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Effect of supply voltage and body-biasing on single-event transient pulse quenching in bulk fin field-effect-transistor process 被引量:2
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作者 于俊庭 陈书明 +2 位作者 陈建军 黄鹏程 宋睿强 《Chinese Physics B》 SCIE EI CAS CSCD 2016年第4期495-500,共6页
Charge sharing is becoming an important topic as the feature size scales down in fin field-effect-transistor (FinFET) technology. However, the studies of charge sharing induced single-event transient (SET) pulse q... Charge sharing is becoming an important topic as the feature size scales down in fin field-effect-transistor (FinFET) technology. However, the studies of charge sharing induced single-event transient (SET) pulse quenching with bulk FinFET are reported seldomly. Using three-dimensional technology computer aided design (3DTCAD) mixed-mode simulations, the effects of supply voltage and body-biasing on SET pulse quenching are investigated for the first time in bulk FinFET process. Research results indicate that due to an enhanced charge sharing effect, the propagating SET pulse width decreases with reducing supply voltage. Moreover, compared with reverse body-biasing (RBB), the circuit with forward body-biasing (FBB) is vulnerable to charge sharing and can effectively mitigate the propagating SET pulse width up to 53% at least. This can provide guidance for radiation-hardened bulk FinFET technology especially in low power and high performance applications. 展开更多
关键词 body-biasing SET pulse quenching charge sharing bulk FinFET process
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Three-Dimensional Rigid-Plastic FEM Simulation of Bulk Forming Processes with New Contact and Remeshing Techniques 被引量:1
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作者 Debin Shan and Youngsuk Kim School of Mechanical Engineering, Kyungpook National University, Taegu 702-70 1, South Korea Hyunsoo Kim Graduate School of Mechanical Engineering, Kyungpook National University, Taegu 702-701, South Korea E-mail: shandb@public 《Journal of Materials Science & Technology》 SCIE EI CAS CSCD 2001年第3期329-332,共4页
Some techniques such as die surface description, contact judgement algorithm and remeshing are proposed to improve the robustness of the numerical solution. Based on these techniques, a three-dimensional rigid-plastic... Some techniques such as die surface description, contact judgement algorithm and remeshing are proposed to improve the robustness of the numerical solution. Based on these techniques, a three-dimensional rigid-plastic FEM code has been developed. Isothermal forging process of a cylindrical housing has been simulated. The simulation results show that the given techniques and the FEM code are reasonable and feasible for three-dimensional bulk forming processes. 展开更多
关键词 Three-Dimensional Rigid-Plastic FEM Simulation of bulk Forming Processes with New Contact and Remeshing Techniques FEM Simulation
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A Review of Glass and Crystallizations of Glass-Ceramics
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作者 Ali S. Alzahrani 《Advances in Materials Physics and Chemistry》 CAS 2022年第11期261-288,共28页
The fundamental science behind glass and glass-ceramics in relation to research including syntheses, processing, characterization and applications are critically reviewed in this paper. The crystalline structure of th... The fundamental science behind glass and glass-ceramics in relation to research including syntheses, processing, characterization and applications are critically reviewed in this paper. The crystalline structure of the crystalline phases/s investigated in the literature is also discussed. Throughout this paper, the scene is set toward the overall picture of the rationale behind the choice of a glass system. Additionally, earlier reviews do not include the most recent literature in this fast-moving field. The main methods of synthesizing glasses and glass-ceramics are explained and described in relation to their applications. The paper concludes with recommendations for future research. 展开更多
关键词 Glass Formation Theories CRYSTALLIZATION GLASS-CERAMICS processing of Powder and bulk Glasses
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Fabrication and characterization of an SOI MEMS gyroscope
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作者 钟卫威 韩国威 +2 位作者 司朝伟 宁谨 杨富华 《Journal of Semiconductors》 EI CAS CSCD 2013年第6期58-62,共5页
This paper presents an SOI(silicon on insulator) MEMS(micro-electro-mechanical systems) vibratory gyroscope that was fabricated using bulk micromachining processes.In the gyroscope architecture,a frame structure t... This paper presents an SOI(silicon on insulator) MEMS(micro-electro-mechanical systems) vibratory gyroscope that was fabricated using bulk micromachining processes.In the gyroscope architecture,a frame structure that nests the proof mass is used to decouple the drive motion and sense motion.This approach ensures that the drive motion is well aligned with the designed drive axis,and minimizes the actual drive motion component along the sense detection axis.The thickness of the structural layer of the device is 100μm,which induces a high elastic stiffness in the thickness direction,so it can suppress the high-order out-of-plane resonant modes to reduce deviation.In addition,the dynamics of the gyroscope indicate that higher driving mass brings about higher sensing displacements.The thick structural layer can improve the output of the device by offering a sufficient mass weight and large sensing capacitance.The preliminary test results of the vacuum packaged device under atmospheric pressure will be provided.The scale factor is 1.316×10^-4 V/(deg/s),the scale factor nonlinearity and asymmetry are 1.87%and 0.36%,the zero-rate offset is 7.74×10^4 V,and the zero-rate stability is 404 deg/h,respectively. 展开更多
关键词 SOI MEMS vibratory gyroscope bulk micromachining processes decoupled gyroscope ICP
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