Preventing formation of intermetallic compounds in ultrasonic-assisted Sn soldering of Mg/Al alloys through pre-plating a Ni coating layer on the Mg substrate

Magnesium and aluminum alloys are widely used in various industries because of their excellent properties,and their reliable connection may increase application of materials.Intermetallic compounds(IMCs)affect the joint performance of Mg/Al.In this study,AZ31 Mg alloy with/without a nickel(Ni)coating layer and 6061 Al alloy were joined by ultrasonic-assisted soldering with Sn-3.0Ag-0.5Cu(SAC)filler.The effects of the Ni coating layer on the microstructure and mechanical properties of Mg/Al joints were systematically investigated.The Ni coating layer had a significant effect on formation of the Mg_(2)Sn IMC and the mechanical properties of Mg/Al joints.The blocky Mg_(2)Sn IMC formed in the Mg/SAC/Al joints without a Ni coating layer.The content of the Mg_(2)Sn IMC increased with increasing soldering temperature,but the joint strength decreased.The joint without a Ni coating layer fractured at the blocky Mg_(2)Sn IMC in the solder,and the maximum shear strength was 32.2 MPa.By pre-plating Ni on the Mg substrate,formation of the blocky Mg_(2)Sn IMC was inhibited in the soldering temperature range 240–280℃and the joint strength increased.However,when the soldering temperature increased to 310℃,the blocky Mg_(2)Sn IMC precipitated again in the solder.Transmission electron microscopy showed that some nano-sized Mg_(2)Sn IMC and the(Cu,Ni)_(6)Sn_(5)phase formed in the Mg(Ni)/SAC/Al joint soldered at 280℃,indicating that the Ni coating layer could no longer prevent diffusion of Mg into the solder when the soldering temperature was higher than 280℃.The maximum shear strength of the Mg(Ni)/SAC/Al joint was 58.2 MPa for a soldering temperature of 280℃,which was 80.7%higher than that of the Mg/SAC/Al joint,and the joint was broken at the Mg(Ni)/SAC interface.Pre-plating Ni is a feasible way to inhibit formation of IMCs when joining dissimilar metals.

A review of soldering by localized heating

In recent years,the rapid development of the new energy industry has driven continuous upgrading of high-density and high-power devices.In the packaging and assembly process,the problem of differentiation of the thermal needs of different modules has become increasingly prominent,especially for small-size solder joints with high heat dissipation in high-power devices.Localized soldering is con-sidered a suitable choice to selectively heat the desired target while not affecting other heat-sensitive chips.This paper reviews several local-ized soldering processes,focusing on the size of solder joints,soldering materials,and current state of the technique.Each localized solder-ing process was discovered to have unique characteristics.The requirements for small-size solder joints are met by laser soldering,microres-istance soldering,and self-propagating soldering;however,laser soldering has difficulty meeting the requirements for large heat dissipation,microresistance soldering requires the application of pressure to joints,and self-propagating soldering requires ignition materials.However,for small-size solder junctions,selective wave soldering,microwave soldering,and ultrasonic soldering are not appropriate.Because the magnetic field can be focused on a tiny area and the output energy of induction heating is large,induction soldering can be employed as a significant trend in future research.

A comprehensive review of radiation effects on solder alloys and solder joints

In the realm of military and defence applications, exposure to radiation significantly challenges the performance and reliability of solder alloys and joints in electronic systems. This comprehensive review examines radiation-induced effects on solder alloys and solder joints in terms of microstructure and mechanical properties. In this paper, we evaluate the existing literature, including experimental studies and fundamental theory, to provide a comprehensive overview of the behavior of solder materials under radiation. A review of the literature highlights key mechanisms that contribute to radiation-induced changes in the microstructure, such as the formation of intermetallic compounds, grain growth,micro-voids and micro-cracks. Radiation is explored as a factor influencing solder alloy hardness,strength, fatigue and ductility. Moreover, the review addresses the challenges and limitations inherent in studying the effects of radiation on solder materials and offers recommendations for future research. It is crucial to understand radiation-induced effects on solder performance to design robust and radiationresistant electronic systems. A review of radiation effects on solder materials and their applications in electronics serves as a valuable resource for researchers, engineers, and practitioners in that field.

