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Analysis on the effectiveness of decoupling capacitor on mitigating radiated emission from power ground planes by BEM 被引量:1
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作者 Wen Shuhua Zhang Jinling Hu Yusheng 《The Journal of China Universities of Posts and Telecommunications》 EI CSCD 2015年第1期77-82,共6页
The radiation emission (RE) of multilayer primed circuit board (PCB) will cause electromagnetic compatibility problem. An efficient numerical method for evaluating the effectiveness of decoupling capacitors in red... The radiation emission (RE) of multilayer primed circuit board (PCB) will cause electromagnetic compatibility problem. An efficient numerical method for evaluating the effectiveness of decoupling capacitors in reducing RE from power ground (P/G) planes in PCB was presented. A two-dimensional boundary-element method (BEM) was used to establish the radiation model. Then, the RE was calculated by equivalent magnetic current of edge field around P/G planes. Furthermore, the radiation and input impedance of P/G planes mounted decoupling capacitors were calculated for frequency up to 5 GHz The results were compared to those of the case without decoupling capacitors. It shows that the decoupling capacitors can effectively decrease RE except for anti-resonant frequency. At higher frequencies, the decoupling effectiveness mainly depends on the parasitic inductance of capacitor pin rather than the value. 展开更多
关键词 printed circuit board radiation emission decoupling capacitors boundary-element method equivalent magnetic current
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In-package P/G planes analysis and optimization based on transmission matrix method
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作者 Yin-jun WANG Cheng ZHUO +2 位作者 Jun-yong DENG Jin-fang ZHOU Kang-sheng CHEN 《Journal of Zhejiang University-Science A(Applied Physics & Engineering)》 SCIE EI CAS CSCD 2008年第6期849-857,共9页
Power integrity (PI) has become a limiting factor for the chip's overall performance, and how to place in-package decoupling capacitors to improve a chip's PI performance has become a hot issue. In this paper,... Power integrity (PI) has become a limiting factor for the chip's overall performance, and how to place in-package decoupling capacitors to improve a chip's PI performance has become a hot issue. In this paper, we propose an improved trans- mission matrix method (TMM) for fast decoupling capacitance allocation. An irregular grid partition mechanism is proposed, which helps speed up the impedance computation and complies better with the irregular power/ground (P/G) plane or planes with many vias and decoupling capacitors. Furthermore, we also ameliorate the computation procedure of the impedance matrix whenever decoupling capacitors are inserted or removed at specific ports. With the fast computation of impedance change, in-package decoupling capacitor allocation is done with an efficient change based method in the frequency domain. Experimental results show that our approach can gain about 5× speedup compared with a general TMM, and is efficient in restraining the noise on the P/G plane. 展开更多
关键词 decoupling capacitor Power/ground (P/G) planes Simultaneous switching noise (SSN) Transmission matrixmethod (TMM) Irregular partition Power integrity (PI)
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