With the aid of the latest fiber optic sensing technology parameters in the cure process of ther- mosetting resin-matrix composite, such as temperature, viscosity,void and residual stress, can be monitored entirely an...With the aid of the latest fiber optic sensing technology parameters in the cure process of ther- mosetting resin-matrix composite, such as temperature, viscosity,void and residual stress, can be monitored entirely and efficiently.In this paper, experiment results of viscosity measurement in composite cure process in autoclave using fiber optic sensors are presented. Based on the sensed information, a computer program is utilized to control the cure process. With this technology, the cure process becomes more apparent and controllable, which will greatly improve the cured products and reduce the cost.展开更多
Microwave processing was used to cure the carbon fiber/epoxy composites and designed for improving the compressive strength of the materials. By controlling the power of microwave heating, vacuum bagged laminates were...Microwave processing was used to cure the carbon fiber/epoxy composites and designed for improving the compressive strength of the materials. By controlling the power of microwave heating, vacuum bagged laminates were fabricated under one atmosphere pressure without arcing. The physical and mechanical properties of composites produced through vacuum bagging using microwave and thermal curing were compared and the multistep （2-step or 3-step） microwave curing process for improved compressive properties was established. The results indicated that microwave cured samples had somewhat differentiated molecular structure and showed slightly higher glass transition temperature. The 2-step process was found to be more conducive to the enhancement of the compressive strength than the 3-step process. A 39% cure cycle time reduction and a 22% compressive strength increment were achieved for the composites manufactured with microwave radiation. The improvement in specific compressive strength was attributed to better interracial bonding between resin matrix and the fibers, which was also demonstrated via scanning electron microscopy analysis.展开更多
文摘With the aid of the latest fiber optic sensing technology parameters in the cure process of ther- mosetting resin-matrix composite, such as temperature, viscosity,void and residual stress, can be monitored entirely and efficiently.In this paper, experiment results of viscosity measurement in composite cure process in autoclave using fiber optic sensors are presented. Based on the sensed information, a computer program is utilized to control the cure process. With this technology, the cure process becomes more apparent and controllable, which will greatly improve the cured products and reduce the cost.
基金the Innovation Funds of China-National Engineering and Research Center for Commercial Aircraft Manufacturing (SAMC12-JS-15-015) for financial support
文摘Microwave processing was used to cure the carbon fiber/epoxy composites and designed for improving the compressive strength of the materials. By controlling the power of microwave heating, vacuum bagged laminates were fabricated under one atmosphere pressure without arcing. The physical and mechanical properties of composites produced through vacuum bagging using microwave and thermal curing were compared and the multistep （2-step or 3-step） microwave curing process for improved compressive properties was established. The results indicated that microwave cured samples had somewhat differentiated molecular structure and showed slightly higher glass transition temperature. The 2-step process was found to be more conducive to the enhancement of the compressive strength than the 3-step process. A 39% cure cycle time reduction and a 22% compressive strength increment were achieved for the composites manufactured with microwave radiation. The improvement in specific compressive strength was attributed to better interracial bonding between resin matrix and the fibers, which was also demonstrated via scanning electron microscopy analysis.
