To meet the requirements of spacecraft for the thermal conductivity of resins and solve the problem of low thermal conduction efficiency when 3D printing complex parts,we propose a new type of continuous mesophase-pit...To meet the requirements of spacecraft for the thermal conductivity of resins and solve the problem of low thermal conduction efficiency when 3D printing complex parts,we propose a new type of continuous mesophase-pitch-based carbon fiber/thermoplastic polyurethane/epoxy(CMPCF/TPU/epoxy)composite filament and its preparation process in this study.The composite filament is based on the high thermal conductivity of CMPCF,the high elasticity of TPU,and the high-temperature resistance of epoxy.The tensile strength and thermal conductivity of the CMPCF/TPU/epoxy composite filament were tested.The CMPCF/TPU/epoxy composites are formed by 3D printing technology,and the composite filament is laid according to the direction of heat conduction so that the printed part can meet the needs of directional heat conduction.The experimental results show that the thermal conductivity of the printed sample is 40.549 W/(m·K),which is 160 times that of pure epoxy resin(0.254 W/(m·K)).It is also approximately 13 times better than that of polyacrylonitrile carbon fiber/epoxy(PAN-CF/epoxy)composites.This study breaks through the technical bottleneck of poor printability of CMPCF.It provides a new method for achieving directional thermal conductivity printing,which is important for the development of complex high-performance thermal conductivity products.展开更多
采用原位聚合法制备了以三聚氰胺-脲甲醛为壁材,环氧E-51为芯材的微胶囊(MUF),并将其应用到碳纤维(CF)增强不饱和聚酯(UP)复合材料中,详细探讨了CF质量分数和MUF质量分数对碳纤维/不饱和聚酯(CF/UP)复合材料和微胶囊/碳纤维/不饱和聚酯(...采用原位聚合法制备了以三聚氰胺-脲甲醛为壁材,环氧E-51为芯材的微胶囊(MUF),并将其应用到碳纤维(CF)增强不饱和聚酯(UP)复合材料中,详细探讨了CF质量分数和MUF质量分数对碳纤维/不饱和聚酯(CF/UP)复合材料和微胶囊/碳纤维/不饱和聚酯(MUF/CF/UP)复合材料热稳定性、力学性能和自修复性能的影响。通过OM和SEM观察MUF的表面形貌,FTIR对MUF、CF/UP复合材料和MUF/CF/UP复合材料的化学结构进行表征,TGA、悬臂梁冲击仪和万能拉力试验机对复合材料的热稳定性、冲击性能、拉伸性能和自修复性能进行测试。结果表明,CF和MUF质量分数均为1%时,MUF/CF/UP复合材料的热稳定性较佳,力学性能及自修复性能较优;其拉伸强度为3.99 MPa,弹性模量为229.58 MPa,断裂伸长率为2.12%,冲击强度为86.75 k J/m^2,自修复效率为62.02%。展开更多
基金supported by the National Natural Science Foundation of China(Nos.52175474 and 52275498)。
文摘To meet the requirements of spacecraft for the thermal conductivity of resins and solve the problem of low thermal conduction efficiency when 3D printing complex parts,we propose a new type of continuous mesophase-pitch-based carbon fiber/thermoplastic polyurethane/epoxy(CMPCF/TPU/epoxy)composite filament and its preparation process in this study.The composite filament is based on the high thermal conductivity of CMPCF,the high elasticity of TPU,and the high-temperature resistance of epoxy.The tensile strength and thermal conductivity of the CMPCF/TPU/epoxy composite filament were tested.The CMPCF/TPU/epoxy composites are formed by 3D printing technology,and the composite filament is laid according to the direction of heat conduction so that the printed part can meet the needs of directional heat conduction.The experimental results show that the thermal conductivity of the printed sample is 40.549 W/(m·K),which is 160 times that of pure epoxy resin(0.254 W/(m·K)).It is also approximately 13 times better than that of polyacrylonitrile carbon fiber/epoxy(PAN-CF/epoxy)composites.This study breaks through the technical bottleneck of poor printability of CMPCF.It provides a new method for achieving directional thermal conductivity printing,which is important for the development of complex high-performance thermal conductivity products.
文摘采用原位聚合法制备了以三聚氰胺-脲甲醛为壁材,环氧E-51为芯材的微胶囊(MUF),并将其应用到碳纤维(CF)增强不饱和聚酯(UP)复合材料中,详细探讨了CF质量分数和MUF质量分数对碳纤维/不饱和聚酯(CF/UP)复合材料和微胶囊/碳纤维/不饱和聚酯(MUF/CF/UP)复合材料热稳定性、力学性能和自修复性能的影响。通过OM和SEM观察MUF的表面形貌,FTIR对MUF、CF/UP复合材料和MUF/CF/UP复合材料的化学结构进行表征,TGA、悬臂梁冲击仪和万能拉力试验机对复合材料的热稳定性、冲击性能、拉伸性能和自修复性能进行测试。结果表明,CF和MUF质量分数均为1%时,MUF/CF/UP复合材料的热稳定性较佳,力学性能及自修复性能较优;其拉伸强度为3.99 MPa,弹性模量为229.58 MPa,断裂伸长率为2.12%,冲击强度为86.75 k J/m^2,自修复效率为62.02%。
