(x)薄膜。结果显示ALD法制备的NiO_(x)薄膜具有较小的均方根表面粗糙度、较高的光学透过率、较大的禁带宽度,而合适的Li掺杂量可以调制其与钙钛矿吸收层之间的能带匹配,这有利于获得更高的开路电压与短路电流。最终,以Li与NiO_(x)掺杂比为1∶500的NiO_(x)薄膜作为HTL制备了电池器件,开路电压高达1.14 V,短路电流为21.73 mA/cm^(2),填充因子为80.5%,光电转换效率为19.95%,这在宽带隙倒置钙钛矿电池中是一个不错的水平。 展开更多
关键词 原子层沉积(ald) 氧化镍 钙钛矿太阳能电池 锂掺杂 空穴传输层(HTL)
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沉积温度对ALD制备HfO_(2)薄膜结构和性能的影响 被引量:1
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作者 赵恒利 杨培志 李赛 《半导体技术》 CAS 北大核心 2022年第3期205-210,242,共7页
采用原子层沉积(ALD)技术,以四(乙基甲基胺基)铪(TEMAHf)和去离子水为前驱体,沉积温度分别为150、200、250和300℃时,在单面抛光硅片和石英玻璃衬底上制备了HfO_(2)薄膜,并对薄膜进行了表征,研究了沉积温度对HfO_(2)薄膜结构和力学、光... 采用原子层沉积(ALD)技术,以四(乙基甲基胺基)铪(TEMAHf)和去离子水为前驱体,沉积温度分别为150、200、250和300℃时,在单面抛光硅片和石英玻璃衬底上制备了HfO_(2)薄膜,并对薄膜进行了表征,研究了沉积温度对HfO_(2)薄膜结构和力学、光学及电学性能的影响。结果表明,当沉积温度低于200℃时,制备的HfO_(2)薄膜为非晶态,在300℃时制备的薄膜结晶度最高;随沉积温度的升高HfO_(2)薄膜厚度减小,表面粗糙度呈现先递增后下降的趋势,硬度和弹性模量均有所下降,残余应力不断增加,折射率略有增加,击穿电压先不变后减小,击穿场强先缓慢增大后明显减小,介电常数先增大后减小。沉积温度为300℃时制备的HfO_(2)薄膜的均匀性和致密性最好,沉积温度为200℃时制备的HfO_(2)薄膜的电学性能最佳。 展开更多
关键词 HfO_(2)薄膜 原子层沉积(ald) 沉积温度 表面形貌 光电性能
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ALD反应沉积超薄TiO_(2)改性LiNi_(0.8)Co_(0.1)Mn_(0.1)O_(2)正极材料及其电化学性能
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作者 朱明原 刘文博 +3 位作者 李瑛 刘杨 李文献 张久俊 《上海大学学报(自然科学版)》 CAS CSCD 北大核心 2023年第2期312-322,共11页
高镍三元正极材料LiNi_(x)Co_(y)Mn_(1-x-y)O_(2)(NCM,ω(Ni)60%)由于粉体颗粒表面的相变,电解液副产物HF的侵蚀,过渡金属离子的溶解等问题,其循环性能及安全稳定性一直不理想.通过原子层沉积(atomic layer deposition,ALD)反应在高镍Li... 高镍三元正极材料LiNi_(x)Co_(y)Mn_(1-x-y)O_(2)(NCM,ω(Ni)60%)由于粉体颗粒表面的相变,电解液副产物HF的侵蚀,过渡金属离子的溶解等问题,其循环性能及安全稳定性一直不理想.通过原子层沉积(atomic layer deposition,ALD)反应在高镍Li Ni_(0.8)Co_(0.1)Mn_(0.1)O_(2)(NCM811)正极材料表面均匀沉积了超薄Ti O_(2)涂层,用于改善其电化学性能.研究结果表明:通过ALD反应沉积Ti O_(2)后,改性NCM811的性能明显改善;超薄Ti O_(2)涂层阻碍了NCM811活性颗粒与电解液的直接接触,提高了材料的循环稳定性;在循环过程中,超薄涂层不会影响锂离子的传输.通过ALD反应沉积超薄涂层为改性电极材料提供了新思路. 展开更多
关键词 LiNi_(0.8)Co_(0.1)Mn_(0.1)O_(2) 原子层沉积 锂离子电池 正极材料 TiO_(2)
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采用ALD方法制备TiO_2/Al_2O_3布拉格反射镜并配合金属反射镜来增强背镀结构的反射效率(英文) 被引量:2
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作者 陈洪钧 郭浩 +1 位作者 张雄 崔一平 《电子器件》 CAS 北大核心 2013年第4期431-436,共6页
首次采用原子层沉积法制备TiO2/Al2O3布拉格反射镜并配合金属反射镜来制备了高反射率的背反射镜。制备的多层布拉格反射镜加Al镜和多层布拉格反射镜加Ag镜有很好的平整度和厚度的精确性,并且反射率高于96%。此外,TiO2/Al2O3布拉格反射镜... 首次采用原子层沉积法制备TiO2/Al2O3布拉格反射镜并配合金属反射镜来制备了高反射率的背反射镜。制备的多层布拉格反射镜加Al镜和多层布拉格反射镜加Ag镜有很好的平整度和厚度的精确性,并且反射率高于96%。此外,TiO2/Al2O3布拉格反射镜和Al与蓝宝石衬底都有良好的粘合性,这样可以节省制备步骤并且可以得到高质量的背反射镜。利用原子层沉积技术和TiO2/Al2O3布拉格反射镜,我们得到了高反射率,角度依赖性小,更加稳定以及均一性更好的背反射镜,可以满足高亮度LED的需求。 展开更多
