In this paper, 0.15-μm gate-length In0.52Al0.48As/In0.53Ga0.47As InP-based high electron mobility transistors （HEMTs） each with a gate-width of 2×50 μm are designed and fabricated. Their excellent DC and RF c...In this paper, 0.15-μm gate-length In0.52Al0.48As/In0.53Ga0.47As InP-based high electron mobility transistors （HEMTs） each with a gate-width of 2×50 μm are designed and fabricated. Their excellent DC and RF characterizations are demonstrated. Their full channel currents and extrinsic maximum transconductance （gm,max） values are measured to be 681 mA/mm and 952 mS/mm, respectively. The off-state gate-to-drain breakdown voltage （BVGD） defined at a gate current of-1 mA/mm is 2.85 V. Additionally, a current-gain cut-off frequency （fT） of 164 GHz and a maximum oscillation frequency （fmax） of 390 GHz are successfully obtained; moreover, the fmax of our device is one of the highest values in the reported 0.15-μm gate-length lattice-matched InP-based HEMTs operating in a millimeter wave frequency range. The high gm,max, BVGD, fmax, and channel current collectively make this device a good candidate for high frequency power applications.展开更多
lnA1N/GaN high-electron-mobility transistors （HEMTs） on SiC substrate were fabricated and character- ized. Several techniques, consisting of high electron density, 70 nm T-shaped gate, low ohmic contacts and a short...lnA1N/GaN high-electron-mobility transistors （HEMTs） on SiC substrate were fabricated and character- ized. Several techniques, consisting of high electron density, 70 nm T-shaped gate, low ohmic contacts and a short drain-source distance, are integrated to gain high device performance. The fabricated InA1N/GaN HEMTs exhibit a maximum drain saturation current density of 1.65 A/ram at Vgs = 1 V and a maximum peak transconductance of 382 mS/rnm. In addition, a unity current gain cut-off frequency （fT） of 162 GHz and a maximum oscillation frequency （fmax） of 176 GHz are achieved on the devices with the 70 nm gate length.展开更多
基金Project supported by the National Basic Research Program of China(Grant Nos.2010CB327502 and 2010CB327505)the Advance Research Project(Grant No.5130803XXXX)
文摘In this paper, 0.15-μm gate-length In0.52Al0.48As/In0.53Ga0.47As InP-based high electron mobility transistors （HEMTs） each with a gate-width of 2×50 μm are designed and fabricated. Their excellent DC and RF characterizations are demonstrated. Their full channel currents and extrinsic maximum transconductance （gm,max） values are measured to be 681 mA/mm and 952 mS/mm, respectively. The off-state gate-to-drain breakdown voltage （BVGD） defined at a gate current of-1 mA/mm is 2.85 V. Additionally, a current-gain cut-off frequency （fT） of 164 GHz and a maximum oscillation frequency （fmax） of 390 GHz are successfully obtained; moreover, the fmax of our device is one of the highest values in the reported 0.15-μm gate-length lattice-matched InP-based HEMTs operating in a millimeter wave frequency range. The high gm,max, BVGD, fmax, and channel current collectively make this device a good candidate for high frequency power applications.
基金supported by the National Natural Science Foundation of China(No.61306113)
文摘lnA1N/GaN high-electron-mobility transistors （HEMTs） on SiC substrate were fabricated and character- ized. Several techniques, consisting of high electron density, 70 nm T-shaped gate, low ohmic contacts and a short drain-source distance, are integrated to gain high device performance. The fabricated InA1N/GaN HEMTs exhibit a maximum drain saturation current density of 1.65 A/ram at Vgs = 1 V and a maximum peak transconductance of 382 mS/rnm. In addition, a unity current gain cut-off frequency （fT） of 162 GHz and a maximum oscillation frequency （fmax） of 176 GHz are achieved on the devices with the 70 nm gate length.
