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Bridge-free fabrication process for Al/AlO_x/Al Josephson junctions
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作者 张珂 李蒙蒙 +2 位作者 刘强 于海峰 于扬 《Chinese Physics B》 SCIE EI CAS CSCD 2017年第7期445-448,共4页
We fabricate different-sized Al/AlO_x/Al Josephson junctions by using a simple bridge-free technique, in which only single-layer E-beam resist polymethyl methacrylate(PMMA) is exposed at low accelerate voltage(belo... We fabricate different-sized Al/AlO_x/Al Josephson junctions by using a simple bridge-free technique, in which only single-layer E-beam resist polymethyl methacrylate(PMMA) is exposed at low accelerate voltage(below 30 kV) and the size of junction can be varied in a large range. Compared with the bridge technique, this fabrication process is very robust because it can avoid collapsing the bridge during fabrication. This makes the bridge-free technique more popular to meet different requirements for Josephson junction devices especially for superconducting quantum bits. 展开更多
关键词 Josephson junction bridge-free technique e-beam lithography superconducting qubit
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