关键词 背反射镜 布拉格反射镜 金属反射镜 原子层沉积
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基于ALD低温制备的纳米涂层刀具性能研究 被引量:1
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作者 王睿 唐思文 +3 位作者 刘德顺 刘骞 卞凯 李佩真 《表面技术》 EI CAS CSCD 北大核心 2021年第5期364-371,共8页
目的探索基于原子层沉积法(Atomic Layer Deposition, ALD)的纳米涂层低温制备技术,并重点研究涂层沉积过程及纳米氧化铝涂层对刀具力学性能的影响。方法利用原子层沉积法,在200℃的环境下制备不同涂层厚度的纳米Al_2O_3涂层刀具,对涂... 目的探索基于原子层沉积法(Atomic Layer Deposition, ALD)的纳米涂层低温制备技术,并重点研究涂层沉积过程及纳米氧化铝涂层对刀具力学性能的影响。方法利用原子层沉积法,在200℃的环境下制备不同涂层厚度的纳米Al_2O_3涂层刀具,对涂层的微观组织、厚度、硬度、断裂韧性、断口形貌、弯曲强度、结合力及摩擦系数进行检测。结果 ALD沉积技术能将纳米涂层均匀沉积在YT5刀具表面,且涂层光滑,无滴状气泡,涂层厚度可以精确控制在纳米级。ALD涂层与基体结合力的大小与涂层厚度相关,随着涂层厚度增大,结合力呈先增后降的趋势,测得50、100、200 nm等3种纳米涂层结合力大小分别为11.07、12.74、7.86N。纳米涂层能够提高刀具的硬度,显著降低刀具表面的摩擦系数,测得刀具摩擦系数分别为0.56、0.43、0.67,最高降低摩擦系数达40%以上。此外在200℃的沉积温度下,没有产生金属相变,因而对刀具基体没有影响,刀具的断裂韧性和弯曲强度没有降低。结论基于ALD的纳米涂层低温沉积技术所制备的纳米涂层刀具,具有良好的力学性能及涂层-基体界面结合力,能显著提高刀具性能,改善切削加工条件。 展开更多
关键词 刀具 纳米涂层 原子层沉积 低温制备 微观组织 结合力 力学性能
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不锈钢管内表面钝化膜ALD制备及抗结焦性能 被引量:2
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作者 朱昌发 郭金鑫 +1 位作者 赵书军 马大衍 《材料热处理学报》 EI CAS CSCD 北大核心 2020年第7期167-174,180,共9页
采用原子层沉积(ALD)技术在SS316不锈钢管内壁制备了Al2O3、TiO2和Ru钝化层,研究其对抗结焦性能影响。结果表明:所制备Al2O3钝化薄膜相结构为γ-Al2O3,TiO2为锐钛矿结构,Ru为密排六方结构。钝化处理能够延长燃油循环系统工作时间,管内... 采用原子层沉积(ALD)技术在SS316不锈钢管内壁制备了Al2O3、TiO2和Ru钝化层,研究其对抗结焦性能影响。结果表明:所制备Al2O3钝化薄膜相结构为γ-Al2O3,TiO2为锐钛矿结构,Ru为密排六方结构。钝化处理能够延长燃油循环系统工作时间,管内循环燃油在800℃保温过程中,Al2O3引起系统压降升高,而TiO2对系统的压降略有降低。对比TiO2和未钝化管的结焦形貌,TiO2钝化处理有效降低了表面焦油滴的尺寸和数量,同时在TiO2钝化管未发现丝状碳的产生,无定型碳的数量也有所降低,说明TiO2钝化层有着优异的抗结焦能力。酒精超声清洗后,TiO2和Ru钝化管胶质层完全脱落,说明其胶质层结构较为疏松或胶质层较薄;Al2O3和未钝化管胶质层只存在部分脱落,说明其胶质层和沥青质层结合力较好或有着较厚的胶质层。实验表明,TiO2和Ru钝化层抗结焦性能优于Al2O3钝化层。 展开更多
关键词 原子层沉积(ald) 钝化层 裂解 抗结焦 积碳
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沉积功率和退火工艺对PE-ALD氧化铝薄膜的影响 被引量:3
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作者 刘媛媛 杜纯 +4 位作者 曹坤 陈蓉 徐湘伦 黄静 单斌 《半导体技术》 CAS CSCD 北大核心 2018年第8期610-615,共6页
Al2O3薄膜常用于有机电子器件的稳定化封装。除了薄膜的水气渗透率特性,薄膜的表面粗糙度、润湿性和折射率等性能也会影响薄膜的最终封装效果。采用自制等离子增强原子层沉积(PE-ALD)系统在低温下成功制备了Al2O3薄膜,研究了沉积功率... Al2O3薄膜常用于有机电子器件的稳定化封装。除了薄膜的水气渗透率特性,薄膜的表面粗糙度、润湿性和折射率等性能也会影响薄膜的最终封装效果。采用自制等离子增强原子层沉积(PE-ALD)系统在低温下成功制备了Al2O3薄膜,研究了沉积功率和退火参数对Al2O3薄膜微观形貌和性能的影响。结果表明,Al2O3薄膜的生长速率和折射率随沉积功率的增加分别呈现先增加后下降和不断增加的趋势,当沉积功率为1 800 W时,薄膜的线性生长速率达到0.27 nm/cycle,远高于传统热原子层沉积技术的沉积速率。退火处理不会改变Al2O3薄膜晶态,但改善了薄膜的表面粗糙度,降低了接触角和有机基团红外强度。得到了最佳的PE-ALD薄膜制备工艺条件,实现了对有机发光二极管器件的有效封装。 展开更多
关键词 等离子增强原子层沉积(PE-ald) AL2O3薄膜 沉积功率 退火工艺 有机发光二极管(OLED)
