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Impact Analysis of Microscopic Defect Types on the Macroscopic Crack Propagation in Sintered Silver Nanoparticles
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作者 Zhongqing Zhang Bo Wan +4 位作者 Guicui Fu Yutai Su Zhaoxi Wu Xiangfen Wang Xu Long 《Computer Modeling in Engineering & Sciences》 SCIE EI 2024年第4期441-458,共18页
Sintered silver nanoparticles(AgNPs)arewidely used in high-power electronics due to their exceptional properties.However,the material reliability is significantly affected by various microscopic defects.In this work,t... Sintered silver nanoparticles(AgNPs)arewidely used in high-power electronics due to their exceptional properties.However,the material reliability is significantly affected by various microscopic defects.In this work,the three primary micro-defect types at potential stress concentrations in sintered AgNPs are identified,categorized,and quantified.Molecular dynamics(MD)simulations are employed to observe the failure evolution of different microscopic defects.The dominant mechanisms responsible for this evolution are dislocation nucleation and dislocation motion.At the same time,this paper clarifies the quantitative relationship between the tensile strain amount and the failure mechanism transitions of the three defect types by defining key strain points.The impact of defect types on the failure process is also discussed.Furthermore,traction-separation curves extracted from microscopic defect evolutions serve as a bridge to connect the macro-scale model.The validity of the crack propagation model is confirmed through tensile tests.Finally,we thoroughly analyze how micro-defect types influence macro-crack propagation and attempt to find supporting evidence from the MD model.Our findings provide a multi-perspective reference for the reliability analysis of sintered AgNPs. 展开更多
关键词 Sintered silver nanoparticles defect types microscopic defect evolution macroscopic crack propagation molecular dynamics simulation cohesive zone model
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Algorithmic Scheme for Concurrent Detection and Classification of Printed Circuit Board Defects 被引量:4
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作者 Jakkrit Onshaunjit Jakkree Srinonchat 《Computers, Materials & Continua》 SCIE EI 2022年第4期355-367,共13页
An ideal printed circuit board(PCB)defect inspection system can detect defects and classify PCB defect types.Existing defect inspection technologies can identify defects but fail to classify all PCB defect types.This ... An ideal printed circuit board(PCB)defect inspection system can detect defects and classify PCB defect types.Existing defect inspection technologies can identify defects but fail to classify all PCB defect types.This research thus proposes an algorithmic scheme that can detect and categorize all 14-known PCB defect types.In the proposed algorithmic scheme,fuzzy cmeans clustering is used for image segmentation via image subtraction prior to defect detection.Arithmetic and logic operations,the circle hough transform(CHT),morphological reconstruction(MR),and connected component labeling(CCL)are used in defect classification.The algorithmic scheme achieves 100%defect detection and 99.05%defect classification accuracies.The novelty of this research lies in the concurrent use of CHT,MR,and CCL algorithms to accurately detect and classify all 14-known PCB defect types and determine the defect characteristics such as the location,area,and nature of defects.This information is helpful in electronic parts manufacturing for finding the root causes of PCB defects and appropriately adjusting the manufacturing process.Moreover,the algorithmic scheme can be integrated into machine vision to streamline the manufacturing process,improve the PCB quality,and lower the production cost. 展开更多
关键词 PCB inspection PCB defect types defect detection defect classification image processing
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Biomechanical study of modular hemipelvic endoprosthesis for Type I-IV defect of pelvic tumor 被引量:1
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作者 Yang Dong Hai Hu Chang-Qing Zhang 《Chinese Journal of Cancer Research》 SCIE CAS CSCD 2014年第4期431-436,共6页
Background: The modular hemipelvic prosthesis has been used in patient of Type I-IV pelvic tumor with good outcomes, but how to keep the stability between the prosthesis and the residual sacrum is a problem. An addit... Background: The modular hemipelvic prosthesis has been used in patient of Type I-IV pelvic tumor with good outcomes, but how to keep the stability between the prosthesis and the residual sacrum is a problem. An additional screw-rod system seems to solve it, but its biomechanical characters are still not well understood, which need experimental evaluation. Methods: Six pelvic specimens were prepared in three conditions (normal intact pelvis, "normal"; the pelvis of left Type I-IV defect and implanted with prosthesis without/with additional screw-rod system, "rod-" and "rod+"). Compressing biomechanical experiments (50-500N) were performed in these three conditions, respectively. Results: The loadings during the experiments are in accordance with the linear elastic control mode. Under the increasing loading, the implanted pelvises displaced asymmetrically, unlike normal intact pelvis. The vertical displacement of "rod+" changed significantly, whereas "rod-" did not. For both implanted pelvis, right side displaced less than left side (P values 〈0.05). Conclusions: The implanted pelvis showed asymmetric displacement under loading, where healthy side displaced more. The implanted pelvis plus screw-rod system showed less displacement at implanted side but more at contralateral side in comparison with those without screw-rod system. 展开更多
关键词 Pelvis of type I-IV defect modular hemipelvic endoprosthesis biomechanical experiment
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