Effect of process parameters on the morphology of aluminum/copper alloy lap joints by red and blue hybrid laser welding

In order to overcome the problems of many pores,large deformation and unstable weld quality of traditional laser welded aluminumcopper alloy joints,a red-blue dual-beam laser source and a swinging laser were introduced for welding.T2 copper and 6063 aluminum thin plates were lap welded by coaxial dual-beam laser welding.The morphology of weld cross section was compared to explore the influence of process parameters on the formation of lap joints.The microstructure characteristics of the weld zone were observed and compared by optical microscope.The results show that the addition of laser beam swing can eliminate the internal pores of the weld.With the increase of the swing width,the weld depth decreases,and the weld width increases first and then decreases.The influence of welding speed on the weld cross section morphology is similar to that of swing width.With the increase of welding speed,the weld width increases first and then decreases,while the weld depth decreases all the time.This is because that the red laser is used as the main heat source to melt the base metals,with the increase of red laser power,the weld depth increases.As an auxiliary laser source,blue laser reduces the total energy consumption,consequently,the effective heat input increases and the spatter is restrained effectively.As a result,the increase of red laser power has an enhancement effect on the weld width and weld depth.When the swing width is 1.2 mm,the red laser power is 550 W,the blue laser power is 500 W,and the welding speed is 35 mm/s,the weld forming is the best.The lap joint of T2 copper and 6063 aluminum alloy thin plate can be connected stably with the hybrid of blue laser.The effect rules of laser beam swing on the weld formation were obtained,which improved the quality of the joints.

Numerical simulation of temperature field in horizontal core-filling continuous casting for copper cladding aluminum rods

The steady-state temperature field of horizontal core-filling continuous casting （HCFC） for producing copper cladding aluminum rods was simulated by finite element method to investigate the effects of key processing parameters on the positions of solid-liquid interfaces （SLIs） of copper and aluminum. It is found that mandrel tube length and mean withdrawing speed have significant effects on the SLI positions of both copper and aluminum. Aluminum casting temperature （TAI） （1003-1123 K） and secondary cooling water flux （600-900 L.h-1） have little effect on the SLI of copper but cause the SLI of aluminum to move 2-4 mm. When TA1 is in a range of 1043-1123 K, the liquid aluminum can fill continuously into the pre-solidified copper tube. Based on the numerical simulation, reasonable processing parameters were determined.

Microstructures and properties analysis of dissimilar metal joint in the friction stir welded copper to aluminum alloy

This paper mainly concentrated on the feasibility of friction stir welding of dissimilar metal of aluminum alloy to copper （I2） and a preliminary analysis of welding parameters influencing on the microstructures and properties of joint was carried out. The results indicated that the thickness of workpiece played an important role in the welding parameters which could succeed in the friction stir welding of dissimilar metal of copper to aluminum alloy, and the parameters were proved to be a narrow choice. The interfacial region between copper and aluminum in the dissimilar joint was not uniformly mixed, constituted with part of incomplete mixing zone, complete mixing zone, dispersion zone and the most region＇ s boundary was obvious. Meantime a kind banded structure with inhomogeneous width was formed. The intermetallic compounds generated during friction stir welding in the interfacial region were mainly CugAl4, Al2Cu etc, and their hardness was higher than oihers.

Microstructure of aluminum/copper clad composite fabricated by casting-cold extrusion forming

An aluminum/copper clad composite was fabricated by the casting-cold extrusion forming technology and the microstructures of the products were observed and analyzed.It is found that aluminum grains at the interface are refined in the radial profiles of cone-shaped deformation zone,but the grains in the center maintain the original state and the grain size is non-uniform.A clear boundary presents between the refined area and center area.In contrast,the copper grains in the radial profiles have been significantly refined.In the center area of the copper,the grains are bigger than those at the boundary.On the surface of the deformable body,the grain size is the smallest,but with irregular grain morphology.After the product is entirely extruded,all the copper and aluminum grains are refined with small and uniform morphology.In the center area,the average diameter of aluminum grains is smaller than 5 μm,and the copper grain on the surface is about 10 μm.At the interface,the grain size is very small,with a good combination of copper and aluminum.The thickness of interface is in the range of 10-15 μm.Energy spectrum analysis shows that CuAl3 phase presents at the interface.

