Asymptotic homogenization (AH) is a general method for predicting the effective coefficient of thermal expansion (CTE) of periodic composites. It has a rigorous mathematical foundation and can give an accurate solutio...Asymptotic homogenization (AH) is a general method for predicting the effective coefficient of thermal expansion (CTE) of periodic composites. It has a rigorous mathematical foundation and can give an accurate solution if the macrostructure is large enough to comprise an infinite number of unit cells. In this paper, a novel implementation algorithm of asymptotic homogenization (NIAH) is developed to calculate the effective CTE of periodic composite materials. Compared with the previous implementation of AH, there are two obvious advantages. One is its implementation as simple as representative volume element (RVE). The new algorithm can be executed easily using commercial finite element analysis (FEA) software as a black box. The detailed process of the new implementation of AH has been provided. The other is that NIAH can simultaneously use more than one element type to discretize a unit cell, which can save much computational cost in predicting the CTE of a complex structure. Several examples are carried out to demonstrate the effectiveness of the new implementation. This work is expected to greatly promote the widespread use of AH in predicting the CTE of periodic composite materials.展开更多
With Al2O3, Dy2O3, and SiO2 as starting materials, the basic glass of Al2O3-Dy2O3-SiO2 system was prepared by conventional melting technology, and their thermal expansion coefficients （TECs） at different anneal time...With Al2O3, Dy2O3, and SiO2 as starting materials, the basic glass of Al2O3-Dy2O3-SiO2 system was prepared by conventional melting technology, and their thermal expansion coefficients （TECs） at different anneal time were investigated. TECs of the basic glass, which were heat-treated under different temperature, were also investigated. The result showed that TECs of the basic glass gradually approached a fixed value as the anneal time was extended, which suggested that most of the inner stress had been eliminated. After heat treatment, the contents of Dy2O3, Dy2Si2O7, and a new crystal increased up to 1200 ℃ and decreased below 1250 ℃, which was consistent with the TEC change of crystallized samples. This suggests that the crystal has a direct effect on TECs of the crystallized samples.展开更多
Diamond reinforced copper（Cu/diamond） composites were prepared by pressure infiltration for their application in thermal management where both high thermal conductivity and low coefficient of thermal expansion（CTE...Diamond reinforced copper（Cu/diamond） composites were prepared by pressure infiltration for their application in thermal management where both high thermal conductivity and low coefficient of thermal expansion（CTE） are important.They were characterized by the microstructure and thermal properties as a function of boron content,which is used for matrix-alloying to increase the interfacial bonding between the diamond and copper.The obtained composites show high thermal conductivity（660 W/（m·K）） and low CET（7.4×10-6 K-1） due to the formation of the B13C2 layer at the diamond-copper interface,which greatly strengthens the interfacial bonding.Thermal property measurements indicate that in the Cu-B/diamond composites,the thermal conductivity and the CTE show a different variation trend as a function of boron content,which is attributed to the thickness and distribution of the interfacial carbide layer.The CTE behavior of the present composites can be well described by Kerner＇s model,especially for the composites with 0.5wt% B.展开更多
Cu-coated powder was fabricated by electroless plating process, and the composition and morphology of coated powder were studied. Moreover, Cu-30, 40, 50 vol.%SiCp heat sink materials were fabricated by hot pressing u...Cu-coated powder was fabricated by electroless plating process, and the composition and morphology of coated powder were studied. Moreover, Cu-30, 40, 50 vol.%SiCp heat sink materials were fabricated by hot pressing using coated and uncoated powder. And the microstructure and thermophysical properties of the heat sink materials were also studied. The results show that SiCp particles distribute uniformly in heat sink materials and the interface between SiCp particles and Cu matrix is clear and well bonded. On the condition of same volume fraction of SiCp, the thermal conductivity of the material using coated powder is larger than that of the material using uncoated powder. Under experiment conditions, the thermal conductivity and coefficient of thermal expansion of Cu-30 vol.%SiCp heat sink material is 236.2 W·m-1·K-1 and 9.9×10-6/K (30-200 ℃) respectively. It provides important reference data for future experiments.展开更多
