Bonding strength of Invar/Cu clad strips fabricated by twin-roll casting process

Based on traditional twin-roll casting process,Invar/Cu clad strips were successfully fabricated by using solid Invar alloy strip and molten Cu under conditions of high temperature,high pressure and plastic deformation.A series of tests including tensile test,bending test,T-type peeling test and scanning electron microscope(SEM)and energy dispersive spectrometer(EDS)measurements were carried out to analyze the mechanical properties of Invar/Cu clad strips and the micro-morphology of tensile fracture surfaces and bonding interfaces.The results indicate that no delamination phenomenon occurs during the compatible deformation of Invar/Cu in bending test and only one stress platform exists in the tensile stress-strain curve when the bonding strength is large.On the contrary,different mechanical properties of Invar and Cu lead to delamination phenomenon during the uniaxial tensile test,which determines that two stress platforms occur on the stress-strain curve of Invar/Cu clad strips when two elements experience necking.The average peeling strength can be increased from13.85to42.31N/mm after heat treatment at800℃for1h,and the observation of the Cu side at peeling interface shows that more Fe is adhered on the Cu side after the heat treatment.All above illustrate that heat treatment can improve the strength of the bonding interface of Invar/Cu clad strips.

Bonding strength in carbon steel sandwich panels under condition of diffusion-rolling with small reduction

One of the key problems by diffusion-rolling bonding with small reduction for carbon steel plates is the bonding assistant coat. Abonding assitant coat used below 850℃ was developed. It contained copper as basic element and zinc as main alloy element. Other small elements and rear metals were added to decrease the melting point and to obtain a better clouding and bigh plasticity. Based on the theory of brazing and transient liquid diffusion welding, two carbon steel plates were rolled with small reduction by using self-made bonding assistant coat. Temperature, pressure and holding time are the main technology parameters for controlling the process of diffusion-rolling. The results show that the bonding strength is the greatest when the bonding temperature is 830℃, holding time is 3 min and the reduction rate is 9%.

Bonding strength of graded anti-corrosive coatings of fluoroethylenepropylene (FEP)/polyphenylene sulfide (PPS)

Fluororesin-based anti-corrosive coatings including graded FEP/PPS were prepared on carbon steel by melt powder coating, the bonding strength of all coating systems was determined by the pull-off test. It is found that the poor adhesion of fluororesin coatings to metallic substrates is improved obviously by the graded coating structure of FEP/PPS, and the bonding strength reaches up to 11.8 MPa for the five-layer system. Examination by electron probe microanalysis （EPMA） verifies that the distribution of main components is graded in the five-layer system, which is responsible for the enhancement of the interfacial bonding.

Effect of Curing Regime on Bonding Strength of EVA Modified Mortar to Tile

Ethylene-Vinyl Acetate （EVA） redispersible powder and latex were used to modify mortar. Three kinds of curing regimes： standard curing, high temperature curing and freeze-thaw circle curing were adopted to cure the bonded samples. Bonding strength of EVA modified mortar was tested at 28 days. The development of bonding strengths under all three curing regimes were discussed and compared. The experimental results show that bonding strength increases with the increase of EVA content in mortar. The curing regime used within 28 days is critical according to the bonding strengths values under three curing regimes for different ages. The reasons of that the EVA can improve the bonding strength were analyzed.

Interfacial Bonding Strength of TiN Film Coated on Si_3N_4 Ceramic Substrate

The fraction of TiN/Si3N4 in the cross section was observed with scanning electric microscope （SEM）, and residual stresses of TiN coated on the surface of Si3N4 ceramic were measured with X-ray diffraction （XRD）.The hardness of TiN film was measured, and bonding strength of TiN film coated on Si3N4 substrate was measured by scratching method. The formed mechanism of residual stress and the failure mechanism of the bonding interface in the film were analyzed, and the adhesion mechanism of TiN film was investigated preliminarily. The results show that residual stresses of TiN film are all behaved as compressive stress, and TiN film is represented smoothly with brittle fracture, which is closely bonded with Si3N4 substrate. TiN film has high hardness and bonding strength of about 500 MPa, which could satisfy usage requests of the surface of cutting Si3N4 ceramic.

The effect of zirconium coating on bonding strength of porcelain to titanium

The Zr coating was deposited on titanium surface using the magnetron sputtering technique. Effects of Zr coating on microstructure and mechanical properties of porcelain fired to titanium have been investigated. The results show that interdiffusion of elements occurs during porcelain firing, and the Zr coating can effectively protect titanium surface from excess oxidation. The strength of bond zone with Zr coating deposited for 1 hour reaches 29. 7 MPa, which has increased by 26.4% as compared with that of bond zone without coating （23.5 MPa）.