Cu-Al interfacial compounds and formation mechanism of copper cladding aluminum composites

Copper cladding aluminum(CCA)rods with the section dimensions of12mm in diameter and2mm in sheath thickness were fabricated by vertical core-filling continuous casting(VCFC)technology.The kinds and morphology of interfacial intermetallic compounds(IMCs)were investigated by SEM,XRD and TEM.The results showed that the interfacial structure of Cu/Al was mainly composed of layeredγ1(Cu9Al4),cellularθ(CuAl2),andα(Al)+θ(CuAl2)phases.Moreover,residual acicularε2(Cu3Al2+x)phase was observed at the Cu/Al interface.By comparing the driving force of formation forε2(Cu3Al2+x)andγ1(Cu9Al4)phases,the conclusion was drawn that theε2(Cu3Al2+x)formed firstly at the Cu/Al interface.In addition,the interfacial formation mechanism of copper cladding aluminum composites was revealed completely.

Orthogonal tests of copper-clad aluminum bimetal continuous casting by nitrogen pressure core-illing

To provide theoretical basis and practical guidance for preparing composite rods by direct continuous casting, copper-clad aluminum composite rods of external copper layer diameter 12 mm and inner aluminum core diameter 8 mm were manufactured. Orthogonal tests consisted of three factors and three levels were carried out to research the effects of melting copper temperature, continuous casting speed and nitrogen pressure on the performance of composite rods. Results showed that nitrogen pressure is the most important factor in influencing the surface quality; continuous casting speed is the most important factor in influencing copper & aluminum inter diffusion amount. Nitrogen pressure can noticeably improve the surface quality and make the rods easily be drawn out, but the surface quality does not show visible improvement when the nitrogen pressure is above 0.05 MPa. Measured by tests, the compound layer can be divided into three types according to its cladding layer degree: deficient cladding, normal cladding and excess cladding. The diameter of normal copper-clad aluminum composite rods can be successfully drawn less than 0.6 mm without annealing.

Vision-based detection of weld pool width in TIG welding of copper-clad aluminum cable

In order to realize automatic control of the width of weld pool, a visual sensor system for the width of weld pool detection is developed. By initiative arc light, the image of copper plate weld pool is taken back of the torch through the process of weakening and filtering arc light. In order to decrease the time of processing video signals, analog circuit is applied in the processing where video signals is magnified, trimmed and processed into binary on the datum of dynamic average value, therefore the waveform of video signals of weld pool is obtained. The method that is used for detecting the width of weld pool is established. Results show that the vision sensing method for real-time detecting weld pool width to copper-clad aluminum wire TIG welding is feasible. The response cycle of this system is no more than 50 ms, and the testing precision is less than 0. 1 mm.

Effect of equal-channel angular pressing on pitting corrosion resistance of anodized aluminum-copper alloy

The effect of equal-channel angular pressing(ECAP) on the pitting corrosion resistance of anodized Al-Cu alloy was investigated by electrochemical techniques in a solution containing 0.2 mol/L AlCl3 and also by surface analysis.Anodizing was conducted for 20 min at 200 and 400 A/m2 in a solution containing 1.53 mol/L H2SO4 and 0.018 5 mol/L Al2(SO4)3·16H2O at 20 ℃.Anodized Al-Cu alloy was immediately dipped in boiling water for 20 min to seal the micro pores present in anodic oxide films.The time required before initiating pitting corrosion of anodized Al-Cu alloy is longer with ECAP than without,indicating that ECAP process improves the pitting corrosion resistance of anodized Al-Cu alloy.Second phase precipitates such as Si,Al-Cu-Mg and Al-Cu-Si-Fe-Mn intermetallic compounds are present in Al-Cu alloy and the size of these precipitates is greatly decreased by application of ECAP.Al-Cu-Mg intermetallic compounds are dissolved during anodization,whereas the precipitates composed of Si and Al-Cu-Si-Fe-Mn remain in anodic oxide films due to their more noble corrosion potential than Al.FE-SEM and EPMA observation reveal that the pitting corrosion of anodized Al-Cu alloy occurs preferentially around Al-Cu-Si-Fe-Mn intermetallic compounds,since the anodic oxide films are absent at the boundary between the normal oxide films and these impurity precipitates.The improvement of pitting corrosion resistance of anodized Al-Cu alloy processed by ECAP appears to be attributed to a decrease in the size of precipitates,which act as origins of pitting corrosion.

