Simulation Investigation on Particle Transmission Characteristics of Two Different Ion Barrier Films

The simulation calculation and analysis of electron transmittance and ion stopping power for ion barrier films (IBFs) of Al2O3 and SiO2 are performed by Monte Carlo methods. The interaction model between particles and solids are described. It is found that at the same conditions,the electron transmittance for SiO2 IBF is relatively higher than that of Al2O3 IBF,and the ion stopping power of SiO2 IBF is relatively lower than that of Al2O3 by Monte Carlo simulations. It is also indicated that SiO2 is one of the ideal materials for fabricating IBFs.

Preparation and Characterization of Maltose-Pendant Polymer/Mica Nanocomposites and Their Application to Oxygen Gas Barrier Films

Maltose-pendant polymer/mica nanocomposites were prepared by a solution intercalation method. For organic composite part, 1) maltose-pendant polymer (homopolymer) and 2) the copolymer of maltose-pendant monomer and a small amount of N,N-Dimethylamino propylacrylamide, methyl chloride quartenary were used. The morphological studies (XRD and FE-SEM) revealed that the hybrid of maltose-pendant polymer was a conventional phase separated composite. On the other hand, the hybrid using the copolymer exhibited exfoliated structure. Both the conventional composite of maltose-pendant polymer and the nanocomposite of copolymer were applied to a coating material for oxygen gas barrier layer on a nylon-6 film, and oxygen transmission rates of the films were evaluated. Maltose-pendant polymer had a good oxygen barrier property under dry condition, and the barrier property under wet condition was improved by the hybridization with mica. In contrast, the barrier property of copolymer was slightly inferior to that of maltosependant polymer. However, under dry condition, it can be seen that the nanocomposite of copolymer improves the barrier property more effectively than the case of conventional composite of maltose-pendant polymer.

Deposition of SiOx barrier films by O2/TMDSO RF-PECVD

This paper reports that the SiOx barrier films are deposited on polyethylene terephthalate substrate by plasmaenhanced chemical vapour deposition （PECVD） for the application of transparent barrier packaging. The variations of 02/Tetramethyldisiloxane （TMDSO） ratio and input power in radio frequency （RF） plasma are carried out to optimize barrier properties of the SiOx coated film. The properties of the coatings are characterized by Fourier transform infrared, water vapour transmission rate （WVTR）, oxygen transmission rate （OTR）, and atomic force microscopy analysers. It is found that the 02/TMDSO ratio exceeding 2：1 and the input power over 200 W yield SiOx films with low carbon contents which can be good to the barrier （WVTR and OTR） properties of the SiOx coatings. Also, the film properties not only depend on oxygen concentration of the inlet gas mixtures and input power, but also relate to the surface morphology of the coating.

High-Pressure Plasma Deposition of a-C:H Films by Dielectric-Barrier Discharge

The fabrication of a-C:H films from methane has been performed using dielectric-barrier discharges at atmospheric pressure. The effect of combined-feed gas, such as carbon dioxide, carbon monoxide or acetylene on the formation of a-C:H films has been investigated. It has been demonstrated that the addition of carbon monoxide or acetylene into methane leads to a remarkable improvement in the fabrication of a-C:H films. The characterization of carbon film obtained has been conducted using FT-IR, Raman and SEM.

Preparation and Gas Barrier Characteristics of Polysilazane-Derived Silica Thin Films Using Ultraviolet Irradiation

The gas barrier film formation technique using simultaneous photo-irradiation and heat-treatment has been researched on alicyclic polyimide film coated with a polysilazane solution. A fine SiO2 thin film on polyimide film was formed at low temperatures, which greatly improved the substrate’s gas barrier characteristics by this technique. The values of gas barrier characteristics depended on the substrate temperature at the time of photo-irradiation. For photo-irradiated thin film heat-treated to 150°C, the water vapor transmission rate and oxygen transmission rate fell below the equipment measurement limit of 0.02 g/m2/day and 0.02 cm3/m2/day, respectively. This polyimide film with a gas-barrier film coating has good transmittance in the region of visible light, heat resistance, and flexibility.

