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Effect of polishing parameters on abrasive free chemical mechanical planarization of semi-polar(1122) aluminum nitride surface 被引量:3
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作者 Khushnuma Asghar D.Das 《Journal of Semiconductors》 EI CAS CSCD 2016年第3期115-121,共7页
An abrasive free chemical mechanical planarization(AFCMP) of semi-polar(1122) Al N surface has been demonstrated. The effect of slurry p H, polishing pressure, and platen velocity on the material removal rate(MRR... An abrasive free chemical mechanical planarization(AFCMP) of semi-polar(1122) Al N surface has been demonstrated. The effect of slurry p H, polishing pressure, and platen velocity on the material removal rate(MRR) and surface quality(RMS roughness) have been studied. The effect of polishing pressure on the AFCMP of the(1122) Al N surface has been compared with that of the(1122) Al Ga N surface. The maximum MRR has been found to be 562 nm/h for the semi-polar(1122) Al N surface, under the experimental conditions of 38 k Pa pressure,90 rpm platen velocity, 30 rpm carrier velocity, slurry p H 3 and 0.4 M oxidizer concentration. The best root mean square(RMS) surface roughness of 1.2 nm and 0.7 nm, over a large scanning area of 0.70×0.96 mm^2, has been achieved on AFCMP processed semi-polar(1122) AlN and(AlGaN) surfaces using optimized slurry chemistry and processing parameters. 展开更多
关键词 Al N AFCMP chemical mechanical planarization material removal rate surface roughness
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