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ALD法制备二维二硫化钼薄膜的研究现状及展望 被引量:3
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作者 常晓萌 李佳保 +1 位作者 周启航 杨培志 《云南师范大学学报(自然科学版)》 2022年第2期1-8,共8页
二硫化钼(MoS_(2))是一种典型的过渡金属硫属化合物,其二维结构表现出优异的光学性能、热电性能及光电性能,在光电器件领域具有广阔的应用前景.MoS_(2)薄膜的带隙可通过原子层数进行调控,随层数减少其带隙呈逐渐增大趋势,当层数减至一层... 二硫化钼(MoS_(2))是一种典型的过渡金属硫属化合物,其二维结构表现出优异的光学性能、热电性能及光电性能,在光电器件领域具有广阔的应用前景.MoS_(2)薄膜的带隙可通过原子层数进行调控,随层数减少其带隙呈逐渐增大趋势,当层数减至一层,将由间接带隙转为直接带隙.因此,制备层数可控的MoS_(2)薄膜是其应用的基础.原子层沉积(ALD)是可控制备MoS_(2)薄膜的重要方法之一,可实现在较低温度下制备均匀的薄膜,而前驱体种类、反应温度、衬底预处理和退火工艺参数等对薄膜质量均有影响.在总结二硫化钼结构及特性的基础上,综述了ALD法制备少层二硫化钼薄膜的进展,并着重探讨了影响薄膜质量的关键因素,最后对其未来发展趋势进行了展望. 展开更多
关键词 二维材料 二硫化钼 原子层沉积
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Electrodeposition of Gold to Conformally Fill High-Aspect-Ratio Nanometric Silicon Grating Trenches: A Comparison of Pulsed and Direct Current Protocols 被引量:2
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作者 Sami Znati Nicholas Chedid +3 位作者 Houxun Miao Lei Chen Eric E. Bennett Han Wen 《Journal of Surface Engineered Materials and Advanced Technology》 2015年第4期207-213,共7页
Filling high-aspect-ratio trenches with gold is a frequent requirement in the fabrication of X-ray optics as well as micro-electronic components and other fabrication processes. Conformal electrodeposition of gold in ... Filling high-aspect-ratio trenches with gold is a frequent requirement in the fabrication of X-ray optics as well as micro-electronic components and other fabrication processes. Conformal electrodeposition of gold in sub-micron-width silicon trenches with an aspect ratio greater than 35 over a grating area of several square centimeters is challenging and has not been described in the literature previously. A comparison of pulsed plating and constant current plating led to a gold electroplating protocol that reliably filled trenches for such structures. 展开更多
关键词 PULSED ELECTROPLATING Gold ELECTROPLATING High Aspect Ratio TRENCHES Gold Electrodepostion Di-rect Current Electrodeposition PULSED vs. Direct Current ELECTROPLATING atomic layer deposition Platinum Seed layer Silicon TRENCH Gratings TRENCH FILLING Grating FILLING ald Adhesive layer
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热ALD和等离子增强ALD沉积HfO2薄膜的比较(英文) 被引量:2
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作者 乌李瑛 柏荣旭 +4 位作者 瞿敏妮 田苗 沈赟靓 王英 程秀兰 《半导体技术》 CAS 北大核心 2019年第10期795-802,共8页
