The effects of thickness and types of gold plating on the resistance to hightemperature discoloration of gold plating on cavity surface of ceramic package were investigated. Itwas found that the thicker gold plating, ...The effects of thickness and types of gold plating on the resistance to hightemperature discoloration of gold plating on cavity surface of ceramic package were investigated. Itwas found that the thicker gold plating, the less discoloration degree for ceramic packages.Non-cyanide gold plating performed better resistance to high-temperature aging than cyanide goldplating. The relationship between the gold plating thickness and the amount of diffused Ni to thegold plating of ceramic packages with Au/Ni and Au/Ni-Co platings after heating at 420℃ for 15 minwas also studied. When the gold plating thickness reach 2.0 μm and 1.6 μm for Au/Ni and Au/Ni-Coplating systems, respectively, no discoloration was observed on the gold plating surface of cavity,and the corresponding diffused Ni amounts (mass fraction) are 1.0% and 0.4%, while the diffused Coto the gold plating is 0.04%.展开更多
The effects of thickness and types of gold plating on the resistance to high temperature discoloration of gold plating on cavity surface of ceramic package were investigated. It was found that the thicker gold plating...The effects of thickness and types of gold plating on the resistance to high temperature discoloration of gold plating on cavity surface of ceramic package were investigated. It was found that the thicker gold plating, the less discoloration degree for ceramic packages. Non-cyanide gold plating performed better resistance to high-temperature aging than cyanide gold plating. The relationship between the gold plating thickness and the amount of diffused Ni to the gold plating of ceramic packages with Au/Ni and Au/Ni-Co platings after heating at 420℃for 15 min was also studied. When the gold plating thickness reach 2.0 μm and 1.6 μm for Au/Ni and Au/Ni-Co plating systems, respectively, no discoloration was observed on the gold plating surface of cavity, and the corresponding diffused Ni amounts (mass fraction) are 1.0% and 0.4%, while the diffused Co to the gold plating is 0.04%.展开更多
Modern electronic circuit requires compact,multifunctional technology in communication systems.However,it is very difficult due to the limitations in passive component miniaturization and the complication of fabricati...Modern electronic circuit requires compact,multifunctional technology in communication systems.However,it is very difficult due to the limitations in passive component miniaturization and the complication of fabrication process.The bandpass filter is one of the most important passive components in millimeter（mm）-wave communication system,attracting significant interest in three-dimension（3D） miniaturized design,which is few reported.In this paper,a bandpass filter structure using low-temperature co-fired ceramic（LTCC） technology,which is fully integrated in a system-in package（SIP） communication module,is presented for miniaturized and high reliable mm-wave application.The bandpass filter with 3D end-coupled microstrip resonators is implemented in order to achieve a high performance bandwidth characteristic.Specifically,all of the resonators are embedded into different ceramic layers to decrease the insertion loss and enhance the out-of-band rejection performance by optimizing the coupling coefficient and the coupling strength.A fence structure,which is formed by metal-filled via array with the gap less than quarter wavelength,is placed around the embedded bandpass filter to avoid electromagnetic（EM） interference problem in multilayer structure.This structural model is validated through actual LTCC process.The bandpass filter is successfully manufactured by modifying the co-fireablity characteristics,adjusting the sintering profile,releasing the interfacial stress,and reducing the shrinkage mismatch with different materials.Measured results show good performance and agree well with the high frequency EM full wave simulation.The influence of layer thickness and dielectric constant on the frequency response in fabricated process is analyzed,where thicker ceramic sheets let the filter response shift to higher frequency.Moreover,measured S-parameters denote the center frequency is also strongly influenced by the variation of ceramic material＇s dielectric constants.By analyzing the relationship between the characteristics of the ceramic tape and the center frequency of the filter,both theoretical and experimental data are accumulated for broadening application filed.With the coupling resonators embedded into the ceramic layers,the bandpass filter exhibits advantages of small size and high reliability compared to conventional planar filter structure,which makes the bandpass filter suitable for SIP communicational application.展开更多
