To acquire a well bonded interface between the copper and the diamond particles in diamondcopper matrix composites, an available process to apply a vapor deposited aluminum（Al） coating onto diamond particles was use...To acquire a well bonded interface between the copper and the diamond particles in diamondcopper matrix composites, an available process to apply a vapor deposited aluminum（Al） coating onto diamond particles was used to solve this interfacial problem. The diamond-copper matrix composites were prepared by spark plasma sintering（SPS） process and the effect of Al-coated diamond particles was demonstrated. The experimental results showed that the densification, interfacial bonding and thermal conductivity of Al-coated composites were evidently improved compared to those of the uncoated composites. A maximum thermal conductivity（TC） of 565 W/（m·K） was obtained in the coated composite containing 50vol% diamond particles sintered at 1163 K. Additionally, the experimental data of thermal conductivity and coefficient of thermal expansion（CTE） were compared with the predictions from several theoretical models.展开更多
An orthogonal experiment scheme was designed to investigate the effects of the Cu content,compaction pressure,and sintering temperature on the microstructures and mechanical and thermal properties of(30−50)wt.%Cu/Inva...An orthogonal experiment scheme was designed to investigate the effects of the Cu content,compaction pressure,and sintering temperature on the microstructures and mechanical and thermal properties of(30−50)wt.%Cu/Invar bi-metal matrix composites fabricated via spark plasma sintering(SPS).The results indicated that as the Cu content increased from 30 to 50 wt.%,a continuous Cu network gradually appeared,and the density,thermal conductivity(TC)and coefficient of thermal expansion of the composites noticeably increased,but the tensile strength decreased.The increase in the sintering temperature promoted the Cu/Invar interface diffusion,leading to a reduction in the TC but an enhancement in the tensile strength of the composites.The compaction pressure comprehensively affected the thermal properties of the composites.The 50wt.%Cu/Invar composite sintered at 700℃ and 60 MPa had the highest TC(90.7 W/(m·K)),which was significantly higher than the TCs obtained for most of the previously reported Cu/Invar composites.展开更多
The thermal conductivity of diamond hybrid SiC/Cu,diamond/Cu and SiC/Cu composite were calculated by using the extended differential effective medium (DEM) theoretical model in this paper.The effects of the particle v...The thermal conductivity of diamond hybrid SiC/Cu,diamond/Cu and SiC/Cu composite were calculated by using the extended differential effective medium (DEM) theoretical model in this paper.The effects of the particle volume fraction,the particle size and the volume ratio of the diamond particles to the total particles on the thermal conductivity of the composite were studied.The DEM theoretical calculation results show that,for the diamond hybrid SiC/Cu composite,when the particle volume fraction is above 46% and the volume ratio of the diamond particles to the SiC particles is above 13:12,the thermal conductivity of the composite can reach 500 W·m-1·K-1.The thermal conduc-tivity of the composite has little change when the particle size is above 200μm.The experimental results show that Ti can improve the wettability of the SiC and Cu.The thermal conductivity of the diamond hybrid SiCTi/Cu is almost two times better than that of the diamond hybrid SiC/Cu.It is feasible to predict the thermal conductivity of the composite by DEM theoretical model.展开更多
This study investigated the effect of thermal cycles on Cu-modified Ti64 thin-walled components deposited using the wire-arc directed energy deposition(wire-arc DED)process.For the samples before and after experiencin...This study investigated the effect of thermal cycles on Cu-modified Ti64 thin-walled components deposited using the wire-arc directed energy deposition(wire-arc DED)process.For the samples before and after experiencing thermal cycles,it was found that both microstructures consisted of priorβ,grain boundaryα(GBα),and basketweave structures containingα+βlamellae.Thermal cycles realized the refinement ofαlaths,the coarsening of priorβgrains andβlaths,while the size and morphology of continuously distributed GBαremained unchanged.The residualβcontent was increased after thermal cycles.Compared with the heat-treated sample with nanoscale Ti2Cu formed,short residence time in high temperature caused by the rapid cooling rate of thermal cycles restricted Ti2Cu formation.No formation of brittle Ti2Cu means that only grain refinement strengthening and solid-solution strengthening matter.The yield strength increased from 809.9 to 910.85 MPa(12.46%increase).Among them,the main contribution from solid solution strengthening(~51 MPa)was due to the elemental redistribution effect betweenαandβphases caused by thermal cycles through quantitative analysis.The ultimate tensile strength increased from 918.5 to 974.22 MPa(6.1%increase),while fracture elongation increased from 6.78 to 10.66%(57.23%increase).Grain refinement ofαlaths,the promotedα′martensite decomposition,decreased aspect ratio,decreased Schmid factor,and local misorientation change ofαlaths are the main factors in improved ductility.Additionally,although the fracture modes of the samples in the top and middle regions are both brittle-ductile mixed fracture mode,the thermal cycles still contributed to an improvement in tensile ductility.展开更多
