Influence of diffusion bonding conditions on bonding strength of damping copper alloy to stainless steel

The experimental investigation of different transition metals was carried out in the diffusion bonding joints of Cu alloys (CuAlBe) to stainless steel (1Cr18Ni9Ti). The microstructure of the joint was analyzed with microscopic examination, SEM, EPMA and X ray diffraction. Following conclusions have been drawn: (1) The joint strength with the Ni interlayer was higher than that with Cu interlayer when the welding parameters were same;(2)When Ni interlayer was thinner,Al could interact with Ni and Fe,and the intermetallic compounds,such as Fe 3Al etc,were formed in the interface,which decreased the strength of the joints;(3)When the bonding temperature was higher,because of the diffusion of Cu in Ni being faster than Ni in Cu,a Kirkendall effect was produced,which also decreased the strength of the joints.

Transient liquid phase diffusion bonding of copper alloy to stainless steel using CuMn alloys as interlayer

With CuMn alloy as interlayer, the transient liquid phase (TLP) diffusion bonding of Cu alloys (CuAlBe) to stainless steel (1Cr18Ni9Ti) was studied. The results show that the bonding pressure, time and temperature and the content of Mn in CuMn alloy have great effects on the strength of bonding interface; when they are 1 MPa, 40 min, 1 223 K and 30% respectively, the maximum joint strength of 487 MPa is attained. The fracture occurring at the bonding interface is a plastic one and the effect of Mn has been analyzed.

Diffusion bonding of copper alloy to stainless steel with Ni and Cu interlayer

CuAlBe alloy is an attractive shape memory alloy with many important usages in industrial field, in order to spread its range of application it is desirable to be able to join CuAlBe soundly with other metallic materials, for example stainless steel; however the weldability between CuAlBe alloy and stainless steel has never been studied, therefore an experimental investigation of different transition metals was carried out in the diffusion bonding joints of Cu alloys (CuAlBe) to stainless steel (1Cr18Ni9Ti). The microstructure and phase composition of the joint were analyzed by SEM, EPMA and X ray diffraction. The following conclusions have been drawn: 1) The joint strength with Ni interlayer is higher than that with Cu interlayer when the welding parameters are the same; 2) When Ni interlayer is thinner, Al will interact with Ni and Fe, and the intermetallic compounds such as Fe 3Al are formed in the interface, which decreases the strength of the joints; 3) When the bonding temperature is higher, because the diffusion of Cu in Ni is faster than Ni in Cu, a Kirkendall effect occurs, which also decreases the strength of the joints.

CuAlBe高强度阻尼合金与不锈钢扩散焊接头组织

以Ni箔作中间层对新型舰船推行器用阻尼材料CuAlBe合金与 1Cr18Ni9Ti不锈钢固相扩散焊接头的微观组织及断口形貌进行了扫描电镜、电子探针线扫描、X射线衍射及微区能谱等微观分析。结果表明 ,焊接热循环易使CuAlBe合金近界面生成粗大的 β相 ,α相沿晶界网状分布 ,这将引起热弹性马氏体阻尼功能退化 ;同时 ,CuAlBe合金与 1Cr18Ni9Ti不锈钢两者塑性变形能力的差异及Cu -Ni界面Kirkendall效应在较大程度上影响扩散焊初期的原子相互扩散 ,进而影响稳定扩散阶段的冶金结合性 ;此外 ,焊接过程元素间的相互扩散在一定程度上影响着接头的断裂特征。

不锈钢复合滤网瞬间液相扩散连接的显微组织

以铜磷合金粉末为中间层,采用瞬间液相扩散连接方法在910~960℃保温30 min条件下对304不锈钢复合滤网进行了连接,对界面微观组织和元素扩散进行了分析。结果表明,在930℃保温30 min时,粗丝与细丝之间形成无焊缝连接,而冲孔板与粗丝之间形成焊缝;连接温度对降熔元素P的扩散影响很大,随连接温度升高,不锈钢复合网的冲孔板与粗丝之间所形成的焊缝宽度不断减小,在960℃保温30 min时,冲孔板与粗丝之间、粗丝与细丝之间均形成无焊缝连接,孔形结构没有明显变化。

CuAlBe/Ni/1Cr18Ni9Ti固相扩散焊

以Ｎｉ 箔作中间层对新型阻尼材料ＣｕＡｌＢｅ 合金与１Ｃｒ１８Ｎｉ９Ｔｉ 不锈钢固相扩散焊接头的微观组织作了试验研究。结果表明，焊接热－ 力循环易使ＣｕＡｌＢｅ 合金近界面生成粗大的β相，α相沿晶界网状分布，这将引起热弹性马氏体阻尼功能退化；同时，ＣｕＡｌＢｅ 合金与１Ｃｒ１８Ｎｉ９Ｔｉ 不锈钢两者塑性变形能力的差异在较大程度上影响着扩散焊初期的原子扩散，进而影响稳定扩散阶段的冶金结合性。此外，焊接过程中原子相互扩散在一定程度上影响着接头的断裂特征。