A review of extreme condition effects on solder joint reliability:Understanding failure mechanisms

Solder joint,crucial component in electronic systems,face significant challenges when exposed to extreme conditions during applications.The solder joint reliability involving microstructure and mechanical properties will be affected by extreme conditions.Understanding the behaviour of solder joints under extreme conditions is vital to determine the durability and reliability of solder joint.This review paper aims to comprehensively explore the underlying failure mechanism affecting solder joint reliability under extreme conditions.This study covers an in-depth analysis of effect extreme temperature,mechanical stress,and radiation conditions towards solder joint.Impact of each condition to the microstructure including solder matrix and intermetallic compound layer,and mechanical properties such as fatigue,shear strength,creep,and hardness was thoroughly discussed.The failure mechanisms were illustrated in graphical diagrams to ensure clarity and understanding.Furthermore,the paper highlighted mitigation strategies that enhancing solder joint reliability under challenging operating conditions.The findings offer valuable guidance for researchers,engineers,and practitioners involved in electronics,engineering,and related fields,fostering advancements in solder joint reliability and performance.

Industrial Fusion Cascade Detection of Solder Joint

With the remarkable advancements in machine vision research and its ever-expanding applications,scholars have increasingly focused on harnessing various vision methodologies within the industrial realm.Specifically,detecting vehicle floor welding points poses unique challenges,including high operational costs and limited portability in practical settings.To address these challenges,this paper innovatively integrates template matching and the Faster RCNN algorithm,presenting an industrial fusion cascaded solder joint detection algorithm that seamlessly blends template matching with deep learning techniques.This algorithm meticulously weights and fuses the optimized features of both methodologies,enhancing the overall detection capabilities.Furthermore,it introduces an optimized multi-scale and multi-template matching approach,leveraging a diverse array of templates and image pyramid algorithms to bolster the accuracy and resilience of object detection.By integrating deep learning algorithms with this multi-scale and multi-template matching strategy,the cascaded target matching algorithm effectively accurately identifies solder joint types and positions.A comprehensive welding point dataset,labeled by experts specifically for vehicle detection,was constructed based on images from authentic industrial environments to validate the algorithm’s performance.Experiments demonstrate the algorithm’s compelling performance in industrial scenarios,outperforming the single-template matching algorithm by 21.3%,the multi-scale and multitemplate matching algorithm by 3.4%,the Faster RCNN algorithm by 19.7%,and the YOLOv9 algorithm by 17.3%in terms of solder joint detection accuracy.This optimized algorithm exhibits remarkable robustness and portability,ideally suited for detecting solder joints across diverse vehicle workpieces.Notably,this study’s dataset and feature fusion approach can be a valuable resource for other algorithms seeking to enhance their solder joint detection capabilities.This work thus not only presents a novel and effective solution for industrial solder joint detection but lays the groundwork for future advancements in this critical area.

Effect of Mo and ZrO_(2)nanoparticles addition on interfacial properties and shear strength of Sn58Bi/Cu solder joint

The influence of Mo and ZrO_(2)nanoparticles addition on the interfacial properties and shear strength of Sn58Bi solder joint was investigated.The interfacial microstructures of Sn58Bi/Cu,Sn58Bi+Mo/Cu and Sn58Bi+ZrO_(2)/Cu solder joints were analysed using a scanning electron microscope(SEM)coupled with energy dispersive X-ray(EDX)and the X-ray diffraction(XRD).Intermetallic compounds(IMCs)of MoSn_(2)are detected in the Sn58Bi+Mo/Cu solder joint,while SnZr,Zr_(5)Sn_(3),ZrCu and ZrSn_(2)are detected in Sn58Bi+ZrO_(2)/Cu solder joint.IMC layers for both composite solders comprise of Cu_(6)Sn_(5) and Cu_(3)Sn.The SEM images of these layers were used to measure the IMC layer’s thickness.The average IMC layer’s thickness is 1.4431μm for Sn58Bi+Mo/Cu and 0.9112μm for Sn58Bi+ZrO_(2)/Cu solder joints.Shear strength of the solder joints was investigated via the single shear lap test method.The average maximum load and shear stress of the Sn58Bi+Mo/Cu and Sn58Bi+ZrO_(2)/Cu solder joints are increased by 33%and 69%,respectively,as compared to those of the Sn58Bi/Cu solder joint.By comparing both composite solder joints,the latter prevails better as adding smaller sized ZrO_(2)nanoparticles improves the interfacial properties granting a stronger solder joint.