The study on interfacial bonding strength of Ag-Ni, Ag-Cu in cold pressure welding

The area of combination actually is a kind of interfacial phenomena that exist on the surface or thin film. The properties of interface have important effect on the whole welded joint, even decide directly the interfacial bonding strength. The bonding strength of metals in cold pressure welding such as Ag Ni (they are hardly mutual soluble) and Ag Cu(they are limited soluble) are discussed in this paper. The results of the tensile test suggest that two kinds of welded joints have enough strength to satisfy with the demand for being used. Moreover, thermodynamics, crystal logy, physics and metal electronic microscopic analysis etc are adopted to further calculate the bonding strength. The results of test and theoretical analyses prove that Ag Ni, Ag Cu, especially, for Ag Ni can form strong welded joint which is higher than that of the relative soft base metals in cold pressure welding.

Study on Welding-Bead Bonding Strength of Laser-Stacking Copper-Aluminum Heterogeneous Electrode Plates

In this paper,two types of copper-aluminum heterogeneous electrode plates are stacked and the finite element analysis(FEA)models of two different laser welding conditions are built by using SYSWELD welding simulation software to calculate the depth of the welding bead and the temperature distribution of the welding surface.Then,the residual stress analysis data of the welded area are exported and the residual stress is applied to the welded specimen for CAE analysis to ensure that the welding bonding strength meets the design target of a shear force of 500 N or higher.The copper-aluminum laser-stacking simulation technique in this paper can be applied to the manufacturing of copper-aluminum heterogeneous laser-welded electrodes and series-connected electrodes of automotive lithium-ion power battery modules,providing an effective analysis method for welding bonding-strength.

Effect of Surface Treatment on Bonding Strength of Aluminum-Magnesium Hot-Rolled Composite Plate

The effect of different surface treatments on the bonding strength of composite plates was investigated under the conditions of 400℃ and reduction ratio of 45%.Results show that the wire brush grinding treatment can only eliminate the oxide film on the plate surface,but it can hardly produce a hard layer on the plate surface.The bonding effect depends on the element diffusion promoted by the close contact between the metals on both sides of the interface.After anodic oxidation,there is a hard layer on the metal surface,and the hard layer broken during the rolling process forms a mechanical occlusion at the bonding interface.However,the hard layer cannot form an effective combination with the metal at the interface,and the bonding can only occur in the fresh metal bonding area at the crack of the hard layer.The acid-alkali washing treatment can completely remove the hard layer on the surface of both alloys without increasing the surface roughness of the plate,and the metal on both sides of the interface is more closely bonded during the rolling process.The optimal bonding strength can be obtained by surface treatment of acid-alkali washing for the aluminum-magnesium hot-rolled bonding.

Hybrid bonding of GaAs and Si wafers at low temperature by Ar plasma activation

High-quality bonding of 4-inch GaAs and Si is achieved using plasma-activated bonding technology.The influence of Ar plasma activation on surface morphology is discussed.When the annealing temperature is 300℃,the bonding strength reaches a maximum of 6.2 MPa.In addition,a thermal stress model for GaAs/Si wafers is established based on finite element analysis to obtain the distribution of equivalent stress and deformation variables at different temperatures.The shape varia-tion of the wafer is directly proportional to the annealing temperature.At an annealing temperature of 400℃,the maximum protrusion of 4 inches GaAs/Si wafers is 3.6 mm.The interface of GaAs/Si wafers is observed to be dense and defect-free using a transmission electron microscope.The characterization of interface elements by X-ray energy dispersion spectroscopy indi-cates that the elements at the interface undergo mutual diffusion,which is beneficial for improving the bonding strength of the interface.There is an amorphous transition layer with a thickness of about 5 nm at the bonding interface.The preparation of Si-based GaAs heterojunctions can enrich the types of materials required for the development of integrated circuits,improve the performance of materials and devices,and promote the development of microelectronics technology.

Experimental study on modification of water-based filtercake to improve the bonding strength at the wellbore cement-formation interface

