The design and fabrication of electromagnetic interference shielding films with a novel structure to eliminate undesirable electromagnetic pollution is an important research direction.However,it is still a challenge t...The design and fabrication of electromagnetic interference shielding films with a novel structure to eliminate undesirable electromagnetic pollution is an important research direction.However,it is still a challenge to combine and organize nanofillers in different dimensions into the structured network in polymer-based electromagnetic interference(EMI)shielding composites.In this work,a sandwich struc-ture polyimide(PI)composite film with alternative 2D-MXene network and 1D-Silver nanowires(Ag NWs)network was prepared through the“electrospinning-immersion-hot pressing”method.With the increase of Ag NWs content,the EMI shielding effectiveness(SE)gradually increases while maintaining good flexibility and mechanical robustness.The EMI SE and the tensile strength of 150μm thick sand-wich composite film can reach up to 79.54 dB and 39.82 MPa,respectively.The prepared flexible and robust PI composite film with a sandwich structure has high EMI SE with less metal content,which can provide guidelines for the development of high-performance EMI polymeric films with potentials in wearable devices and equipment.展开更多
基金the Fund of Natural Science Founda-tion of Shaanxi Provincial(No.2021JQ-111)the Fund of Basic and Applied Fundamental Research of Guangdong Provincial(No.2020A1515110861).
文摘The design and fabrication of electromagnetic interference shielding films with a novel structure to eliminate undesirable electromagnetic pollution is an important research direction.However,it is still a challenge to combine and organize nanofillers in different dimensions into the structured network in polymer-based electromagnetic interference(EMI)shielding composites.In this work,a sandwich struc-ture polyimide(PI)composite film with alternative 2D-MXene network and 1D-Silver nanowires(Ag NWs)network was prepared through the“electrospinning-immersion-hot pressing”method.With the increase of Ag NWs content,the EMI shielding effectiveness(SE)gradually increases while maintaining good flexibility and mechanical robustness.The EMI SE and the tensile strength of 150μm thick sand-wich composite film can reach up to 79.54 dB and 39.82 MPa,respectively.The prepared flexible and robust PI composite film with a sandwich structure has high EMI SE with less metal content,which can provide guidelines for the development of high-performance EMI polymeric films with potentials in wearable devices and equipment.