Effect of continuous induction annealing on the microstructure and mechanical properties of copper-clad aluminum flat bars

Copper-clad aluminum （CCA） flat bars produced by the continuous casting-rolling process were subjected to continuous induction heating annealing （CIHA）, and the effects of induction heating temperature and holding time on the microstructure, interface, and mechanical properties of the fiat bars were investigated. The results showed that complete recrystallization of the copper sheath occurred under CIHA at 460℃ for 5 s, 480℃ for 3 s, or 500℃ for 1 s and that the average grain size in the copper sheath was approximately 10.0 μm. In the case of specimens subjected to CIHA at 460-500℃ for longer than 1 s, complete recrystallization occurred in the aluminum core. In the case of CIHA at 460-500℃ for 1-5 s, a continuous interracial layer with a thickness of 2.5-5.5 μm formed and the thickness mainly increased with increasing annealing temperature. After CIHA, the interracial layer consisted primarily of a Cu9A14 layer and a CuA12 layer; the average interface shear strength of the CCA flat bars treated by CIHA at 460-500℃ for 1-5 s was 45-52 MPa. After full softening annealing, the hardness values of the copper sheath and the aluminum core were HV 65 and HV 24, respectively, and the hardness along the cross section of the CCA flat bar was uniform.

Effect of preparation methods of aluminum emulsions on catalytic performance of copper-based catalysts for methanol synthesis from syngas

Various Cu/ZnO/Al2O3 catalysts have been synthesized by different aluminum emulsions as aluminum sources and their pertormances tor methanol synthesis from syngas have been investigated. The influences of preparation methods of aluminum emulsions on physicochemical and catalytic properties of catalysts were studied by XRD, SEM, XPS,N2 adsorption-desorption techniques and methanol synthesis from syngas. The preparation methods of aluminum emulsions were found to influence the catalytic activity, CuO crystallite size, surface area and Cu0 surface area and reduction process. The results show that the catalyst CN using the aluminum source prepared by addition the ammonia into the aluminum nitrate （NP） exhibited the best catalytic performance for methanol synthesis from syngas.

Manufacturing process and microstructure of copper-coated aluminum wires

Copper-coated aluminum wires exhibit good electrical conductivity, high thermal conductivity, low contact resistance of copper and low density, and provide economic advantages over aluminum. However, there are some problems in the manufacring processes of hot-dip copper-coated aluminum wires, such as the difficulties in controlling coating process. In this work, the hot-dip copper-coating method of aluminum wires was investigated for producing copper-coated aluminum wire composites. The interface microstructure between the aluminum wire and the copper coating layer was analyzed by scanning electron microscopy （SEM） and energy-dispersive X-ray spec- trometry （EDS）. Five different fluxing agents were tested. Experimental results show that appropriate conditions for the hot-dip process are determined as the liquid copper temperature of 1085℃ and the treatment time less than 1 s. A success in hot-dip copper-coated aluminum wires is achieved by hot-dipping a low-melting-point metal into a high-melting-point metal liquid, which is significant for the further devel- opment and application of copper-coated aluminum wire composites.

