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Stochastic collocation for device-level variability analysis in integrated photonics 被引量:3
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作者 Yufei Xing Domenico Spina +2 位作者 Ang Li Tom Dhaene Wim Bogaerts 《Photonics Research》 SCIE EI 2016年第2期93-100,共8页
We demonstrate the use of stochastic collocation to assess the performance of photonic devices under the effect of uncertainty. This approach combines high accuracy and efficiency in analyzing device variability with ... We demonstrate the use of stochastic collocation to assess the performance of photonic devices under the effect of uncertainty. This approach combines high accuracy and efficiency in analyzing device variability with the ease of implementation of sampling-based methods. Its flexibility makes it suitable to be applied to a large range of photonic devices. We compare the stochastic collocation method with a Monte Carlo technique on a numerical analysis of the variability in silicon directional couplers. 展开更多
关键词 Stochastic collocation for device-level variability analysis in integrated photonics
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A Model to Evaluate the Device-Level Performance of Thermoelectric Cooler with Thomson Effect Considered
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作者 GONG Tingrui GAO Lei +6 位作者 WU Yongjia TAN Haoshu QIN Feng XIN Xiong SHEN Limei LI Juntao MING Tingzhen 《Journal of Thermal Science》 SCIE EI CAS CSCD 2022年第3期712-726,共15页
In this paper,a one-dimensional thermodynamic model was developed to evaluate the device-level performance of thermoelectric cooler(TEC)with the Thomson effect,contact resistance,gap heat leakage,heat sink,and heat lo... In this paper,a one-dimensional thermodynamic model was developed to evaluate the device-level performance of thermoelectric cooler(TEC)with the Thomson effect,contact resistance,gap heat leakage,heat sink,and heat load taken into account.The model was generalized and simplified by introducing dimensionless parameters.Experimental measurements showed good agreement with analytical results.The parametric analysis indicated that the influence of the Thomson effect on cooling capacity continued to expand with increasing current,while the effect on COP hardly changed with current.Low thermal contact resistance was beneficial to obtain lower hot-junction temperature,which can even reduce 2 K compared with the electrical contact resistance in the case study.The gap heat leakage was a negative factor affecting the cooling performance.When the thermal resistance of the heat sink was small,the negative effect of heat leakage on performance would be further enlarged.The enhancement of heat load temperature would increase the cooling power of the TEC.For example,an increase of 5 K in heat load can increase the cooling capacity by about 4%.However,once the current exceeded the optimum value,the raising effect on the cooling power would be weakened.The research can provide an analytical approach for the designer to perform trade studies to optimize the TEC system. 展开更多
关键词 thermoelectric cooler thermodynamic model Thomson effect contact resistance device-level performance
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