Growth of Fluorocarbon Films by Low-Pressure Dielectric Barrier Discharge

Plasma polymerized fluorocarbon （FC） films have been deposited on silicon substrates from dielectric barrier discharge （DBD） plasma of C4Fs at room temperature under a pressure of 25～125 Pa. The effects of the discharge pressure and frequency of power supply on the films have been systematically investigated. FC films with a less cross linked structure may be formed at a relatively high pressure. Increase in the frequency of power supply leads to a significant increase in the deposition rate. Static contact angle measurements show that deposited FC films have a stable, hydrophobic surface property. All deposited films show smooth surfaces with an atomic surface roughness. The relationship between plasma parameters and the properties of the deposited FC films are discussed.

The Effect of Diffusion Barrier and Bombardment on Adhesive Strength of CuCr Alloy Films

A novel co-sputtering method that combined magnetron sputtering (MS) with ion beam sputtering (IBS) was used to fabricate CuCr alloy films without breaking vacuum after depositing diffusion barrier with IBS. Different bombardment energies were used to improve the comprehensive properties of Cu alloy film. The results indicated that the effects of diffusion barriers and bombardment energy on adhesive strength could be evaluated by a rolling contact fatigue adhesion test. Diffusion barrier can enhance the adhesive strength, and the adhesion of CuCr/CrN was higher than that of CuCr/TiN. When bombarding energy was higher, the adhesive strength of CuCr/TiN films was higher due to the broader transition zone.

Deposition of Thin Titania Films by Dielectric Barrier Discharge at Atmospheric Pressure

A homogeneous atmospheric pressure dielectric barrier discharge is studied. It is in argon with small admixtures of titanium tetrachloride vapour and oxygen for the deposition of thin titania films on glass substrates. A special electrode configuration was applied in order to deposit the titania film uniformly. The sustaining voltage （6 kV to 12 kV）, current density （about 3 mA/cm^2） and total optical emission spectroscopy were monitored to characterize the discharge in the gap of 2 mm. Typical deposition rates ranged from approximately 30 nm/min to 120 nm/min. The film morphology was investigated by using scanning electron microscopy （SEM） and the composition was determined with an energy dispersive x-ray spectroscopy （EDS） analysis tool attached to the SEM. The crystal structure and phase composition of the films were studied by x-ray diffraction （XRD）. Several parameters such as the discharge power, the ratio of carrier gas to the precursor gas, the deposition time on the crystallization behavior, the deposition rate and the surface morphology of the titania film were extensively studied.

Study on Al_xNi_y Alloys as Diffusion Barriers in Flexible Thin Film Solar Cells

Co-sputtered AlxNiy thin films were used as diffusion barriers between aluminum and hydrogenated microcrystalline silicon （μc-Si：H） for flexible thin film solar cells. The stoichiometric ratio of AlxNiy showed a significant effect on the structures of the films. The obtained Al3Ni2 film was amorphous, while polycrystalline films were obtained when the ratio of aluminum to nickel was 1：1 and 2：3. An auger electron spectroscope and four-point probe system were applied to test the resistance to the interdiffusion between aluminum and silicon, as well as the conductivities of the AlxNiy barriers. The data of auger depth profile showed that the content of silicon was the minimum in the aluminum layer after sputtering for 4 min using AlNi thin film as the barrier layer. Compared to other AlxNiy alloys, the AlNi thin film possessed the lowest sheet resistance.

Plasma-Assisted Chemical Vapor Deposition of Titanium Oxide Films by Dielectric Barrier Discharge in TiCl_4/O_2/N_2 Gas Mixtures