以四(甲乙胺)铪(TEMAHf)作为前驱体,采用热原子层沉积(TALD)技术和等离子体增强原子层沉积(PEALD)技术分别在硅衬底上沉积二氧化铪(HfO2)薄膜。分别研究了水和臭氧作为共反应物对TALD HfO2薄膜性能的影响及采用电容耦合等离子体(CCP)PEA... 以四(甲乙胺)铪(TEMAHf)作为前驱体,采用热原子层沉积(TALD)技术和等离子体增强原子层沉积(PEALD)技术分别在硅衬底上沉积二氧化铪(HfO2)薄膜。分别研究了水和臭氧作为共反应物对TALD HfO2薄膜性能的影响及采用电容耦合等离子体(CCP)PEALD HfO2薄膜的最佳工艺条件。通过X射线衍射(XRD)、扫描电子显微镜(SEM)和光电子能谱(XPS)对不同工艺制备的HfO2薄膜的微观结构、表面形貌进行了表征。结果表明,反应温度为300℃时,TALD 50 nm厚的HfO2薄膜为单斜相晶体;PEALD在较低反应温度(150℃)下充分反应,所沉积的50 nm厚的HfO2薄膜杂质含量较低,薄膜未形成结晶态;PEALD工艺得到的HfO2薄膜的界面层最厚,主要为硅的亚氧化物或铪硅酸盐。电流-电压(I-V)和电容-电压(C-V)测试结果表明,以水作为氧源且反应温度300℃的TALD工艺所得到的HfO2薄膜,其金属-绝缘体-半导体(MIS)器件的漏电流及电滞回线最小。 展开更多
关键词 二氧化铪(HfO2) 原子层沉积(ald) 热原子层沉积(Tald) 等离子增强原子层沉积(PEald) 介电常数
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基于ALD技术的高性能光电探测器研究进展 被引量:1
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作者 胡鲲 翟爱平 +4 位作者 冯琳 石林林 冀婷 李国辉 崔艳霞 《半导体技术》 CAS 北大核心 2021年第12期909-920,共12页
采用原子层沉积(ALD)技术制备的薄膜具有致密性高、保形性高、平滑性好、缺陷密度低、厚度可精准调控等优势,被广泛应用于各类光电器件中。利用ALD技术制备的功能薄膜可以明显改善光电探测器的暗电流、探测率和线性动态范围等性能。以基... 采用原子层沉积(ALD)技术制备的薄膜具有致密性高、保形性高、平滑性好、缺陷密度低、厚度可精准调控等优势,被广泛应用于各类光电器件中。利用ALD技术制备的功能薄膜可以明显改善光电探测器的暗电流、探测率和线性动态范围等性能。以基于ALD技术的高性能光电探测器为主题,首先详细介绍了热ALD生长薄膜的基本原理,同时简要介绍了等离子体增强ALD技术生长薄膜的基本原理。然后依据光电探测器中薄膜的功能不同,依次总结了基于ALD技术制作的活性层、钝化层、界面层、电荷传输层等实现高性能光电探测器的研究进展。最后对ALD技术在光电探测器领域的发展趋势和挑战进行了展望。 展开更多
关键词 原子层沉积(ald)技术 光电探测器 活性层 钝化层 界面层
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热型ALD技术制备镍薄膜及其金属硅化物
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作者 乌李瑛 瞿敏妮 +2 位作者 沈贇靓 王英 程秀兰 《微纳电子技术》 北大核心 2019年第6期486-492,共7页
金属硅化物材料具有较低的接触电阻,并且与硅材料有较好的兼容性,所以在互补金属氧化物半导体(CMOS)器件中被看作是重要的电极材料。形成镍金属硅化物的关键是镍金属单质的淀积工艺。如何在大深宽比纳米尺度的三维结构中沉积保形性好、... 金属硅化物材料具有较低的接触电阻,并且与硅材料有较好的兼容性,所以在互补金属氧化物半导体(CMOS)器件中被看作是重要的电极材料。形成镍金属硅化物的关键是镍金属单质的淀积工艺。如何在大深宽比纳米尺度的三维结构中沉积保形性好、纯度高、导电性好的镍金属单质薄膜是亟需解决的问题。利用热法原子层沉积(ALD)技术,以一种新型脒基镍前驱体[Ni(iPr-MeAMD)]_2,在深宽比为10:1的硅基底沟槽中沉积得到纯度高、保形性好、连续平滑的镍薄膜。对薄膜进行了X射线衍射(XRD)测试,为单一的α六方晶体结构。考察了不同退火温度下镍金属硅化物的形成,利用扫描电子显微镜(SEM)、能量色散谱(EDS)和XRD进行了物相相变的分析。退火温度400℃下得到NiSi相,其薄膜电阻率最低,约为34μΩ·cm。 展开更多
关键词 镍(Ni)薄膜 原子层沉积(ald) 沉积速率 金属硅化物 互补金属氧化物半导体(CMOS)
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On the evaluation of ALD TiO_(2),ZrO_(2) and HfO_(2) coatings on corrosion and cytotoxicity performances
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作者 Mirco Peron Susanna Cogo +5 位作者 Maria Bjelland Abdulla Bin Afif Anup Dadlani Elisa Greggio Filippo Berto Jan Torgersen 《Journal of Magnesium and Alloys》 SCIE EI CAS CSCD 2021年第5期1828-1841,共14页
