Transition and Transgression of Identity in Chuck Palahniuk＇s Survivor

The post-modernist concerning with identity and subjectivity posits that identity is multi-faceted and constantly gets re-constructed by choice. This results in increasingly fragmented and unstable identities leading to an inevitable breakdown in social relationships and sanity. A limited and dependable set of coherent identities began to fragment into a diverse and unstable series of competing identities. Post-modernism stifled the idea of nation, religion, family, and identity as bedrocks of stability and security. Disillusioned post-modernist world has deconstructed the well-defined boundaries that governed the life, otherwise, transition and transgression through and across these domains became the norm that allowed negotiation in daily lives. Where the subject became a terminal of multiple networks, consciously enacting the repetitions through which identity was getting produced and changed, demonstrating identity＇s ＂performativity＂. Establishing that what we believe to be true is only a construction or an interpretation of reality, shaped by our own socially constructed bias, thereby putting to scrutiny the idea of reality and real itself, which removed any sense of objective reality and with it the notion of an objective self. Identity is constantly changing and transitioning, the idea of the self which is entangled with multiplicity, heterogeneity, difference and ceaselessly becoming caught between the present and future, real and unreal, death and life. This research paper will carry out an analysis on evidential aspects in the selected novel and will further interpret the episodes of transition and transgressions that inform this novel.

美国参议员提出药品进口提案

美国参议院财政委员会主席共和党参议员Chuck Grassley提出药品市场准入与药品安全法。新提案旨在寻求：去除贸易壁垒；提供一种合法的通过进口获得便宜药品的途径；赋予美国FDA执行安全有效计划的资源和权力；联邦贸易委员会执行非歧视性管理规定，按照此种规定，生产企业如果干预进口，将承担民事损害赔偿。

Chuck Martin:征服“移动武装”的消费者

移动时代,这些消费者不再需要专门逛街购物,他们是＂始终＂都在购物。在移动互联网之前,一个人想购物时,需要坐在一台电脑前面上网购买,或者亲自到实体店里购买。但随着移动的兴起,这一切都改变了,消费者随时随地拿起手中的手机,就可以开始挑选产品,对比价格,下单购买。

Piecewise model and experiment of power chuck's gripping force loss during high speed turning

High speed power chucks are important function units in high speed turning.The gripping force loss is the primary factor limiting the rotational speed of high-speed power chucks.This paper proposes a piecewise model considering the difference of wedge transmission's radial deformation between low-speed stage and medium-to-high-speed stage,the friction forces of chuck transmission,and the compressibility of hydraulic oil in rotary hydraulic cylinders.A corrected model of gripping force loss is also established for power chucks with asymmetric stiffness.The model is verified by experiment results.It is helpful to use the piecewise model to explain the experimental phenomenon that the overall loss coefficient of gripping force increases with the rotational speed increasing at medium and high speed stages.Besides,the loss coefficients of gripping force at each stage during speeding up and the critical rotational speed between two adjacent stages are discussed.For wedge power chucks with small wedge angel(α<20°) and ordinary lubrication(μ0>0.06),the local loss coefficient of gripping force at the low speed stage is about 70% of that at the medium to high speed stage.For wedge power chucks with larger wedge angel(α>20°) or low friction coefficient(μ0<0.06),the wedge transmissions cannot self-lock at high speed stage,and the gripping force loss at the high speed stage is related to the hydraulic lock and hydraulic oil in the rotary hydraulic cylinder;the local loss coefficients of gripping force at the third stage is about 1.75 to 2.13 times that at the second stage.This work is helpful to understand the mechanism of the gripping force loss thoroughly and to optimize power chucks.

