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DEPOSITION OF c-BN FILMS AND ADHESION IMPROVEMENT
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作者 S.R. Lee E.S.Byon and Y.-W. Seo 1)Korea Institnte of Machinery and Materials, Changwon 641-010, Korea 2)V & P International Co., Ltd, 705-9, Gozandong, Inchon 405-310, Korea ) 《Acta Metallurgica Sinica(English Letters)》 SCIE EI CAS CSCD 1996年第6期485-488,共4页
Cubic boron nitride (c-BN) films were successfully grown on Si(100)substrates by a helicon wave plasma-assisted chemical vapor deposition technique.The lower limits of rf substrated bias voltage and plasma density for... Cubic boron nitride (c-BN) films were successfully grown on Si(100)substrates by a helicon wave plasma-assisted chemical vapor deposition technique.The lower limits of rf substrated bias voltage and plasma density for formation of a single phase c-BN film were 350V and 4.5×10 ̄(10) cm ̄(3),respectively. The grown c-BN films demonstrated a poor adhesion to the substrates. A postannealing treatment at 800℃ C in N_2 atmosphere was found very effective in relieving the compressive stress in the films which were thereby stabilized to improve the adhesion. 展开更多
关键词 cubic boron nitride helicon wave plasma chemical vapor depo sition compressive stress
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