Magnesium alloys have been widely studied as materials for temporary implants,but their use has been limited by their corrosion rate.Recently,coatings have been proven to provide an effective barrier.Though only littl... Magnesium alloys have been widely studied as materials for temporary implants,but their use has been limited by their corrosion rate.Recently,coatings have been proven to provide an effective barrier.Though only little explored in the field,Atomic Layer Deposition(ALD)stands out as a coating technology due to the outstanding film conformality and density achievable.Here,we provide first insights into the corrosion behavior and the induced biological response of 100 nm thick ALD TiO_(2),HfO_(2)and ZrO_(2)coatings on AZ31 alloy by means of potentiodynamic polarization curves,electrochemical impedance spectroscopy(EIS),hydrogen evolution and MTS colorimetric assay with L929 cells.All three coatings improve the corrosion behavior and cytotoxicity of the alloy.Particularly,HfO_(2)coatings were characterized by the highest corrosion resistance and cell viability,slightly higher than those of ZrO_(2)coatings.TiO_(2)was characterized by the lowest corrosion improvements and,though generally considered a biocompatible coating,was found to not meet the demands for cellular applications(it was characterized by grade 3 cytotoxicity after 5 days of culture).These results reveal a strong link between biocompatibility and corrosion resistance and entail the need of taking the latter into consideration in the choice of a biocompatible coating to protect degradable Mg-based alloys. 展开更多
关键词 atomic layer deposition(ald) COATINGS Corrosion resistance CYTOCOMPATIBILITY Magnesium
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高k材料镧前驱体La(tmhd)_(3)和La(tmod)_(3)的热力学及其ALD应用
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作者 周洪 丁玉强 《微纳电子技术》 CAS 北大核心 2023年第7期1047-1057,共11页
通过同步热分析研究两种不同的前驱体(La(tmhd)_(3)和La(tmod)_(3))在升华过程中的热稳定性。结果表明,具有不对称分子结构的La(tmod)_(3)的挥发性大于La(tmhd)_(3),其可以作为镧前驱体应用于原子层沉积(ALD)技术。将La(tmod)_(3)和O_(3... 通过同步热分析研究两种不同的前驱体(La(tmhd)_(3)和La(tmod)_(3))在升华过程中的热稳定性。结果表明,具有不对称分子结构的La(tmod)_(3)的挥发性大于La(tmhd)_(3),其可以作为镧前驱体应用于原子层沉积(ALD)技术。将La(tmod)_(3)和O_(3)作为前驱体,通过ALD技术在SiO_(2)基片上实现了LaOx薄膜的制备。实验结果表明,其最佳的ALD工艺参数包括:La(tmod)_(3)和O_(3)的脉冲时间分别为6 s和2 s,O_(3)的清洗时间为5 s,沉积温度为250℃。在制备的薄膜中发现了理想的自限性沉积行为。通过X射线光电子能谱仪(XPS)、扫描电子显微镜(SEM)和原子力显微镜(AFM)证实了生长的薄膜具有良好的纯度和表面形貌,其在250℃的沉积温度下具有稳定的生长速率(约0.16A/cycle,1A=0.1 nm),薄膜的主要成分为La2O_(3)。 展开更多
关键词 LAOX La(tmhd)_(3) 原子层沉积(ald) La(tmod)_(3) 热分析 O_(3)
