This paper presents an EPC Class 1 Generation 2 compatible tag with on-chip antenna implemented in the SMIC 0.18 μm standard CMOS process.The UHF tag chip includes an RF/analog front-end, a digital baseband, and a 64...This paper presents an EPC Class 1 Generation 2 compatible tag with on-chip antenna implemented in the SMIC 0.18 μm standard CMOS process.The UHF tag chip includes an RF/analog front-end, a digital baseband, and a 640-bit EEPROM memory.The on-chip antenna is optimized based on a novel parasitic-aware model.The rectifier is optimized to achieve a power conversion efficiency up to 40% by applying a self-bias feedback and threshold compensation techniques.A good match between the tag circuits and the on-chip antenna is realized by adjusting the rectifier input impedance.Measurements show that the presented tag can achieve a communication range of 1 cm with 1 W reader output power using a 1 × 1 cm2 single-turn loop reader antenna.展开更多
A 2 nd transconductance subharmonic receiver for 245 GHz spectroscopy sensor applications has been proposed. The receiver consists of a 245 GHz on-chip folded dipole antenna, a CB（common base） LNA, a 2 nd transcondu...A 2 nd transconductance subharmonic receiver for 245 GHz spectroscopy sensor applications has been proposed. The receiver consists of a 245 GHz on-chip folded dipole antenna, a CB（common base） LNA, a 2 nd transconductance SHM（subharmonic mixer）, and a 120 GHz push-push VCO with 1/64 divider. The receiver is fabricated in f;/f;= 300/500 GHz SiGe:C BiCMOS technology. The receiver dissipates a low power of 288 mW.Integrated with the on-chip antenna, the receiver is measured on-chip with a conversion gain of 15 dB, a bandwidth of 15 GHz, and the chip will be utilized in PCB board design for gas spectroscopy sensor application.展开更多
为满足卫星通信中双频共口径、高集成、多波束等要求,提出了一种基于封装天线(Antenna in Package, AIP)架构的Ka频段收发共口径多波束相控阵天线。天线以双频堆叠微带单元的形式实现了收发共口径,并通过天线集成滤波器保证了收发通道...为满足卫星通信中双频共口径、高集成、多波束等要求,提出了一种基于封装天线(Antenna in Package, AIP)架构的Ka频段收发共口径多波束相控阵天线。天线以双频堆叠微带单元的形式实现了收发共口径,并通过天线集成滤波器保证了收发通道的隔离度优于44 dB。在±60°范围内,64元接收阵增益优于17.4 dB,128元发射阵增益优于20.2 dB,具有良好的波束扫描性能。为获得收发多波束一片式集成,在收发(Transmitter/Receiver, T/R)组件中使用晶圆级三维系统集成封装(Three Dimensions System in Package, 3D-SIP)并结合微凸点的制备技术,保证了系统级芯片(System-on-Chip, SOC)的高密度二次集成。高低频混压技术同样被应用于阵面、收发网络、控制供电链路的多层板集成。所提多波束的相控阵天线新架构具有高密度集成TR组件、多波束一体化、高效散热等特点,在卫星通信和数据链等方面具有广阔的应用前景。展开更多
文摘This paper presents an EPC Class 1 Generation 2 compatible tag with on-chip antenna implemented in the SMIC 0.18 μm standard CMOS process.The UHF tag chip includes an RF/analog front-end, a digital baseband, and a 640-bit EEPROM memory.The on-chip antenna is optimized based on a novel parasitic-aware model.The rectifier is optimized to achieve a power conversion efficiency up to 40% by applying a self-bias feedback and threshold compensation techniques.A good match between the tag circuits and the on-chip antenna is realized by adjusting the rectifier input impedance.Measurements show that the presented tag can achieve a communication range of 1 cm with 1 W reader output power using a 1 × 1 cm2 single-turn loop reader antenna.
基金Project supported by the Zhejiang National Natural Science Foundation of China(No.LQ17F040001)the Key Laboratory Open Project Fund of Southeast University,China(No.K201817)
文摘A 2 nd transconductance subharmonic receiver for 245 GHz spectroscopy sensor applications has been proposed. The receiver consists of a 245 GHz on-chip folded dipole antenna, a CB（common base） LNA, a 2 nd transconductance SHM（subharmonic mixer）, and a 120 GHz push-push VCO with 1/64 divider. The receiver is fabricated in f;/f;= 300/500 GHz SiGe:C BiCMOS technology. The receiver dissipates a low power of 288 mW.Integrated with the on-chip antenna, the receiver is measured on-chip with a conversion gain of 15 dB, a bandwidth of 15 GHz, and the chip will be utilized in PCB board design for gas spectroscopy sensor application.
文摘为满足卫星通信中双频共口径、高集成、多波束等要求,提出了一种基于封装天线(Antenna in Package, AIP)架构的Ka频段收发共口径多波束相控阵天线。天线以双频堆叠微带单元的形式实现了收发共口径,并通过天线集成滤波器保证了收发通道的隔离度优于44 dB。在±60°范围内,64元接收阵增益优于17.4 dB,128元发射阵增益优于20.2 dB,具有良好的波束扫描性能。为获得收发多波束一片式集成,在收发(Transmitter/Receiver, T/R)组件中使用晶圆级三维系统集成封装(Three Dimensions System in Package, 3D-SIP)并结合微凸点的制备技术,保证了系统级芯片(System-on-Chip, SOC)的高密度二次集成。高低频混压技术同样被应用于阵面、收发网络、控制供电链路的多层板集成。所提多波束的相控阵天线新架构具有高密度集成TR组件、多波束一体化、高效散热等特点,在卫星通信和数据链等方面具有广阔的应用前景。
文摘针对奥地利微电子公司（AMS）推出的具有传感功能的标签芯片SL900A,提出一种适用SL900A标签芯片的超高频折叠偶极子标签天线。SL900A标签芯片符合EPC Class1 Gen2（860-960 MHz）标准,谐振频率在900MHz处芯片输入阻抗为31-320jΩ。本文通过HFSS电磁仿真软件对设计的天线进行建模、仿真,分析得出影响天线阻抗、谐振频率和带宽性能的关键尺寸参数,采用烟花算法（FWA）优化方法对天线关键尺寸参数进行优化。经过优化,天线功率反射系数小于-10 d B时带宽为10%,覆盖860-960 MHz频段,最大增益达到-0.98 d B,天线与SL900A标签芯片实现良好的共轭阻抗匹配。根据优化结果制作天线实物,测试结果表明设计实现的天线适用于SL900A标签芯片。