Analysis of Laser Micro Welding of Copper-Aluminum Dissimilar Metals and Its Mechanism

Micro welding of dissimilar metals can meet many performance requirements for modern engineering structures. In this experiment, laser micro welding of copper-aluminum dissimilar metals was conducted with an HWLW-300A energy negative feedback Nd:YAG pulse laser. By using the overlap welding method with copper on aluminum, with the laser energy being distributed unevenly, good weld joints were obtained. In this paper, the welding mechanism was analyzed from aspects such as welding temperature and the specific heat capacity of the solid metal. Existing defects were identified, and a feasible improvement scheme was proposed.

Fabrication of Superhydrophobic Surfaces on Aluminum Alloy Via Electrodeposition of Copper Followed by Electrochemical Modification

Superhydrophobic aluminum surfaces have been prepared by means of electrodeposition of copper on aluminum surfaces, followed by electrochemical modification using stearic acid organic molecules. Scanning electron microscopy(SEM) images show that the electrodeposited copper films follow "island growth mode" in the form of microdots and their number densities increase with the rise of the negative deposition potentials. At an electrodeposition potential of-0.2 V the number density of the copper microdots are found to be 4.5×104cm^(-2)that are increased to 2.9×105cm^(-2)at a potential of-0.8 V. Systematically, the distances between the microdots are found to be reduced from 26.6 μm to 11.03 μm with the increase of negative electrochemical potential from-0.2 V to-0.8 V. X-ray diffraction(XRD) analyses have confirmed the formation of copper stearate on the stearic acid modified copper films. The roughness of the stearic acid modified electrodeposited copper films is found to increase with the increase in the density of the copper microdots. A critical copper deposition potential of-0.6 V in conjunction with the stearic acid modification provides a surface roughness of 6.2 μm with a water contact angle of 157?, resulting in superhydrophobic properties on the aluminum substrates.

Thick Target Neutron Production on Aluminum and Copper by 40 MeV Deuterons

The thick target neutron yields （TTNYs） of deuteron-induced reaction on AI and Cu isotopes are analyzed by combining the improved nuclear models and particle transport effects. The modified Glauber model is employed mainly to produce the peak of double differential cross section for the breakup process, and the exciton model and the Hauser-Feshbach theory are used for the statistical processes. The thin-layer accumulation method is used to calculate the TTNYs considering the neutron attenuation effects in the target. The calculated results are compared with the existing experimental data, and the analysis method can predict the TTNY data well at the deuteron energy of 40 MeV.

增强体表面改性在高导热金属基复合材料中的应用

随着电子技术的高速发展和电子器件的更新换代,电子封装材料的性能需求越来越高。金属基复合材料,尤其是铝基和铜基复合材料具有高导热、低膨胀、高稳定性等特点,是具有广阔应用前景的电子封装材料。然而,金刚石、石墨烯、硅等增强体与基体的润湿性差,或者在高温下与基体发生有害的界面反应,限制了此类高导热金属基复合材料的开发和应用。本文简述了金属基复合材料的界面研究进展,结合影响金属基复合材料界面结合的因素,提出了几种改善界面结合的方法。增强体表面改性是改善金属基复合材料界面的重要途径之一,常用工艺有磁控溅射法、化学气相沉积法、溶胶凝胶法、化学镀法等;最后,对增强体表面改性在高热导金属基复合材料中的应用进行分析和展望。

铝粉还原污酸中砷新工艺研究

由于硫化精矿中砷含量越来越高,致使烟气处理过程产生的污酸中砷含量也越来越高,同时污酸中含有铜、铁等有价金属。目前污酸除砷方法多以除砷为目的,形成的含砷渣属于危废,还需要二次处理。本研究研发了还原除砷新工艺,首先向污酸中加入硫化砷渣进行脱铜预处理并回收铜,然后用铝粉还原脱铜后液中的砷回收砷,最后向脱砷液中加入硫酸钾回收铝,还原后液回收还原剂后采用两段中和法处理。试验研究结果表明,在加入铜离子摩尔量1.1倍的硫化砷渣、反应温度85℃、反应时间3 h的条件下,污酸中的铜含量由2000 mg/L降至196 mg/L,硫化铜渣返熔炼配料系统;在还原温度70℃、还原时间2 h,还原剂用量1.8倍的条件下,砷的还原率大于96%,还原后液中的砷含量低于300 mg/L,得到的砷渣品位大于95%,可用于后续制备高品位单质砷;在硫酸钾用量1.1倍、反应温度常温、反应时间2 h的条件下,溶液含铝3.6 g/L,得到的明矾可达到《工业硫酸铝钾》(HG/T2565—2007)一等品标准。该方法除砷效果好,且能将污酸中的砷转变为具有经济价值的砷产品,还不会产生硫化氢气体,具有应用推广价值。