Surface shape control of the workpiece in a double-spindle triple-workstation wafer grinder

Double-spindle triple-workstation（DSTW） ultra precision grinders are mainly used in production lines for manufacturing and back thinning large diameter（≥300 mm） silicon wafers for integrated circuits.It is important, but insufficiently studied,to control the wafer shape ground on a DSTW grinder by adjusting the inclination angles of the spindles and work tables.In this paper,the requirements of the inclination angle adjustment of the grinding spindles and work tables in DSTW wafer grinders are analyzed.A reasonable configuration of the grinding spindles and work tables in DSTW wafer grinders are proposed.Based on the proposed configuration,an adjustment method of the inclination angle of grinding spindles and work tables for DSTW wafer grinders is put forward. The mathematical models of wafer shape with the adjustment amount of inclination angles for both fine and rough grinding spindles are derived.The proposed grinder configuration and adjustment method will provide helpful instruction for DSTW wafer grinder design.

Finite element analysis on factors influencing the clamping force in an electrostatic chuck

As one of the core components of IC manufacturing equipment, the electrostatic chuck （ESC） has been widely applied in semiconductor processing such as etching, PVD and CVD. The clamping force of the ESC is one of the most important technical indicators. A multi-physics simulation software COMSOL is used to analyze the factors influencing the clamping force. The curves between the clamping force and the main parameters such as DC voltage, electrode thickness, electrode radius, dielectric thickness and helium gap are obtained. Moreover, the effects of these factors on the clamping force are investigated by means oforthogonal experiments. The results show that the factors can be ranked in order of voltage, electrode radius, helium gap and dielectric thickness according to their importance, which may offer certain reference for the design of ESCs.

A novel measuring method of clamping force for electrostatic chuck in semiconductor devices

Electrostatic chucks are one of the core components of semiconductor devices. As a key index of electrostatic chucks, the clamping force must be controlled within a reasonable range. Therefore, it is essential to accurately measure the clamping force. To reduce the negative factors influencing measurement precision and repeatability, this article presents a novel method to measure the clamping force and we elaborate both the principle and the key procedure. A micro-force probe component is introduced to monitor, adjust, and eliminate the gap between the wafer and the electrostatic chuck. The contact force between the ruby probe and the wafer is selected as an important parameter to characterize de-chucking, and we have found that the moment of de-chucking can be exactly judged. Moreover, this article derives the formula calibrating equivalent action area of backside gas pressure under real working conditions, which can effectively connect the backside gas pressure at the moment of de-chucking and the clamping force. The experiments were then performed on a self-designed measuring platform.The de-chucking mechanism is discussed in light of our analysis of the experimental data. Determination criteria for de-chucking point are summed up. It is found that the relationship between de-chucking pressure and applied voltage conforms well to quadratic equation. Meanwhile, the result reveals that actual de-chucking behavior is much more complicated than the description given in the classical empirical formula.

Design space of electrostatic chuck in etching chamber

One of the core semiconductor devices is the electrostatic chuck. It has been widely used in plasma- based and vacuum-based semiconductor processing. The electrostatic chuck plays an important role in adsorbing and cooling/heating wafers, and has technical advantages on non-edge exclusion, high reliability, wafer planarity, particles reduction and so on. This article extracts key design elements from the existing knowledge and techniques of electrostatic chuck by the method proposed by Paul and Beitz, and establishes a design space systematically. The design space is composed of working objects, working principles and working structures. The working objects in- volve electrostatic chuck components and materials, classifications, and relevant properties; the working principles involve clamping force, residual force, and temperature control; the working structures describe how to compose an electrostatic chuck and to fulfill the overall functions. The systematic design space exhibits the main issues during electrostatic chuck design. The design space will facilitate and inspire designers to improve the design quality and shorten the design time in the conceptual design.

Doing the Best With Waste

Before you chuck your trash into the nearest can, think for a moment. As per government rules in a number of cities, not all your garbage can be dumped into one trashcan. It needs to be sorted out with different piles going into different bins. Waste classification, a practice that has long been the norm in developed countries like Japan, is the new challenge for many Chinese urban dwellers. However, though initially you might need to rack your brains to figure out which trash goes into which can, in the long run, the result is well worth the effort.