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原子层沉积法制备鸡蛋清栅介质ZnO-TFT及其性能研究
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作者 王聪 黄荷 +1 位作者 刘玉荣 彭强 《电子器件》 CAS 2024年第3期865-869,共5页
采用原子层沉积法(ALD),以天然鸡蛋清作为栅介质制备双电层氧化锌薄膜晶体管(ZnO-TFT),并对其电性能进行测试与分析,研究了该器件在栅偏压应力条件下和空气环境下电学性能的稳定性。结果表明,氧化锌薄膜晶体管电特性表现良好,阈值电压为... 采用原子层沉积法(ALD),以天然鸡蛋清作为栅介质制备双电层氧化锌薄膜晶体管(ZnO-TFT),并对其电性能进行测试与分析,研究了该器件在栅偏压应力条件下和空气环境下电学性能的稳定性。结果表明,氧化锌薄膜晶体管电特性表现良好,阈值电压为0.73 V,载流子饱和迁移率为9.95 cm^(2)/(V·s),开关电流比为1.8×10^(4),亚阈值摆幅为0.33 V/decade,工作电压可低至3.0 V。研究还发现,在正栅偏压应力作用下或在空气环境下器件的电性能皆呈现出不稳定性。栅偏压应力不稳定性主要与栅介质层界面处正电荷集聚及新缺陷态的产生有关;干燥空气环境下电性能的退化可解释为沟道有源层吸附空气中的氧气导致沟道层中载流子有所消耗,以及鸡蛋清电解质被氧化而引起双电层效应的退化。 展开更多
关键词 氧化锌薄膜晶体管 偏压应力 稳定性 双电层 原子层沉积
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High densities of magnetic nanoparticles supported on graphene fabricated by atomic layer deposition and their use as efficient synergistic microwave absorbers 被引量:37
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作者 Guizhen wang Zhe Gao +3 位作者 Gengping Wan Shiwei Lin Peng Yang Yong Qin 《Nano Research》 SCIE EI CAS CSCD 2014年第5期704-716,共13页
An atomic layer deposition (ALD) method has been employed to synthesize Fe3O4/graphene and Ni/graphene composites. The structure and microwave absorbing properties of the as-prepared composites are investigated. The... An atomic layer deposition (ALD) method has been employed to synthesize Fe3O4/graphene and Ni/graphene composites. The structure and microwave absorbing properties of the as-prepared composites are investigated. The surfaces of graphene are densely covered by Fe3O4 or Ni nanoparticles with a narrow size distribution, and the magnetic nanoparticles are well distributed on each graphene sheet without significant conglomeration or large vacancies. The coated graphene materials exhibit remarkably improved electromagnetic (EM) absorption properties compared to the pristine graphene. The optimal reflection loss (RL) reaches -46.4 dB at 15.6 GHz with a thickness of only 1.4 mm for the Fe3O4/graphene composites obtained by applying 100 cycles of Fe2O3 deposition followed by a hydrogen reduction. The enhanced absorption ability arises from the effective impedance matching, multiple interfacial polarization and increased magnetic loss from the added magnetic constituents. Moreover, compared with other recently reported materials, the composites have a lower filling ratio and smaller coating thickness resulting in significantly increased EM absorption properties. This demonstrates that nanoscale surface modification of magnetic particles on graphene by ALD is a very promising way to design lightweight and high-efficiency microwave absorbers. 展开更多