A novel type of ZnO-Al2O3-B2O3-SiO2 glass-ceramics sealing to Kovar in electronic packaging was developed, whose thermal expansion coefficient and electrical resistance are 5.2× 10^-6/℃ and over 1×10^13 Ω&...A novel type of ZnO-Al2O3-B2O3-SiO2 glass-ceramics sealing to Kovar in electronic packaging was developed, whose thermal expansion coefficient and electrical resistance are 5.2× 10^-6/℃ and over 1×10^13 Ω·cm, respectively. The major crystalline phases in the glass-ceramic seals were ZnAl2O4, ZnB2O4, and NaSiAl2O4. The dielectric resistance of the glass-ceramic could be remarkably enhanced through the control of alkali metal ions into crystal lattices. It was found that crystallization happened first on the surface of the sample, leaving the amorphous phase in the inner, which made the glass suitable for sealing. The glass-ceramic showed better wetting on the Kovar surface, and sealing atmosphere and temperature had great effect on the wetting angle. Strong interracial bonding was obtained, which was mainly attributed to the interracial reaction between SiO2 and FeO or Fe3O4.展开更多
The quality of a via hole on a multilayer stack of Low Temperature Co-fired Ceramic (LTCC) tape is of utmost importance to its functionality. This paper investigates a substitute for the commonly used circular shape h...The quality of a via hole on a multilayer stack of Low Temperature Co-fired Ceramic (LTCC) tape is of utmost importance to its functionality. This paper investigates a substitute for the commonly used circular shape hole to a more complex one and its implications when different parameters such as sheet thickness, punch speed, travel distance and tool clearance are?changed. Fabrication of the punch tools and the punching process is carried out at the same machine, ensuring alignment. Two types of non-circular shape are chosen to carry out the experiment. Pre-sintered complex shape hole measurements show that while punch conditions such as speed and tool gap have?little effect on the size, sheet thickness and travel depth play a vital role in the overall dimension. Albeit having only a slight effect on the size, those parameters are significant in other aspects of hole quality. Post-sintering investigation is also observed and discussed.展开更多
文摘The effects of thickness and types of gold plating on the resistance to hightemperature discoloration of gold plating on cavity surface of ceramic package were investigated. Itwas found that the thicker gold plating, the less discoloration degree for ceramic packages.Non-cyanide gold plating performed better resistance to high-temperature aging than cyanide goldplating. The relationship between the gold plating thickness and the amount of diffused Ni to thegold plating of ceramic packages with Au/Ni and Au/Ni-Co platings after heating at 420℃ for 15 minwas also studied. When the gold plating thickness reach 2.0 μm and 1.6 μm for Au/Ni and Au/Ni-Coplating systems, respectively, no discoloration was observed on the gold plating surface of cavity,and the corresponding diffused Ni amounts (mass fraction) are 1.0% and 0.4%, while the diffused Coto the gold plating is 0.04%.
文摘The effects of thickness and types of gold plating on the resistance to high temperature discoloration of gold plating on cavity surface of ceramic package were investigated. It was found that the thicker gold plating, the less discoloration degree for ceramic packages. Non-cyanide gold plating performed better resistance to high-temperature aging than cyanide gold plating. The relationship between the gold plating thickness and the amount of diffused Ni to the gold plating of ceramic packages with Au/Ni and Au/Ni-Co platings after heating at 420℃for 15 min was also studied. When the gold plating thickness reach 2.0 μm and 1.6 μm for Au/Ni and Au/Ni-Co plating systems, respectively, no discoloration was observed on the gold plating surface of cavity, and the corresponding diffused Ni amounts (mass fraction) are 1.0% and 0.4%, while the diffused Co to the gold plating is 0.04%.