Low-pressure dielectric barrier discharge（DBD） TiCl4/O2and N2 plasmas have been used to deposit titanium oxide films at different power supply driving frequencies. A homemade large area low pressure DBD reactor was applied, characterized by the simplicity of the experimental set-up and a low consumption of feed gas and electric power, as well as being easy to operate. Atomic force microscopy, scanning electron microscopy, energy dispersive spectroscopy,and contact angle measurements have been used to characterize the deposited films. Experimental results show all deposited films are uniform and hydrophilic with a contact angle of about 15 o.Compared to titanium oxide films deposited in TiCl4/O2gas mixtures, those in TiCl4/O2/N2gas mixtures are much more stable. The contact angle of titanium oxide films in TiCl4/O2/N2gas mixtures with the addition of 50% N2 and 20% TiCl4 is still smaller than 20 o, while that of undoped titanium oxide films is larger than 64 owhen they are measured after one week. The low-pressure TiCl4/O2plasmas consist of pulsed glow-like discharges with peak widths of several microseconds, which leads to the uniform deposition of titanium oxide films. Increasing a film thickness over several hundreds of nm leads to the film’s fragmentation due to the over-high film stress. Optical emission spectra（OES） of TiCl4/O2DBD plasmas at various power supply driving frequencies are presented.

Effect of sterilization on barrier property of BOPET used in film-laminated steel

High-temperature sterilization is applied when film-laminated steel is used as food-can packaging material. To study the effect of this sterilization on the barrier property of biaxially oriented polyester （BOPET） film,the water vapor transmission, thermal properties, and microstructure of BOPET that had undergone different sterilization time were analyzed. Results show that water vapor transmission is decreased by sterilization, and that with increased sterilization treatment time,the melting point and melting enthalpy of BOPET increases. Moreover, the microstructure of BOPET film also can be improved by sterilization ,in which the quantity of crystal nuclei and the crystallization density increase to form a network-like structure, which is beneficial to the barrier property of BOPET film.

Formation and Gas Barrier Characteristics of Polysilazane-Derived Silica Coatings Formed by Excimer Light Irradiation on PET Films with Vacuum Evaporated Silica Coatings

The effects of excimer light irradiation on polysilazane coatings formed on PET films with vacuum-evaporated SiO2 coatings and the effects of these coatings on gas barrier characteristics have been investigated. The temperature during light irradiation has a large effect on the coating’s molecular structure and gas barrier characteristics. When irradiation was performed at 100℃, the polysilazane coating transformed into a silica coating, and a compact silica coating at a much lower temperature than with heat treatment alone was produced. Surface irregularities in the vapor-deposited silica coating were smoothed out by the formation of a polysilazane coating, which was transformed into a compact silica coating when irradiated with light, resulting in a significant improvement in the gas barrier characteristics. The water vapor permeability of the thin coating irradiated with excimer light at 100℃ showed only 0.04 g/m2•day (40℃, 90% RH). According to the results of investigation of temperature variation of water-vapor permeability, it is inferred that the developed film has an excellent gas barrier value, namely, 4.90 × 10–4 g/m2•day at 25℃. This gas barrier coated PET film is transparent and flexible, and can be used in the fabrication of flexible electronics. Also, the proposed fabrication method effectively provides a simple low-cost and low-temperature fabrication technique without the need for high vacuum facility.

Diffusion barrier performance of nanoscale TaN_x thin-film

TaNx nanoscale thin-films and Cu/TaNx multilayer structures were deposited on P-type Si(100) substrates by DC reactive magnetron sputtering. The characteristics of TaNx films and thermal stabilities of Cu/TaNx/Si systems annealed at various temperatures were studied by four-point probe(FPP) sheet resistance measurement, atomic force microscopy(AFM), scanning electron microscope-energy dispersive spectrum (SEM-EDS), Alpha-Step IQ Profilers and X-ray diffraction(XRD), respectively. The results show that the surfaces of deposited TaNx thin-films are smooth. With the increasing of N2 partial pressure, the deposition rate and root-mean-square(RMS) decrease, while the content of N and sheet resistance of the TaNx thin-films increase, and the diffusion barrier properties of TaNx thin-films is improved. TaN1.09 can prevent interdiffusion between Cu and Si effectively after annealing up to 650 ℃ for 60 s. The failure of TaNx is mainly attributed to the formation of Cu3Si on TaN/Si interface, which results from Cu diffusion along the grain boundaries of polycrystalline TaN.