关键词 atomic layer depositionald GRAPHENE magnetic nanoparticles microwave absorption
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Coaxial multi-interface hollow Ni-AI203-ZnO nanowires tailored by atomic layer deposition for selective- frequency absorptions 被引量:13
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作者 Lili Yan Jia Liu +6 位作者 Shichao Zhao Bin Zhang Zhe Gao Huibin Ge Yao Chen Maosheng Cao Yong Qin 《Nano Research》 SCIE EI CAS CSCD 2017年第5期1595-1607,共13页
In this work, atomic layer deposition (ALD) was employed to fabricate coaxial multi-interface hollow Ni-A12OB-ZnO nanowires. The morpholog34 microstructure, and ZnO shell thickness dependent electromagnetic and micr... In this work, atomic layer deposition (ALD) was employed to fabricate coaxial multi-interface hollow Ni-A12OB-ZnO nanowires. The morpholog34 microstructure, and ZnO shell thickness dependent electromagnetic and microwave absorbing properties of these Ni-A12OB-ZnO nanowires were characterized. Excellent microwave absorbing properties with a minimum reflection loss (RL) of approximately -50 dB at 9.44 GHz were found for the Ni-A12OB-100ZnO nanowires, which was 10 times of Ni-A1203 nanowires. The microwave absorption frequency could be effectively varied by simply adjusting the number of ZnO deposition cycles. The absorption peaks of Ni-A1203-100ZnO and Ni-A12OB-150ZnO nanowires shifted of 5.5 and 6.8 GHz towards lower frequencies, respectively, occupying one third of the investigated frequency band. The enhanced microwave absorption arose from multiple loss mechanisms caused by the unique coaxial multi-interface structure, such as multi-interfacial polarization relaxation, natural and exchange resonances, as well as multiple internal reflections and scattering. These results demonstrate that the ALD method can be used to realize tailored nanoscale structures, making it a highly promising method for obtaining high- efficiency microwave absorbers, and opening a potentially novel route for frecluencv adiustment and microwave ima^in~ fields. 展开更多
关键词 atomic layer depositionald Ni-A1203-ZnO nanowires selective frequencyabsorption
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