基金supported by Research Fund for the Doctoral Program of Higher Education of China(Grant No.20060614021)Sichuan Provincial Fundamental Research of China(Grant No.2008JY0057),Fundamental Research Funds for the Central Universities of China(Grant No.ZYGX2009J091)
文摘Modern electronic circuit requires compact,multifunctional technology in communication systems.However,it is very difficult due to the limitations in passive component miniaturization and the complication of fabrication process.The bandpass filter is one of the most important passive components in millimeter（mm）-wave communication system,attracting significant interest in three-dimension（3D） miniaturized design,which is few reported.In this paper,a bandpass filter structure using low-temperature co-fired ceramic（LTCC） technology,which is fully integrated in a system-in package（SIP） communication module,is presented for miniaturized and high reliable mm-wave application.The bandpass filter with 3D end-coupled microstrip resonators is implemented in order to achieve a high performance bandwidth characteristic.Specifically,all of the resonators are embedded into different ceramic layers to decrease the insertion loss and enhance the out-of-band rejection performance by optimizing the coupling coefficient and the coupling strength.A fence structure,which is formed by metal-filled via array with the gap less than quarter wavelength,is placed around the embedded bandpass filter to avoid electromagnetic（EM） interference problem in multilayer structure.This structural model is validated through actual LTCC process.The bandpass filter is successfully manufactured by modifying the co-fireablity characteristics,adjusting the sintering profile,releasing the interfacial stress,and reducing the shrinkage mismatch with different materials.Measured results show good performance and agree well with the high frequency EM full wave simulation.The influence of layer thickness and dielectric constant on the frequency response in fabricated process is analyzed,where thicker ceramic sheets let the filter response shift to higher frequency.Moreover,measured S-parameters denote the center frequency is also strongly influenced by the variation of ceramic material＇s dielectric constants.By analyzing the relationship between the characteristics of the ceramic tape and the center frequency of the filter,both theoretical and experimental data are accumulated for broadening application filed.With the coupling resonators embedded into the ceramic layers,the bandpass filter exhibits advantages of small size and high reliability compared to conventional planar filter structure,which makes the bandpass filter suitable for SIP communicational application.
基金supported by the National Natural Science Foundation of China (No.50274014, 50774005)the Major State Basic Research Development Program of China (No.2006CB605207)the National High-Tech Research and Development Program of China (No.2006AA03Z557)
文摘A novel type of ZnO-Al2O3-B2O3-SiO2 glass-ceramics sealing to Kovar in electronic packaging was developed, whose thermal expansion coefficient and electrical resistance are 5.2× 10^-6/℃ and over 1×10^13 Ω·cm, respectively. The major crystalline phases in the glass-ceramic seals were ZnAl2O4, ZnB2O4, and NaSiAl2O4. The dielectric resistance of the glass-ceramic could be remarkably enhanced through the control of alkali metal ions into crystal lattices. It was found that crystallization happened first on the surface of the sample, leaving the amorphous phase in the inner, which made the glass suitable for sealing. The glass-ceramic showed better wetting on the Kovar surface, and sealing atmosphere and temperature had great effect on the wetting angle. Strong interracial bonding was obtained, which was mainly attributed to the interracial reaction between SiO2 and FeO or Fe3O4.
文摘The quality of a via hole on a multilayer stack of Low Temperature Co-fired Ceramic (LTCC) tape is of utmost importance to its functionality. This paper investigates a substitute for the commonly used circular shape hole to a more complex one and its implications when different parameters such as sheet thickness, punch speed, travel distance and tool clearance are?changed. Fabrication of the punch tools and the punching process is carried out at the same machine, ensuring alignment. Two types of non-circular shape are chosen to carry out the experiment. Pre-sintered complex shape hole measurements show that while punch conditions such as speed and tool gap have?little effect on the size, sheet thickness and travel depth play a vital role in the overall dimension. Albeit having only a slight effect on the size, those parameters are significant in other aspects of hole quality. Post-sintering investigation is also observed and discussed.
