The samples were attained through altering the cooling system of producing glass-ceramics. The X-ray diffraction was used to test the stress value of different samples. The relation of the cooling system and internal ...The samples were attained through altering the cooling system of producing glass-ceramics. The X-ray diffraction was used to test the stress value of different samples. The relation of the cooling system and internal stress were also investigated. The experimental results show that the stress of glass-ceramic had a close relation with starting cool temperature. Above 800 ~C, glass-ceramic could be accelerated cooling and did not bring stress. Temperature between 500 ℃ and 800℃ was an important temperature range of the formation of stress in glass-ceramic, in which the glass-ceramic stress would change obviously. Cool system was the key on how to control and eliminate internal stress in order to reduce the destroy of materials crated by internal stress. In addition, glass particles size increase, glass-ceramic stress increase in consequent.展开更多
This paper presents an analytical solution for the thermoelastic stress in a typical in-plane＇s thin-film micro- thermoelectric cooling device under different operating con- ditions. The distributions of the permissi...This paper presents an analytical solution for the thermoelastic stress in a typical in-plane＇s thin-film micro- thermoelectric cooling device under different operating con- ditions. The distributions of the permissible temperature fields in multilayered thin-films are analytically obtained, and the characteristics, including maximum temperature dif- ference and maximum refrigerating output of the thermo- electric device, are discussed for two operating conditions. Analytical expressions of the thermoelastic stresses in the layered thermoelectric thin-films induced by the tempera- ture difference are formulated based on the theory of mul- tilayer system. The results demonstrate that, the geometric dimension is a significant factor which remarkably affects the thermoelastic stresses. The stress distributions in layers of semiconductor thermoelements, insulating and support- ing membrane show distinctly different features. The present work may profitably guide the optimization design of high- efficiency micro-thermoelectric cooling devices.展开更多
The influence of different cooling during heat treatment on microstructure and stress rupture property of DZ951 alloy was investigated by optical microscope, SEM and TEM. The results show that the shape of MC carbide ...The influence of different cooling during heat treatment on microstructure and stress rupture property of DZ951 alloy was investigated by optical microscope, SEM and TEM. The results show that the shape of MC carbide changes from Chinese script in as-cast alloy to small block with different cooling ways. The size of γ′ phase decreases and the shape of γ′ phase changes from cuboid to sphere with the increase of cooling rate. The γ′ phase splits into eight small cuboids when the alloy is cooled by furnace cooling. The stress rupture life of the samples by air cooling is superior to that by other cooling way.展开更多
A local thermal stress model of water-cooled-wall pulverized-coal gasifier was built, and ANSYS was used to simulate the stress field in the gasifier operation to research the damage of refractories and slag layer cau...A local thermal stress model of water-cooled-wall pulverized-coal gasifier was built, and ANSYS was used to simulate the stress field in the gasifier operation to research the damage of refractories and slag layer caused by the thermal stress. The results reveal that:（1） the maximum stress of water-cooled-wall gasifier appears at the interface between anchor nails and refractories as well as the interface between refractories and the slag layer, and the maximum stress of slag layer appears on the surface of the slag layer;（2） the increase of slag layer thickness can significantly reduce the thermal stress at the interface between anchor nails and refractories, but increase the thermal stress between slag layer and refractories;（3） when the therma I conductivity is 2-6 W · m-1 · K-1, the thermal stress increases rapidly with the increase of the thermal conductivity, but when the thermal conductivity is 6-10 W · m-1 · K-1, the thermal stress is basically stable;（4） the higher the cooling rate, the faster the decreasing speed of the temperature and thermal stress.展开更多
借助船级社规范与MATLAB软件,开发可提取浮式生产储卸油装置(Floating Production Storage and Offloading,FPSO)管道任意位置处加速度的程序,以便更好地对FPSO主甲板冷却水管路系统进行应力分析。将该系统任意位置处实际加速度值和FPS...借助船级社规范与MATLAB软件,开发可提取浮式生产储卸油装置(Floating Production Storage and Offloading,FPSO)管道任意位置处加速度的程序,以便更好地对FPSO主甲板冷却水管路系统进行应力分析。将该系统任意位置处实际加速度值和FPSO船体重心处加速度值以均布载荷形式分别施加至管道上,利用CAESARⅡ软件分析在满载工况条件下该系统的应力变化。结果表明,在FPSO满载工况条件下,采用重心处加速度值得到的结果相较于其自身实际加速度值的作用结果会出现应力冗余和应力不足的情况,例如节点50应力增加1.01%,而节点2570应力减小0.19%。展开更多
基金National Natural Science Foundation of China(50272043)Natural Science Foundation of Hubei Province(2002AB077)+1 种基金Natural Science Foundation of Wuhan University of Technology(2003XJJ013)Natural Science Foundation of Key Laboratory of Silicate Materials Science and Engineering of Ministry of Education,Wuhan University of Technology
文摘The samples were attained through altering the cooling system of producing glass-ceramics. The X-ray diffraction was used to test the stress value of different samples. The relation of the cooling system and internal stress were also investigated. The experimental results show that the stress of glass-ceramic had a close relation with starting cool temperature. Above 800 ~C, glass-ceramic could be accelerated cooling and did not bring stress. Temperature between 500 ℃ and 800℃ was an important temperature range of the formation of stress in glass-ceramic, in which the glass-ceramic stress would change obviously. Cool system was the key on how to control and eliminate internal stress in order to reduce the destroy of materials crated by internal stress. In addition, glass particles size increase, glass-ceramic stress increase in consequent.