基金supported by the National Natural Science Foundation of China (Grants 11332004, 11572071)the Program for Changjiang Scholars and Innovative Research Team in Dalian University of Technology (PCSIRT)+2 种基金111 Project (Grant B14013)the CATIC Industrial Production Projects (Grant CXY2013DLLG32)the Fundamental Research Funds for the Central Universities (Grant DUT15ZD101)
文摘Asymptotic homogenization (AH) is a general method for predicting the effective coefficient of thermal expansion (CTE) of periodic composites. It has a rigorous mathematical foundation and can give an accurate solution if the macrostructure is large enough to comprise an infinite number of unit cells. In this paper, a novel implementation algorithm of asymptotic homogenization (NIAH) is developed to calculate the effective CTE of periodic composite materials. Compared with the previous implementation of AH, there are two obvious advantages. One is its implementation as simple as representative volume element (RVE). The new algorithm can be executed easily using commercial finite element analysis (FEA) software as a black box. The detailed process of the new implementation of AH has been provided. The other is that NIAH can simultaneously use more than one element type to discretize a unit cell, which can save much computational cost in predicting the CTE of a complex structure. Several examples are carried out to demonstrate the effectiveness of the new implementation. This work is expected to greatly promote the widespread use of AH in predicting the CTE of periodic composite materials.
基金Project supported by the Ministry of Science and Technology of China (2006CB601104)
文摘With Al2O3, Dy2O3, and SiO2 as starting materials, the basic glass of Al2O3-Dy2O3-SiO2 system was prepared by conventional melting technology, and their thermal expansion coefficients （TECs） at different anneal time were investigated. TECs of the basic glass, which were heat-treated under different temperature, were also investigated. The result showed that TECs of the basic glass gradually approached a fixed value as the anneal time was extended, which suggested that most of the inner stress had been eliminated. After heat treatment, the contents of Dy2O3, Dy2Si2O7, and a new crystal increased up to 1200 ℃ and decreased below 1250 ℃, which was consistent with the TEC change of crystallized samples. This suggests that the crystal has a direct effect on TECs of the crystallized samples.
基金supported by the National Natural Science Foundation of China (No.50971020)the National High-Tech Research and Development Program of China (No.2008AA03Z505)
文摘Diamond reinforced copper（Cu/diamond） composites were prepared by pressure infiltration for their application in thermal management where both high thermal conductivity and low coefficient of thermal expansion（CTE） are important.They were characterized by the microstructure and thermal properties as a function of boron content,which is used for matrix-alloying to increase the interfacial bonding between the diamond and copper.The obtained composites show high thermal conductivity（660 W/（m·K）） and low CET（7.4×10-6 K-1） due to the formation of the B13C2 layer at the diamond-copper interface,which greatly strengthens the interfacial bonding.Thermal property measurements indicate that in the Cu-B/diamond composites,the thermal conductivity and the CTE show a different variation trend as a function of boron content,which is attributed to the thickness and distribution of the interfacial carbide layer.The CTE behavior of the present composites can be well described by Kerner＇s model,especially for the composites with 0.5wt% B.
文摘Cu-coated powder was fabricated by electroless plating process, and the composition and morphology of coated powder were studied. Moreover, Cu-30, 40, 50 vol.%SiCp heat sink materials were fabricated by hot pressing using coated and uncoated powder. And the microstructure and thermophysical properties of the heat sink materials were also studied. The results show that SiCp particles distribute uniformly in heat sink materials and the interface between SiCp particles and Cu matrix is clear and well bonded. On the condition of same volume fraction of SiCp, the thermal conductivity of the material using coated powder is larger than that of the material using uncoated powder. Under experiment conditions, the thermal conductivity and coefficient of thermal expansion of Cu-30 vol.%SiCp heat sink material is 236.2 W·m-1·K-1 and 9.9×10-6/K (30-200 ℃) respectively. It provides important reference data for future experiments.