Microstructure evolution and mechanical properties of ultrasonic-assisted soldering joints of 2024 aluminum alloys

Ultrasonic-assisted soldering of 2024 aluminum alloys using a filler metal of Zn-5Al alloy was investigated at the temperature of 400 ℃,which is lower than the solution strengthening temperature of Al-Cu alloys.The ultrasonic vibration with power of 200 W and vibration amplitude of 15 μm at the frequency of 21 kHz was applied on the top samples.The ultrasonic vibration promoted the dissolution of Al elements in the base metal.The reduction of volume fraction of the eutectic phases in the bonds was investigated by increasing ultrasonic vibration time.As the ultrasonic vibration time increased from 3 s to 30 s,the volume fraction of the eutectic phase in the bonds decreased from 12.9% to 0.9%,and the shear strength of the joints was up to 149-153 MPa,increased by 20%.The improvement of the mechanical properties of joints was discussed based on the modulus and hardness of the phases in the bonds and the fracture of the joints.

Diode Laser Soldering Technology of Fine Pitch QFP Devices

The laser provides a controllable means of supplying localized energy for solder joint formation and is a valuable tool in electronics manufacture.Diode laser soldering for fine pitch QFP devices were carried out with Sn-Ag-Cu lead-free solder and Sn-Pb solder respectively,and the mechanical properties of micro-joints of the QFP devices were tested and studied by STR-1000 micro-joints tester.The results indicate that sound QFP micro-joints without bridging or solder ball are gained by means of diode laser soldering method with appropriate laser processing parameters,and the pitch of the QFP devices is as fine as to 0.4mm.Tensile strength of QFP micro-joints increases gradually with the increase of laser output power,the maximum tensile strength presents when the laser output power increase to a certain value.The results also indicate that the mechanical properties of QFP micro-joints soldered by diode laser soldering system are better than those of QFP micro-joints soldered by IR reflow soldering method.The experimental results may provide a theory guide for investigation of diode laser soldering.

FORMATION AND CHANGE OF AuSn_4 COMPOUNDS AT INTERFACE BETWEEN PBGA SOLDER BALL AND Au/Ni/Cu METALLIZATION DURING LASER AND INFRA-RED REFLOW SOLDERING

Interactions between 63Sn37Pb solder and PBGA metallization (Au/Ni/Cu) duringlaser and infrared reflow soldering were studied. During laser reflow soldering process,a thin layer of AuSn_4 was observed at the interface of the solder bumps, its morphologywas strongly dependent on the laser reflow power and heating time. The solder bumpsformed by the first laser reflow was reflowed again to form the solder joints. TheAuSn_4 compounds formed in the first laser reflow process dissolved into the bulk solderafter the secondary infrared reflow process. The needle-like AuSn_4 changed into rod-like, and distributed inside the solder near the solder/pad interface.

Microstructure evolution and mechanical properties of the Sip/Zn- Al composite joints by ultrasonic-assisted soldering in air

Hypereutectic Al -27Si alloys were joined without flux by ultrasonic-assisted soldering at 420 ℃ in air using Zn -5Al the filler alloys, and Si particulate-reinforced Zn - Al based composites filler joints were obtained. The ultrasonic vibration introduced into soldering could influence the migration of Si particles and the microstructure of solidified Zn - Al based alloys. Both the distribution of Si particles and microstructure of the solidified Zn - Al based alloys affected the shear strength of joints. The shear strength increased with the ultrasonic vibration time. The highest average shear strength of joints reached to -68.5 MPa. Transcrystalline rupture mode was observed on the fracture surface.

Mg_(2)Sn-induced whisker growth on the surfaces of Mg/Sn/Mg ultrasonic-assisted soldering joints

In this paper,the phenomena of Mg_(2)Sn-induced Sn whisker growth were explored on the surfaces of Mg/Sn/Mg ultrasonic-assisted soldering joints after aging treatment.The in-situ observation and thermal analysis confirmed that the formation and the corrosion of Mg_(2)Sn nanoparticles were the dominant reason of Sn whisker growth.The Mg_(2)Sn accumulation at the grain boundaries would pin the dislocation slip and affect the continuity of whisker growth,and the boundary angle would thus play a decisive role in the growth shape of Sn whiskers due to the pining effect of Mg_(2)Sn.This study might be conducive to elucidating the growth behavior of Sn whiskers and provide the exploration strategy to further improve the bonding strength of Mg/Sn/Mg ultrasonic-assisted soldering joints.