The effect of stress on the microstructure and properties of an Al-Cu-Mg-Ag alloy under-aged at 165 ℃ for 2 h during thermal exposure at 200 ℃ was investigated. The tensile experimental results show that the remaine...The effect of stress on the microstructure and properties of an Al-Cu-Mg-Ag alloy under-aged at 165 ℃ for 2 h during thermal exposure at 200 ℃ was investigated. The tensile experimental results show that the remained tensile strength of both specimens at room temperature after being exposed at 200 ℃ with and without applying stress rises firstly, and then drops with the increasing of exposure time. The peak value of the remained strength reaches 439 MPa for non-stress-exposure for 10 h, and 454 MPa after being exposed with stress loaded for 20 h at 220 MPa. The elongation change is similar to that of strength. After being exposed for 100 h, specimen exposed at 220 MPa still remains a tensile strength of 401 MPa, larger than that exposed without applying stress. TEM shows that the microstructure of under-aged alloy is dominated by - phase mainly and a little θ′ phase. The θ′ and - phases are believed competitive with increasing exposure time. The width of precipitation free zone(PFZ) increases and the granular second phase precipitates at grain-boundary correspondingly. It is shown that the mechanical properties of alloy decrease slightly and present good thermal stability after thermal exposure at 200 ℃ and 220 MPa for 100 h.展开更多
30-50 wt.%graphite nanoflakes(GNFs)/6061Al matrix composites were fabricated via spark plasma sintering(SPS)at 610℃.The effects of the sintering pressure and GNF content on the microstructure and properties of the co...30-50 wt.%graphite nanoflakes(GNFs)/6061Al matrix composites were fabricated via spark plasma sintering(SPS)at 610℃.The effects of the sintering pressure and GNF content on the microstructure and properties of the composites were investigated.The results indicated that interfacial reactions were inhibited during SPS because no Al4C3 was detected.Moreover,the agglomeration of the GNFs increased,and the distribution orientation of the GNFs decreased with increasing the GNF content.The relative density,bending strength,and coefficient of thermal expansion(CTE)of the composites decreased,while the thermal conductivity(TC)in the X−Y direction increased.As the sintering pressure increased,the GNFs deagglomerated and were distributed preferentially in the X−Y direction,which increased the relative density,bending strength and TC,and decreased the CTE of the composites.The 50wt.%GNFs/6061Al matrix composite sintered at 610℃ under 55 MPa demonstrated the best performance,i.e.,bending strength of 72 MPa,TC and CTE(RT−100℃)of 254 W/(m·K)and 8.5×10^(−6)K^(−1)in the X−Y direction,and 55 W/(m·K)and 9.7×10^(−6)K^(−1)in the Z direction,respectively.展开更多
基金Funded by the National Natural Science Foundation of China(21273192)the Foundation of He’nan Educational Committee(15B430009)the Key Scientific Research Foundation of Xuchang University(2014077)
文摘To acquire a well bonded interface between the copper and the diamond particles in diamondcopper matrix composites, an available process to apply a vapor deposited aluminum（Al） coating onto diamond particles was used to solve this interfacial problem. The diamond-copper matrix composites were prepared by spark plasma sintering（SPS） process and the effect of Al-coated diamond particles was demonstrated. The experimental results showed that the densification, interfacial bonding and thermal conductivity of Al-coated composites were evidently improved compared to those of the uncoated composites. A maximum thermal conductivity（TC） of 565 W/（m·K） was obtained in the coated composite containing 50vol% diamond particles sintered at 1163 K. Additionally, the experimental data of thermal conductivity and coefficient of thermal expansion（CTE） were compared with the predictions from several theoretical models.
基金the International Science&Technology Cooperation Program of China(No.2014DFA50860).
文摘An orthogonal experiment scheme was designed to investigate the effects of the Cu content,compaction pressure,and sintering temperature on the microstructures and mechanical and thermal properties of(30−50)wt.%Cu/Invar bi-metal matrix composites fabricated via spark plasma sintering(SPS).The results indicated that as the Cu content increased from 30 to 50 wt.%,a continuous Cu network gradually appeared,and the density,thermal conductivity(TC)and coefficient of thermal expansion of the composites noticeably increased,but the tensile strength decreased.The increase in the sintering temperature promoted the Cu/Invar interface diffusion,leading to a reduction in the TC but an enhancement in the tensile strength of the composites.The compaction pressure comprehensively affected the thermal properties of the composites.The 50wt.%Cu/Invar composite sintered at 700℃ and 60 MPa had the highest TC(90.7 W/(m·K)),which was significantly higher than the TCs obtained for most of the previously reported Cu/Invar composites.
