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Investigation of L1_0 FePt-based soft/hard composite bit-patterned media by micromagnetic simulation
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作者 王颖 韦丹 +1 位作者 曹江伟 魏福林 《Chinese Physics B》 SCIE EI CAS CSCD 2015年第6期662-667,共6页
The soft/hard composite patterned media have potential to be the next generation of magnetic recording, but the composing modes of soft and hard materials have not been investigated systematically. L10 FePt-based soft... The soft/hard composite patterned media have potential to be the next generation of magnetic recording, but the composing modes of soft and hard materials have not been investigated systematically. L10 FePt-based soft/hard composite patterned media with an anisotropic constant distribution are studied by micromagnetic simulation. Square arrays and hexagonal arrays with various pitch sizes are simulated for two composing types: the soft layer that encloses the hard dots and the soft layer that covers the whole surface. It is found that the soft material can reduce the switching fields of bits effectively for all models. Compared with the first type, the second type of models possess low switching fields, narrow switching field distributions, and high gain factors due to the introduction of inter-bit exchange coupling. Furthermore, the readout waveforms of the second type are not deteriorated by the inter-bit soft layers. Since the recording density of hexagonal arrays are higher than that of square arrays with the same center-to-center distances, the readout waveforrns of hexagonal arrays are a little worse, although other simulation results are similar for these two arrays. 展开更多
关键词 micromagnetic simulation composite bit patterned media L10 FePt switching field distribution readout signal
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Effect of tungsten carbide particles on microstructure and mechanical properties of Cu alloy composite bit matrix
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作者 Ding-qian Dong Feng-yuan He +5 位作者 Xin-hui Chen Hui Li Kai-hua Shi Hui-wen Xiong Xin Xiang Li Zhang 《Journal of Iron and Steel Research International》 SCIE EI CAS CSCD 2024年第2期519-530,共12页
Copper alloy composite bit matrix was prepared by pressureless vacuum infiltration,using at least one of the three kinds of tungsten carbide particles,for example,irregular cast tungsten carbide,monocrystalline tungst... Copper alloy composite bit matrix was prepared by pressureless vacuum infiltration,using at least one of the three kinds of tungsten carbide particles,for example,irregular cast tungsten carbide,monocrystalline tungsten carbide and sintered reduced tungsten carbide particles.The effects of powder particle morphology,particle size and mass fraction of tungsten carbide on the microstructure and mechanical properties of copper alloy composite were investigated by means of scanning electron microscopy,X-ray diffraction and abrasive wear test in detail.The results show that tungsten carbide morphology and particle size have obvious effects on the mechanical properties of copper alloy composites.Cast tungsten carbide partially dissolved in the copper alloy binding phase,and layers of Cu_(0.3)W_(0.5)Ni_(0.1)Mn_(0.1)C phase with a thickness of around 8–15μm were formed on the edge of the cast tungsten carbide.When 45%irregular crushed fine cast tungsten carbide and 15%monocrystalline cast tungsten carbide were used as the skeleton,satisfactory comprehensive performance of the reinforced copper alloy composite bit matrix was obtained,with the bending strength,impact toughness and hardness reaching 1048 MPa,4.95 J/cm^(2) and 43.6 HRC,respectively.The main wear mechanism was that the tungsten carbide particles firstly protruded from the friction surface after the copper alloy matrix was worn,and then peeled off from the matrix when further wear occurred. 展开更多
关键词 Polycrystalline diamond compact Pressureless vacuum infiltration Copper alloy composite bit matrix Microstructure characterization Abrasive wear behavior
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Test results judgment method based on BIT faults 被引量:4
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作者 Wang Gang Qiu Jing +1 位作者 Liu Guanjun Lyu Kehong 《Chinese Journal of Aeronautics》 SCIE EI CAS CSCD 2015年第6期1650-1657,共8页
Built-in-test (BIT) is responsible for equipment fault detection, so the test data correct- ness directly influences diagnosis results. Equipment suffers all kinds of environment stresses, such as temperature, vibra... Built-in-test (BIT) is responsible for equipment fault detection, so the test data correct- ness directly influences diagnosis results. Equipment suffers all kinds of environment stresses, such as temperature, vibration, and electromagnetic stress. As embedded testing facility, BIT also suffers from these stresses and the interferences/faults are caused, so that the test course is influenced, resulting in incredible results. Therefore it is necessary to monitor test data and judge test failures. Stress monitor and BIT self-diagnosis would redound to BIT reliability, but the existing anti- jamming researches are mainly safeguard design and signal process. This paper focuses on test results monitor and BIT equipment (BITE) failure judge, and a series of improved approaches is proposed. Firstly the stress influences on components are illustrated and the effects on the diagnosis results are summarized. Secondly a composite BIT program is proposed with information integra- tion, and a stress monitor program is given. Thirdly, based on the detailed analysis of system faults and forms of BIT results, the test sequence control method is proposed. It assists BITE failure judge and reduces error probability. Finally the validation cases prove that these approaches enhance credibility. 展开更多
关键词 bit composite bit program Stress monitor Test course Test sequence control
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