Significant Inhibition of IMCs Growth between an Electroless Ni-W-P Metallization and SAC305 Solder During Soldering and Aging

The formation and growth behavior of intermetallic compound(IMC) layers after introducing an electroless Ni-W-P metallization into the Sn-3.0Ag-0.5Cu(SAC305) solder joint during soldering and aging were investigated. The soldering was performed at 250 ℃ for 10 min, followed by air cooling and aging treatment at 150 ℃ up to 15 days. The results show that the scallop-like Cu_6Sn_5 IMC layer and planar-like Cu_3Sn formed between solder and Cu substrate during soldering and aging. The Ni_3P and(Ni,Cu)_3Sn_4 compounds were formed between electroless Ni-W-P layer and solder, and Cu substrate was not damaged and kept a smooth interface. When the isothermal aging treatment was applied, the total thickness of IMCs which formed at the SAC305/Cu and SAC305/Ni-W-P/Cu interface increased with increasing aging time. Kirkendall voids emerged at the Cu_3Sn and the Ni_3P layers, but the voids emerged at the Ni_3P layer in the form of crack. The amount of Kirkendall voids increased and the crack elongated with increasing aging time. The Cu_6Sn_5 and(Ni,Cu)_3Sn_4grains grew by merging adjacent grains. In the process of growth, the growing interfacial compounds filled the free space, and new columnar dendrite grain of(Ni,Cu)_3Sn_4 constantly generated during aging treatment. After 15 days aging, the Ni-W-P barrier layer was still remained, which indicated that the Ni-W-P layer can be a good barrier layer between the solder alloys and Cu substrate.

Interfacial microstructure evolution and mechanical properties of Al/Sn joints by ultrasonic-assisted soldering

Soldering aluminum alloys at low temperature have great potential to avoid softening of base metals.Pure Al was solderedwith pure tin assisted by ultrasound.The influence of primaryα(Al)on the microstructure of Al/Sn interface and its bonding strengthwas studied.It is found that the primaryα(Al)in liquid tin tends to be octahedron enclosed by Al{111}facet with the lowest surfacefree energy and growth rate.The ultrasonic action could increase the nucleation rate and refine the particles of primaryα(Al).For thelonger ultrasonic and holding time,a large amount of the octahedral primaryα(Al)particles crystallize at the Al/Sn interface.Thebonding interface exhibits the profile of rough dentation,resulting in an increment of bonding interface area and the effect ofmechanical occlusion.The bonding strength at interface could reach63MPa with ultrasonic time of40s and holding time of10min.

Mechanism of die soldering during aluminum die casting

Soldering is a unique casting defect associated with die casting or metal mold casting of aluminum al oys. It occurs when molten aluminum sticks or solders the surface of the die steel and remains there after the ejection of the casting, causing a surface defect and dimensional inaccuracy of the castings and increased machine downtime. Soldering occurs easily when a bare die steel mold is used for die casting of aluminum al oys. When molten aluminum comes in contact with the die steel at a temperature higher than a critical temperature, the iron and aluminum atoms diffuse into each other, forming a series of intermetallic phases and a liquid aluminum-rich fcc phase. This liquid phase exists between intermetal ic phases. On cooling, the liquid fcc phase solidiifes on the intermetal ic phases and grows into the casting, resulting in soldering. The critical temperature is the eutectic temperature near the aluminum corner of the phase diagram. If the die is protected using a nonreactive ceramic coating, soldering starts at locations where local coating failure occurs. Molten aluminum comes into contact with die steel through the coating failure locations and eats into the steel matrix, forming smal pits. As these smal pits grow, the coating is gradual y removed and soldering becomes more severe. Details of die soldering step on a bare steel die and on a coated die material are discussed.

Direct active soldering of Al_(0.3)CrFe _(1.5)MnNi_(0.5) high entropy alloy to 6061-Al using Sn-Ag-Ti active solder

Al0.3CrFe1.5MnNi0.5 high entropy alloys(HEA)have special properties.The microstructures and shear strengths of HEA/HEA and HEA/6061-Al joints were determined after direct active soldering(DAS)in air with Sn3.5Ag4Ti active filler at 250°C for 60 s.The results showed that the diffusion of all alloying elements of the HEA alloy was sluggish in the joint area.The joint strengths of HEA/HEA and HEA/6061-Al samples,as analyzed by shear testing,were(14.20±1.63)and(15.70±1.35)MPa,respectively.Observation of the fracture section showed that the HEA/6061-Al soldered joints presented obvious semi-brittle fracture characteristics.