Preparation of Diamond-like Carbon Film Assisted in the Plasma of Dielectric Barrier Discharge at Atmospheric Pressure

Dielectric barrier discharge at atmospheric presure has been applied to prepare hydrocarbon films on large- area glass and silicon substrates. When hydrogen and methane mixture(2:1) is used as discharge gas and the substrate is heated to 300 C, hard hydrogenated amorphous carbon film is deposited. From the IR deconvolution analysis of the C-H stretching absorption for the coating, the hydrocarbon group ration (CH3:CH2:CH) and C-C bond type ratio (sp3c/sp2c) are about 10%: 21%: 69% and 3:1~6:1,respectively. Their Knoop hardness is up to 10Gpa. No film isdeposited when the content of methane in the mixed gases is decreased to 5% at 300 C silicon substrate.

聚乳酸/壳聚糖/肉桂醛单向阻湿双层膜的制备及其在秀珍菇保鲜中的应用

为改善秀珍菇富含营养和水分,采后极易失水萎蔫降低商品价值,而膜包装易导致内部环境湿度大造成腐烂的问题,本研究以聚乳酸(polylactic acid,PLA)和壳聚糖(chitosan,CS)为成膜基质,制备含有0.25%肉桂醛纳米乳(cinnamaldehyde nano-emulsion,CANE)的单向阻湿双层膜(0.25%CANE-PLA-CS),探讨该膜的微观结构、物理性能、光学性能、机械性能、水蒸气的阻隔性能和缓释性能,最终将其应用在秀珍菇贮藏保鲜中。结果表明:PLA和CS两者间的复合可有效弥补单体膜的缺陷,0.25%CANE-PLA-CS双层膜层与层之间结合紧密,对CA的保留率是42%,抗紫外线能力强,水滴沉降速度最小且P层有较好的水蒸气阻隔性,C层具有较好的亲水性。秀珍菇保鲜实验发现,与PE膜包装相比,0.25%CANE-PLA-CS双层膜对秀珍菇采后的褐变有明显的抑制作用;有效抑制秀珍菇贮藏期间的呼吸强度,延缓秀珍菇质量损失率、可溶性固形物、褐变度、电导率以及丙二醛含量的上升;降低秀珍菇贮藏期间的多酚氧化酶和过氧化物酶活性,维持了秀珍菇较高的超氧化物歧化酶活性。这些结果表明该单向阻湿双层膜能够有效延缓秀珍菇褐变、衰老和维持其商品价值,为制备菇类新型保鲜材料提供理论支撑,对降低秀珍菇采后损失具有较好的指导价值。

基于包装油/盐的玉米醇溶蛋白膜中甘油迁移规律及变化机制

为探究包装高脂肪类食品和高盐粉类食品时玉米醇溶蛋白膜中甘油迁移规律及储藏中膜内部的变化机制,选择甘油添加量0.2 g/g、柠檬酸添加量0.2 g/g复合增塑制备的甘油/柠檬酸膜(CG膜)和甘油添加量0.15 g/g、聚乙二醇添加量0.2 g/g复合增塑制备的甘油/聚乙二醇膜(PG膜)包装油和盐并进行储藏。研究表明:在储藏过程中,CG膜中甘油迁移量高于PG膜;同一储藏温度,膜中甘油向盐中的迁移量高于向油中的迁移量;25℃储藏的膜中甘油向油中的迁移量高于5℃储藏,向盐中迁移时则相反;随储藏时间的延长,膜中水分含量逐渐降低;膜中氢键作用力逐渐减弱且与甘油迁移量呈负相关;膜中游离巯基含量逐渐降低,游离巯基含量受温度影响且与甘油迁移量呈负相关。CG膜更适合包装高脂肪类食品,PG膜更适合包装高盐粉状物。