The objective of this experimental study is to improve the cementing bond quality of sandstone oil-gas well along the wellbore cement-formation interface(WCFI),so as to ensure long-term zonal isolation throughout the lifecycle of the well by using NsO solution as filtercake modifier which was developed in the laboratory.According to designed experimental method and API RP 10,the effectiveness of filtercake modifier(NSO)on the bonding strength at the WCFI was assessed by using designed simulated wellbore as sandstone formation.The experimental results indicated that the samples which were treated with NsO solution had higher bond strength over untreated samples.The strength generally increased with curing period as for treated samples,0.198,0.374,0.433 and 0.473 MPa for 3,7,15,and 30 days respectively while for the untreated samples the bond strength were 0.050,0.070,0.81 and 0.100 MPa for the same period.The water-based filtercake modification techniques had significantly enhanced the bonding strength of WCFI by increasing rates above 296%.Improvement of bond strength to the treated sample was due to filtercake modification as a result of formation of cementitious material as revealed in FTIR spectral such as Calcium-Silicate-Hydrate(C-S-H)and other geopolymers like Calcium-Aluminium-Silicate-Hydrate(C-A-S-H)and Sodium-Aluminium-Silicate-Hydrate(N-A-S-H)along the interface which filled the existed pores hence reducing porosity hence high strength of bond.The low transmittance value for the NsO treated samples revealed that there were more cementitious materials existing at the WCFI which led to improvement of bonding strength as compared to the untreated samples.The lower/poor bond strength for the untreated samples is due to existence of untreated,thick water-based filtercake films at WCFI,which prevented the complete hydration process between rock grains and cement slurry components to make chemical binder of cement slurry material and formation.2022 The Authors.Publishing services provided by Elsevier B.V.on behalf of KeAi Communication Co.Ltd.This is an open access article under the cc BY license(http://creativecommons.org/licenses/by/4.o/).

Additive manufacturing of steel–copper functionally graded material with ultrahigh bonding strength

Additive manufacturing enables processing of functionally graded materials(FGMs)with flexible spatial design and high bonding strength.A steel-copper FGM with high interfacial strength was developed using laser powder bed fusion(LPBF).The effect of laser process parameters on interfacial defects was evaluated by X-ray tomography,which indicates a low porosity level of 0.042%therein.Gradient/fine dendritic grains in the interface are incited by high cooling rates,which facilitates interface strengthening.Multiple mechanical tests evaluate the bonding reliability of interface;and the fatigue tests further substantiate the ultrahigh bonding strength in FGMs,which is superior to traditional manufacturing methods.Mechanisms of the high interfacial bond strength were also discussed.

Mechanistic insights of the controlled release capacity of polar functional group in transdermal drug delivery system:the relationship of hydrogen bonding strength and controlled release capacity

Background:Hydrogen bonding interaction was considered to play a critical role in controlling drug release from transdermal patch.However,the quantitative evaluation of hydrogen bonding strength between drug and polar functional group was rarely reported,and the relationship between hydrogen bonding strength and controlled release capacity of pressure sensitive adhesive(PSA)was not well understood.The present study shed light on this relationship.Methods:Acrylate PSAs with amide group were synthesized by a free radical-initiated solution polymerization.Six drugs,i.e.,etodolac,ketoprofen,gemfibrozil,zolmitriptan,propranolol and lidocaine,were selected as model drugs.In vitro drug release and skin permeation experiments and in vivo pharmacokinetic experiment were performed.Partial correlation analysis,fourier-transform infrared spectroscopy and molecular simulation were conducted to provide molecular details of drug-PSA interactions.Mechanical test,rheology study,and modulated differential scanning calorimetry study were performed to scrutinize the free volume and molecular mobility of PSAs.Results:Release rate of all six drugs from amide PSAs decreased with the increase of amide group concentrations;however,only zolmitriptan and propranolol showed decreased skin permeation rate.It was found that drug release was controlled by amide group through hydrogen bonding,and controlled release extent was positively correlated with hydrogen bonding strength.Conclusion:From these results,we concluded that drugs with strong hydrogen bond forming ability and high skin permeation were suitable to use amide PSAs to regulate their release rate from patch.

Lightweight epoxy-based abradable seal coating with high bonding strength

To gain high efficiency and low fuel consumption, aluminum-based abradable seal coatings had been widely used in the compressor casing of aero engines or gas turbines owing to the low elastic modulus. However, the adhesive transfer phenomenon frequently occurs when the radial rubbing generates between titanium alloy blade tips and aluminum-based coating. It tends to increase scratch force and results in blades vibration and even engine jam. To eliminate this problem, a new lightweight epoxy-based abradable seal coating with high bonding strength was developed by an effective and porosity controllable mixing process that distributes spherical pores uniformly in the continuous matrix. A lightweight coating of 63% porosity with a hardness of 33.1(HR15 Y) can be reached when the content of hollow microspheres is 31 wt.%. The coating density is 0.5 g/cm3 and the bonding strength is as high as 18 MPa.The performance of the epoxy-based coating is comprehensively better than aluminum-based coatings in five essential indices. This study is expected to provide a new technical path for obtaining high-quality abradable seal coatings to guarantee the efficient and safe operation of compressors.