基金financially supported by High-Technology Research and Development Program of China (No.2008AA03Z505)
文摘The thermal conductivity of diamond hybrid SiC/Cu,diamond/Cu and SiC/Cu composite were calculated by using the extended differential effective medium (DEM) theoretical model in this paper.The effects of the particle volume fraction,the particle size and the volume ratio of the diamond particles to the total particles on the thermal conductivity of the composite were studied.The DEM theoretical calculation results show that,for the diamond hybrid SiC/Cu composite,when the particle volume fraction is above 46% and the volume ratio of the diamond particles to the SiC particles is above 13:12,the thermal conductivity of the composite can reach 500 W·m-1·K-1.The thermal conduc-tivity of the composite has little change when the particle size is above 200μm.The experimental results show that Ti can improve the wettability of the SiC and Cu.The thermal conductivity of the diamond hybrid SiCTi/Cu is almost two times better than that of the diamond hybrid SiC/Cu.It is feasible to predict the thermal conductivity of the composite by DEM theoretical model.
基金sponsored by the National Key Laboratory Foundation of Science and Technology on Materials under Shock and Impact 2021ZX52002222019the Natural Science Foundation of China(NSFC No.U2141216)the Chongqing Technology Innovation and Application Special Program.
文摘This study investigated the effect of thermal cycles on Cu-modified Ti64 thin-walled components deposited using the wire-arc directed energy deposition(wire-arc DED)process.For the samples before and after experiencing thermal cycles,it was found that both microstructures consisted of priorβ,grain boundaryα(GBα),and basketweave structures containingα+βlamellae.Thermal cycles realized the refinement ofαlaths,the coarsening of priorβgrains andβlaths,while the size and morphology of continuously distributed GBαremained unchanged.The residualβcontent was increased after thermal cycles.Compared with the heat-treated sample with nanoscale Ti2Cu formed,short residence time in high temperature caused by the rapid cooling rate of thermal cycles restricted Ti2Cu formation.No formation of brittle Ti2Cu means that only grain refinement strengthening and solid-solution strengthening matter.The yield strength increased from 809.9 to 910.85 MPa(12.46%increase).Among them,the main contribution from solid solution strengthening(~51 MPa)was due to the elemental redistribution effect betweenαandβphases caused by thermal cycles through quantitative analysis.The ultimate tensile strength increased from 918.5 to 974.22 MPa(6.1%increase),while fracture elongation increased from 6.78 to 10.66%(57.23%increase).Grain refinement ofαlaths,the promotedα′martensite decomposition,decreased aspect ratio,decreased Schmid factor,and local misorientation change ofαlaths are the main factors in improved ductility.Additionally,although the fracture modes of the samples in the top and middle regions are both brittle-ductile mixed fracture mode,the thermal cycles still contributed to an improvement in tensile ductility.
基金Project(2005CB623705-04) supported by the National Basic Research Program of China
文摘The effect of stress on the microstructure and properties of an Al-Cu-Mg-Ag alloy under-aged at 165 ℃ for 2 h during thermal exposure at 200 ℃ was investigated. The tensile experimental results show that the remained tensile strength of both specimens at room temperature after being exposed at 200 ℃ with and without applying stress rises firstly, and then drops with the increasing of exposure time. The peak value of the remained strength reaches 439 MPa for non-stress-exposure for 10 h, and 454 MPa after being exposed with stress loaded for 20 h at 220 MPa. The elongation change is similar to that of strength. After being exposed for 100 h, specimen exposed at 220 MPa still remains a tensile strength of 401 MPa, larger than that exposed without applying stress. TEM shows that the microstructure of under-aged alloy is dominated by - phase mainly and a little θ′ phase. The θ′ and - phases are believed competitive with increasing exposure time. The width of precipitation free zone(PFZ) increases and the granular second phase precipitates at grain-boundary correspondingly. It is shown that the mechanical properties of alloy decrease slightly and present good thermal stability after thermal exposure at 200 ℃ and 220 MPa for 100 h.
基金financial support from the International Science&Technology Cooperation Program of China(No.2014DFA50860)。
文摘30-50 wt.%graphite nanoflakes(GNFs)/6061Al matrix composites were fabricated via spark plasma sintering(SPS)at 610℃.The effects of the sintering pressure and GNF content on the microstructure and properties of the composites were investigated.The results indicated that interfacial reactions were inhibited during SPS because no Al4C3 was detected.Moreover,the agglomeration of the GNFs increased,and the distribution orientation of the GNFs decreased with increasing the GNF content.The relative density,bending strength,and coefficient of thermal expansion(CTE)of the composites decreased,while the thermal conductivity(TC)in the X−Y direction increased.As the sintering pressure increased,the GNFs deagglomerated and were distributed preferentially in the X−Y direction,which increased the relative density,bending strength and TC,and decreased the CTE of the composites.The 50wt.%GNFs/6061Al matrix composite sintered at 610℃ under 55 MPa demonstrated the best performance,i.e.,bending strength of 72 MPa,TC and CTE(RT−100℃)of 254 W/(m·K)and 8.5×10^(−6)K^(−1)in the X−Y direction,and 55 W/(m·K)and 9.7×10^(−6)K^(−1)in the Z direction,respectively.