LDPE/m-nZVI复合膜的制备及性能

为克服脱氧剂小袋包装与食品混装带来的安全问题,采用硼氢化钾(KBH4)液相还原法制备了油酸钠(NaOl)改性纳米零价铁(m-nZVI),将其与低密度聚乙烯(LDPE)熔融共混后热压成膜,制备了包装用LDPE/m-nZVI阻氧复合膜。利用傅里叶变换红外光谱仪、热重分析仪、差示扫描量热仪、万能拉伸试验机和气体渗透仪对复合膜的结构与性能进行表征和测定。结果表明:m-nZVI和LDPE的复合是物理共混;加入m-nZVI后,LDPE的热稳定性基本不变;随着m-nZVI含量的增加,复合膜的抗拉强度和断后伸长率先增大后减小,m-nZVI质量分数为2%时,抗拉强度和断后伸长率达到最大,较LDPE膜分别提高了41.4%和23.4%;复合膜的氧气透过系数也呈现出先减小后增大,当m-nZVI质量分数为3%时,复合膜的氧气透过系数最小,较LDPE膜降低了40.9%。复合膜结晶过程中,m-nZVI起异相成核的作用,改善了复合膜的结晶行为,使复合膜的结构和性能得到改善,力学性能和阻隔性能都得到提高。

用于柔性电子器件的有机/无机薄膜封装技术研究进展

有机/无机薄膜封装技术被广泛用于有机发光二极管(OLED)、量子点显示及有机光伏等领域,是一种新型的柔性封装技术。综述近年来有机/无机薄膜封装技术的发展趋势,首先概述了传统硬质盖板封装方式与薄膜封装方式的发展及其优缺点。其次,系统地总结了有机/无机薄膜的制备方法,如原子层沉积、等离子体化学气相沉积等,详细阐述了不同制备方法的原理及其应用。再次,讨论了薄膜的微观缺陷、内应力,以及材料界面工程对有机/无机薄膜封装性能的影响,分析总结了有机/无机封装薄膜制备的技术要点,如采用基底表面预处理、引入中性层、调节层间应力等方式获得优质的封装薄膜。最后,探究了有机/无机封装薄膜的内在阻隔机理,提出气体在有机/无机薄膜中的传输方式以努森扩散为主,并总结了提高薄膜封装的策略,即延长气体扩散路径、“主动”引入阻隔基团及薄膜表面改性。提出了未来薄膜封装技术面临的问题,拟为柔性电子器件封装技术的发展提供一定参考。

柑橘皮/壳聚糖复合膜制备及性能研究

柑橘废弃物处理困难是限制柑橘加工业发展的重要因素。为了将柑橘果皮加工成生物基复合薄膜,并研究其结构和性能,先以脐橙皮、壳聚糖和甘油为原料,最大拉伸强度和断裂伸长率为响应值,通过响应面中心组合试验,制备力学性能较佳的脐橙皮/壳聚糖复合膜。再以优化后的配方制备马家柚皮复合膜、南丰蜜桔皮复合膜和纯壳聚糖膜,通过扫描电子显微镜和傅里叶变换红外光谱对壳聚糖膜和3种柑橘皮复合膜进行表征,并测定了薄膜的水蒸气渗透性、光阻隔性和抗氧化能力。响应面优化结果为壳聚糖含量1.10%,脐橙皮含量4.10%,甘油含量0.90%(均为质量分数)。优化后脐橙皮复合膜拉伸强度为(15.76±0.66)MPa,断裂伸长率为(19.23±1.52)%。表征结果显示柑橘皮均匀分散在薄膜结构中,与壳聚糖具有良好的混溶性,两者可能通过氢键进行结合。此外,柑橘皮复合膜在紫外光区和可见光区的光透射率均低于10%,在食品模拟物(体积分数为10%的乙醇溶液和95%乙醇溶液)中能够释放抗氧化物质。综上所述,柑橘皮与壳聚糖能够加工成具有一定力学性能、良好光阻隔性和抗氧化活性的生物基薄膜,为脐橙、南丰蜜桔和马家柚果皮资源化利用提供参考。

壳聚糖/聚乙烯醇/明胶复合薄膜的阻隔和阻燃性能研究

采用溶液流延法,将不同比例的壳聚糖(CS)、聚乙烯醇(PVA)、明胶(GEL)溶液混合均匀后,倾倒在有机玻璃板上流延成膜,制备不同系列CS/PVA/GEL复合薄膜,并通过红外分析、紫外分析和表面接触角测定等手段对其进行表征,同时,对CS/PVA/GEL复合薄膜的热稳定性能、燃烧特性、透氧性能、保鲜、力学等性能进行了测试。结果表明:当CS、PVA、GEL按照10/3/7质量比共混时,制得的共混膜综合性能最好。