基金supported by the National Basic Research Program of China(2007CB607506)the Fok Ying-Tong Education Foundation for Young Teachers in the Higher Education Institutions of China(111005)the Foundation for Innovative Research Groups of the National Natural Science Foundation of China(11121202)
文摘This paper presents an analytical solution for the thermoelastic stress in a typical in-plane＇s thin-film micro- thermoelectric cooling device under different operating con- ditions. The distributions of the permissible temperature fields in multilayered thin-films are analytically obtained, and the characteristics, including maximum temperature dif- ference and maximum refrigerating output of the thermo- electric device, are discussed for two operating conditions. Analytical expressions of the thermoelastic stresses in the layered thermoelectric thin-films induced by the tempera- ture difference are formulated based on the theory of mul- tilayer system. The results demonstrate that, the geometric dimension is a significant factor which remarkably affects the thermoelastic stresses. The stress distributions in layers of semiconductor thermoelements, insulating and support- ing membrane show distinctly different features. The present work may profitably guide the optimization design of high- efficiency micro-thermoelectric cooling devices.
文摘The influence of different cooling during heat treatment on microstructure and stress rupture property of DZ951 alloy was investigated by optical microscope, SEM and TEM. The results show that the shape of MC carbide changes from Chinese script in as-cast alloy to small block with different cooling ways. The size of γ′ phase decreases and the shape of γ′ phase changes from cuboid to sphere with the increase of cooling rate. The γ′ phase splits into eight small cuboids when the alloy is cooled by furnace cooling. The stress rupture life of the samples by air cooling is superior to that by other cooling way.
文摘A local thermal stress model of water-cooled-wall pulverized-coal gasifier was built, and ANSYS was used to simulate the stress field in the gasifier operation to research the damage of refractories and slag layer caused by the thermal stress. The results reveal that:（1） the maximum stress of water-cooled-wall gasifier appears at the interface between anchor nails and refractories as well as the interface between refractories and the slag layer, and the maximum stress of slag layer appears on the surface of the slag layer;（2） the increase of slag layer thickness can significantly reduce the thermal stress at the interface between anchor nails and refractories, but increase the thermal stress between slag layer and refractories;（3） when the therma I conductivity is 2-6 W · m-1 · K-1, the thermal stress increases rapidly with the increase of the thermal conductivity, but when the thermal conductivity is 6-10 W · m-1 · K-1, the thermal stress is basically stable;（4） the higher the cooling rate, the faster the decreasing speed of the temperature and thermal stress.
文摘借助船级社规范与MATLAB软件,开发可提取浮式生产储卸油装置(Floating Production Storage and Offloading,FPSO)管道任意位置处加速度的程序,以便更好地对FPSO主甲板冷却水管路系统进行应力分析。将该系统任意位置处实际加速度值和FPSO船体重心处加速度值以均布载荷形式分别施加至管道上,利用CAESARⅡ软件分析在满载工况条件下该系统的应力变化。结果表明,在FPSO满载工况条件下,采用重心处加速度值得到的结果相较于其自身实际加速度值的作用结果会出现应力冗余和应力不足的情况,例如节点50应力增加1.01%,而节点2570应力减小0.19%。