Effects of cerium on microstructure and bonding strength of Cu-14Al-4.5Fe bronze plasma sprayed coating

Cu-14Al-4.5Fe bronze powders with and without 0.6% Ce were prepared and their coatings were fabricated on 45# carbon steel substrate by atmospheric plasma spraying. The effects of rare earth Ce on the coating interface bonding strength, coatings and bonding interface vertical sections microstructure were investigated by tensile machine, X-ray diffraction analysis, scanning electron microscopy （SEM） and electronic probe microanalysis （EPMA）. The results showed that the shape of powders was more spherical like, and the coating’s hardness and interface bonging tensile strength would be improved to 8.9% and 17.4%, respectively, higher than that of the Cu-14Al-4.5Fe coating without 0.6% Ce added. The refined of κ phases, well distributed matrix phases in coatings and the promotion of Fe, Al elements diffusion led to the improvement in interface bonding strength and hardness of the Cu-14Al-4.5Fe coating with addition of 0.6% Ce, which hardened and strengthened the coating.

Development of anti-oxidation Ag salt paste for large-area(35×35 mm^(2))Cu-Cu bonding with ultra-high bonding strength

In this paper,by proposing a novel and low-cost Ag salt paste,a robustly and large-area(35×35 mm^(2))bare Cu to Cu bonding was realized under a low sintering pressure of 0.8 MPa and a low sintering temperature of 300℃ in air atmospheric conditions.The relationship between the bonding strength and microstructure changes of sintered Ag under various bonding conditions was investigated in detail.The large-area bonded plate exhibits low porosity about 10%and low percentage of voids,which result in ultra-high bonding strength over 58 MPa.More importantly,the introduction of reducing agent formic acid(CH_(2)O_(2))and the low porosity successfully improve the anti-oxidation of novel Ag salt paste during sintering process,result in pure Cu-Ag-Cu bonding.The cross-section of the Ag joints was obtained to explain the bonding pattern,in which Cu was oxidized only at the edge of the sintering interface,and no Cu oxide generated in middle bonding section.The development of novel Ag salt paste successfully addresses the energy-intensive process and low bonding strength faced by large-scale sintering,which greatly promotes the high-temperature applications of power device.

Atom Diffusion Behavior and Bonding Strength of Ag/Cu Composite Interface

The atom (Ag,Cu) diffusion behavior and the effect of technology on the interface of rolled Ag/Cu composite contact were investigated. The concentration of Ag and Cu atoms near the interface was determined with electron probe. The bonding strength of composite interface was tested and the fracture in tensile sample was observed by SEM. The results show that there was inter diffusion of Ag and Cu atoms on the interface, which formed compact layer with high bonding strength of 98 MPa. The practical application proved that the Ag/Cu composite interface is reliable.

Improvement of Bonding Strength of Horizontal Twin-Roll Cast Steel/Aluminum Clad Sheet by Electromagnetic Fields

Electromagnetic field is an available online method to increase bonding strength of clad sheet manufactured by horizontal twin-roll casting （HTRC）. In this paper, an electric current pulse （ECP） and a complex field （static magnetic field （SMF） together with ECP） are exerted during HTRC of steel/aluminum clad sheet. The produced clad sheet has good appearance, and no visible defects exist at the bonding interface. The inter-diffusion zone at Fe/A1 interface in ECP and SMF＋ECP sheets is 3 and 4 μm, respectively, and the latter increases slightly compared with that in non-field sheet. The average peel strengths （APS） of ECP and SMF＋ECP sheet are 14 and 21 N/mm, respectively, which increase by 2 and 9 N/mm compared with 12 N/mm of non-field sheet. The APS increment in SMF＋ECP sheet is resulted from the increment of interface bonding spots and the enhancement of inter-diffusion zone width.

Study on interfacial structure and strength of Si_3N_4/Ti/Cu/Ti/Si_3N_4 PTLP bonding

Partial transient liquid-phase bonding （PTLP bonding） of Si3N4 ceramic with Ti/Cu/Ti multi-interlayer is performed with changing the thickness of Ti foil. The influence of Ti foil thickness on interface structure and joint strength was discussed. The joint interface structures are investigated by scanning electron microscope （SEM） and energy dispersion spectroscopy（EDS）. The results show that the maximum joint strength of 210 MPa is obtained at room temperature in the experiments. When joining temperature and time are not changed and the process of isothermal solidification is sufficient , interface structure, reaction layer thickness and isothermal solidification thickness change with the thickness of Ti foil.

Factors Influencing Bonding Strength of Laminated Bamboo Strips Lumber

Factors influencing bonding strength of laminated bamboo strips lumber (LBSL) were investigated in this paper. In order to find an optimized technology, this paper investigated how the thickness of bamboo strips, the assembly orientation of bamboo curtain, the type of adhesives, as well as coupling agent treatment of bamboo curtain affected the bonding strength. The following conclusions were drawn: 1)The thinner the thickness of the bamboo strips, the bigger the bonding strength of LBSL; 2) The assembly orientation of the bamboo curtain benefited the bonding strength, MOR and MOE; 3) The bonding strength increased with the use of phenol-resorcinol-formaldehyde (PRF) resin; and 4) Treatment of coupling agent could increase the bonding strength but decrease both MOR and MOE.