Effect of Bismuth Addition on Structure and Mechanical Properties of Tin-9Zinc Soldering Alloy

Sn-Zn based solder is a possible replacement of Pb solder because of its better mechanical properties. The alloys need to be studied and explored to get a usable solder alloy having better properties. In this work eutectic Sn-9Zn and three Tin-Zinc-Bismuth ternary alloys were prepared and investigated their microhardness and mechanical properties. Microhardness, tensile strength and elastic modulus increase with Bi addition while ductility decreases with Bi addition.

Mechanical properties of QFP micro-joints soldered with lead-free solders using diode laser soldering technology

Soldering experiments of quad flat package(QFP) devices were carried out by means of diode laser soldering system with Sn-Ag-Cu and Sn-Cu-Ni lead-free solders, and competitive experiments were also carried out not only with Sn-Pb eutectic solders but also with infrared reflow soldering method. The results indicate that under the conditions of laser continuous scanning mode as well as the fixed laser soldering time, an optimal power exists, while the optimal mechanical properties of QFP micro-joints are gained. Mechanical properties of QFP micro-joints soldered with laser soldering system are better than those of QFP micro-joints soldered with IR reflow soldering method. Fracture morphologies of QFP micro-joints soldered with laser soldering system exhibit the characteristic of tough fracture, and homogeneous and fine dimples appear under the optimal laser output power.

Wetting Behavior and Interfacial Reactions in (Sn-9Zn)-2Cu/Ni Joints during Soldering and Isothermal Aging

The wetting property of （Sn-9Zn）-2Cu （wt pct） on Ni substrate and the evolution of interracial microstructure in （Sn-9Zn）-2Cu/Ni joints during soldering as well as isothermal aging were studied. The wetting ability of eutectic Sn-gZn solder on Ni substrate was markedly improved by adding 2 wt pct Cu into this solder alloy. Plate-like Cu5Zn8 intermetallic compounds （IMCs） were detected in （Sn-9Zn）-2Cu solder matrix. A continuous NisZn21 IMC layer was formed at （Sn-9Zn）-2Cu/Ni interface after soldering. This IMC layer kept its type and integrality even after aging at 170℃ for up to 1000 h. At the early aging stage （before 500 h）, the IMC layer grew fast and its thickness followed a linear relationship with the square root of aging time. Thereafter, however, the thickness increased very slowly with longer aging time. When the joints were aged for 1000 h, a new IMC phase, （Cu,Ni）5Zn8, was found in the matrix near the interface. The formation of （Cu,Ni）5Zns phase can be attributed to the diffusion of Ni atoms into the solder matrix from the substrate.

Numerical simulation of temperature field in multilayer heterogeneity lamination laser soldering

A temperature field numerical simulation is carried out using the finite element method for laser soldering on PECT (piezoelectric ceramics transformer). A three dimensional model of laser soldering temperature field of multilayer materials is established. Then, the model was simplified in order to perform an efficient finite element analysis. Moreover, the temperature distribution characteristic in the laser soldering is investigated and verified by experiments. In all cases, the numerical results are in good agreement with the experimental measurements.

Study on laser and hot air reflow soldering of PBGA solder ball

Laser and hot air reflow soldering of PBGA solder ball was investigated. Experimental results showed that surface quality and shear strength of solder bump reflowed by laser was superior than the solder bump by hot air, and the microstructure within the solder bump reflowed by laser was much finer. Analysis on interfacial reaction showed that eutectic solder reacted with Au/Ni/Cu pad shortly after the solder was melted. Interface of solder bump reflowed by laser consists of a continuous AuSn 4 layer and remnant Au element. Needle like AuSn 4 grew sidewise from interface, and then spread out to the entire interface region. A thin layer of Ni 3Sn 4 intermetallic compound was found at the interface of solder bump reflowed by hot air, and AuSn 4 particles distributed within the whole solder bump randomly. The combination effect of the continuous AuSn 4 layer and finer eutectic microstructure contributes to the higher shear strength of solder bump reflowed by laser.