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Effect of strain rate on microstructural evolution and thermal stability of 1050 commercial pure aluminum 被引量:4
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作者 Yang YANG Jun-liang WANG +1 位作者 Ya-dong CHEN Hai-bo HU 《Transactions of Nonferrous Metals Society of China》 SCIE EI CAS CSCD 2018年第1期1-8,共8页
Effects of strain rate on the microstructure evolution and thermal stability of1050commercial pure aluminum processed by means of split Hopkinson pressure bar(SHPB)and Instron?3369mechanical testing machine were inves... Effects of strain rate on the microstructure evolution and thermal stability of1050commercial pure aluminum processed by means of split Hopkinson pressure bar(SHPB)and Instron?3369mechanical testing machine were investigated.Samples in the deformed state and after various annealing treatments at423?523K(150?250°C)for1h were characterized by TEM and hardness test.The result reveals that the samples in the deformed state were mainly composed of elongated subgrains/cells with high density of dislocations.Microstructures of the quasi-static compressed aluminum were quite stable throughout the temperature range studied,and no significant grain growth was observed.However,for the dynamic impacted one,recrystallized grains with an average grain size of4.7μm were evolved after annealing at523K(250°C)for1h.It is suggested that the annealing behavior of this dynamic deformed aluminum is a continuous process of grain coarsening,rather than the traditional discontinuous recrystallization for the quasi-static compressed aluminum. 展开更多
关键词 strain rate thermal stability continuous recrystallization 1050 commercial pure aluminum
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Effect of stress profile on microstructure evolution of cold-drawn commercially pure aluminum wire analyzed by finite element simulation 被引量:2
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作者 Y.K.Zhu Q.Y.Chen +6 位作者 Q.Wang H.Y.Yu R.Li J.P.Hou Z.J.Zhang G.P.Zhang Z.F.Zhang 《Journal of Materials Science & Technology》 SCIE EI CAS CSCD 2018年第7期1214-1221,共8页
The evolution of microstructure in the drawing process of commercially pure aluminum wire (CPAW) does not only depend on the nature of materials, but also on the stress profile. In this study, the effect of stress p... The evolution of microstructure in the drawing process of commercially pure aluminum wire (CPAW) does not only depend on the nature of materials, but also on the stress profile. In this study, the effect of stress profile on the texture evolution of the CPAW was systematically investigated by combining the numerical simulation and the microstructure observation. The results show that the tensile stress at the wire center promotes the formation of 〈111〉 texture, whereas the shear stress nearby the rim makes little contribution to the texture formation. Therefore, the 〈111 〉 texture at the wire center is stronger than that in the surface layer, which also results in a higher microhardness at the center of the CPAW under axial loading.2017 Published by Elsevier Ltd on behalf of The editorial office of Journal of Materials Science & Technology. 展开更多
关键词 commercially pure aluminum wire Cold drawing TEXTURE Finite element simulation Stress profile
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