Considerable research efforts have been devoted to developing novel photocatalysts with increased performances by hybridizing inorganic nanomaterials with carbon nanotubes.In this work,one-dimensional coaxial core-she...Considerable research efforts have been devoted to developing novel photocatalysts with increased performances by hybridizing inorganic nanomaterials with carbon nanotubes.In this work,one-dimensional coaxial core-shell carbon nanotubes@SiC nanotubes were successfully synthesized via in situ growth of SiC coatings on carbon nanotubes by a vapor-solid reaction between silicon vapor and carbon nanotubes.High-resolution transmission electron microscope images show that SiC and carbon nanotubes link to form a robust heterojunction with intrinsic atomic contact,which results in efficient separation of the photogenerated electron-hole pairs on SiC and electron transfer from SiC to carbon nanotubes.Compared with those of similar materials such as pure SiC nanocrystals and SiC nanotubes,the metal-free carbon nanotubes@SiC exhibits an enhanced photocatalytic activity for hydrogen evolution,which is attributed to the enhanced light absorption and the efficient interfacial charge transfer/separation brought about by their one-dimensional coaxial nanoheterostructures.Moreover,the photocatalytic stability of the metal-free carbon nanotubes@SiC was tested for over 20 h without any obvious decay.展开更多
Many 3D IC applications such as MEMS and RF systems require Through-Silicon Via （TSV） with operations for high-speed vertical communication. In this paper, we introduce a novel air-gap coaxial TSV that is suiTab, fo...Many 3D IC applications such as MEMS and RF systems require Through-Silicon Via （TSV） with operations for high-speed vertical communication. In this paper, we introduce a novel air-gap coaxial TSV that is suiTab, for such RF applications. Firstly, the detailed fabrication process is described to explain how to acquire such a structure. Then, an Resistor Inductance Conductance Capacitance （RLGC） model is developed to profile the transverse electromagnetic field effect of the proposed air-gap TSV. The model is further verified by a 3D field solver program through the S-parameter comparison. With reference to the numerically simulated results, this analytical model delivers a maximum deviation of less than 6%0, on the conditions of varying diameters, outer to inner radius ratios, and SU-8 central angles, etc. Taking advantages of scalability of the model, a number of air-gap-based TSV designs are simulated, providing 1.6-4.0 times higher bandwidth than the con- ventional coaxial TSVs and leading to an efficient high frequency vertical RF interconnection solution for 3D ICs.展开更多
基金supported by the National Natural Science Foundation of China(21673083,21802046)the Guangdong Provincial Science and Technology Project(2017A030313090,2014A030310427)~~
文摘Considerable research efforts have been devoted to developing novel photocatalysts with increased performances by hybridizing inorganic nanomaterials with carbon nanotubes.In this work,one-dimensional coaxial core-shell carbon nanotubes@SiC nanotubes were successfully synthesized via in situ growth of SiC coatings on carbon nanotubes by a vapor-solid reaction between silicon vapor and carbon nanotubes.High-resolution transmission electron microscope images show that SiC and carbon nanotubes link to form a robust heterojunction with intrinsic atomic contact,which results in efficient separation of the photogenerated electron-hole pairs on SiC and electron transfer from SiC to carbon nanotubes.Compared with those of similar materials such as pure SiC nanocrystals and SiC nanotubes,the metal-free carbon nanotubes@SiC exhibits an enhanced photocatalytic activity for hydrogen evolution,which is attributed to the enhanced light absorption and the efficient interfacial charge transfer/separation brought about by their one-dimensional coaxial nanoheterostructures.Moreover,the photocatalytic stability of the metal-free carbon nanotubes@SiC was tested for over 20 h without any obvious decay.
基金Sponsored by the National Natural Science Foundation of China(No.61271149)
文摘Many 3D IC applications such as MEMS and RF systems require Through-Silicon Via （TSV） with operations for high-speed vertical communication. In this paper, we introduce a novel air-gap coaxial TSV that is suiTab, for such RF applications. Firstly, the detailed fabrication process is described to explain how to acquire such a structure. Then, an Resistor Inductance Conductance Capacitance （RLGC） model is developed to profile the transverse electromagnetic field effect of the proposed air-gap TSV. The model is further verified by a 3D field solver program through the S-parameter comparison. With reference to the numerically simulated results, this analytical model delivers a maximum deviation of less than 6%0, on the conditions of varying diameters, outer to inner radius ratios, and SU-8 central angles, etc. Taking advantages of scalability of the model, a number of air-gap-based TSV designs are simulated, providing 1.6-4.0 times higher bandwidth than the con- ventional coaxial TSVs and leading to an efficient high frequency vertical RF interconnection solution for 3D ICs.