铜/铝双金属固-液复合工艺研究

采用冲击射流固-液复合法制备铜/铝复合材料,预先在铜基体表面进行预处理,在浇注过程中改变铜基体的移动速度,使铝液与铜基体产生不同程度强化换热作用。利用SEM、XRD、EDS检测分析了铜/铝复合层成分与组织变化规律,用万能力学试验机测量其结合强度,显微硬度分析复合层的硬度分布。试验表明:浇注温度720℃时,随着铜基体移动速度升高,铝液对铜基体冲击射流换热量降低,复合层由Cu/Al金属间化合物组成。镀镍层使得铝液在铜基体表面产生润湿、漫流、保护作用,促进固-液界面形成冶金结合,有效提升了铜/铝复合材料的结合强度。试样在浇注温度720℃、铜基体移动速15 mm/s时,测得界面结合强度为24.8 MPa。

含碳Cu-Zn-Al乙炔选择性加氢催化剂制备及性能

采用共沉淀法制备不同Cu/Zn摩尔比铜-锌-铝水滑石前体,焙烧后经过乙炔预处理和H_(2)还原得到Cu_(m)Zn_(3-m)Al-LDO(T140-R150)催化剂(m取值为1、1.5、2、3)。对上述含碳铜-锌-铝催化剂进行N_(2)物理吸附、X射线衍射、扫描电子显微镜和透射电镜表征,研究其在大量乙烯存在时乙炔选择性加氢反应中的催化性能。结果表明:在铜-铝水滑石中引入锌,可提高前体中铜的分散度,有利于碳化铜(Cu_(x)C)加氢活性相的生成,提高乙炔选择性加氢反应的性能。催化剂最佳制备条件为:Cu/Zn摩尔比1,乙炔处理温度140℃,乙炔处理时间2 h,氢气还原温度150℃,氢气还原时间3 h。在温度100℃和压力0.1 MPa条件下,Cu_(1.5)Zn_(1.5)Al-LDO(T140-R150)催化乙炔选择性加氢反应的乙炔转化率达100%,乙烯选择性为53.9%,C4选择性为15.5%,乙烷选择性为30.6%。

基于扫频电阻法的变压器绕组材质辨识方法及实验验证

变压器生产中“以铝代铜”现象危害电力系统运行安全,为了简单有效地辨别变压器绕组材质,提出了一种基于扫频电阻法的辨识方法和实验方案,并根据该方案搭建了一套变压器绕组材质检测系统。首先对基于扫频电阻法的辨识方法进行了相关理论推导和证明,之后对基于该方法的检测系统性能进行了测试,最后对不同类型变压器进行了实验验证。实验结果表明该方法能够快速高效地辨别变压器绕组材质,具有较高的工程实用价值。

Cu对铝/钢CMT熔钎焊接头界面区组织的影响研究

采用冷金属过渡方法,以AlSi5焊丝为填充金属,在5052铝合金和镀锌钢板之间添加铜箔片进行搭接熔钎焊,使用扫描电子显微镜结合能谱分析和拉伸试验机对接头的界面区组织与性能进行研究。结果表明,未加入铜箔时,界面区组织主要由FeAl_(3)金属间化合物组成;铜箔的加入使得界面区组织中新生成了CuAl_(2)金属间化合物,同时改善了Zn在界面区的分布。Zn固溶于Al中,一定程度上抑制了Fe-Al金属间化合物产生。加入铜箔后的试样断裂位置发生改变,接头的承载能力与未加入铜箔的相近。