Application of silver nanoparticles in electrically conductive adhesives with silver micro flakes

This study has been conducted to evaluate the application of silver nanoparticles(NPs)in Electrically Conductive Adhesives(ECAs),filled with hybrid silver flakes and NPs,and silver flakes as a control sample,at a filler loading of 78 wt.%,83 wt.%and 88 wt.%and cured at 150℃and 180℃,respectively.The results show that the electrical and thermal conductivities of ECAs were improved with the increasing of filler loading and curing temperature.Adding silver NPs in silver flakes negatively affected the electrical and thermal conductivities of ECAs at a low filler mass fraction of 78 wt.%,because the segregation of NPs enlarged the average distance of silver flakes;while it positively influenced the electrical and thermal conductivities of ECAs at a loading ratio of 88 wt.%,probably due to NPs filling in the gaps between silver flakes or even sintering together with each other or with silver flakes,especially when curing at high temperature of 180℃.

Reliability aspects of electronics packaging technology using anisotropic conductive adhesives

Anisotropic conductive adhesive technology for electronics packaging and interconnect application has significantly been developed during the last few years. It is time to make a summary of what has been done in this field. The present paper reviews the technology development, especially from the reliability point of view. It is pointed out that anisotropic conductive adhesives are now widely used in many applications and the reliability data and models have been developed to a large extent for anisotropic conductive adhesives in various applications.

Effect of Curing Procedure on the Properties of Copper-Powder-Filled Conductive Adhesives

By means of testing the shear strength with single lap joint, measuring electrical resistivity for cured products and the curing strain with strain gauges, the effect of cure parameters on the properties of HT1012 conductive adhesive filled with copper powder was investigated, and the residual stress in the conductive adhesives was also estimated. The experimental results show that the properties such as shear strength of the adhesives, electrical resistivity of products as well as the residual stress of cured HT 1012 copperfitted conductive adhesive were evidently affected by curing temperature and time. The diagrams of scanning electron microscopy （SEM） and Fourier transform infrared （FT-IR） were also used to determine the properties. The higher mechanical property was achieved under the condition of curing the adhesive 3 h at 60 ℃ as the density of the hydrogen links or linkages existed in the adhesive was relatively higher and the lower electrical resistivity occurred at 80 ℃.

Electrically Detaching Behavior and Mechanism of Ionic Conductive Adhesives

Design of rapidly detachable adhesives with high initial bonding strength is of great significance but it is full of great challenge. Here, we report the fast electrically detaching behavior (100% detaching efficiency in just 1 min under dozens of DC voltage) and high initial bonding strength (>12 MPa) of epoxy-based ionic conductive adhesives (ICAs). The epoxy-based ICAs are fabricated by introducing polyethylene glycol dimethyl ether (PEGDE) and 1-ethyl-3-methylimidazolium trifluoromethanesulfonate ([EMIM]OTF) into epoxy. The combination of PEGDE and [EMIM]OTF enables the free ions to migrate directively in electric field, and the anchoring of PEG chains onto epoxy chains ensures the long-term reliability of ICAs. The investigation on the electrically detaching mechanism suggests that the enrichment and following rapid interfacial electrochemical reactions of [EMIM]OTF lead to formation of metal hydroxide (Me(OH)n) nanoparticles at the bonding interfaces, thus the strong interactions containing interlocked forces, van de Waals’ forces and hydrogen bonding interactions between ICAs and bonding substrates are destroyed. This work provides a promising direction for detachable adhesives with both high initial bonding strength and high detaching efficiency in short time.

Preparation and Performance of Graphene Oxide Modified Polyurethane Thermal Conductive Insulating Adhesive

A novel graphene oxide (GO) modified polyurethane thermal conductive insulating adhesive with small addition and excellent insulation properties was prepared by in-situ polymerization using GO as thermal conductive filler.The effects of GO content on the mechanical performance,thermal conductivity,thermal stability and insulation properties of the modified polyurethane adhesive were studied.The results showed that the tensile strength and elongation at break of polyurethane adhesive increased at first and then decreased with the increase of GO content.The thermal conductivity and thermal decomposition temperature of GO/PU composite adhesive can be effectively improved by adding appropriate amount of GO.The tensile strength,thermal conductivity and thermal decomposition temperature of polyurethane adhesive reached the maximum when GO content was 1.5 wt%.The novel GO-modified polyurethane adhesive exhibited good insulation property.The development of GO/PU thermal conductive adhesive will provide a facile method for effectively solving the “trade-off” problem between low filling and high thermal conductivity.

Design and Characterization of Electrical Connections for Conductive Yarns

The development of flexible and stretchable electronics has attracted much attention.As an important part of wearable electronic systems,the connection between conductive yarns and electronic components affects the stability and accuracy of their electrical reliability.In this paper,three different connections were attempted to electrically and mechanically link two conductive yarns,including soldering followed by waterborne polyurethane(WPU)encapsulation,coating of conductive silver adhesive with WPU encapsulation,as well as coating of conductive silver adhesive with polydimethylsiloxane(PDMS)encapsulation.The surface morphologies and electro-mechanical behaviors of the three created connected conductive yarns were characterized.Compared with their electro-mechanical behaviors of the established three connections,the connection with soldering remained electrically conductive to around 200%,which mainly came from the stress concentration between the stiff soldering and soft conductive yarns.However,the coating of conductive silver adhesive and encapsulated protection of PDMS can make the connected conductive yarns stretchable up to 300%with almost constant electrical resistance.