Precipitates Generation Mechanism and Surface Quality Improvement for Aluminum Alloy 6061 in Diamond Cutting

To improve the surface quality for aluminum alloy 6061(Al6061) in ultra-precision machining, we investigated the factors affecting the surface finish in single point diamond turning(SPDT)by studying influence of the precipitates generation of Al6061 on surface integrity and surface roughness.Based on the Johnson-Mehl-Avrami solid phase transformation kinetics equation, theoretical and experimental studies were conducted to build the relationship between the aging condition and the type, size and number of the precipitates for Al6061. Diamond cutting experiments were conducted to machine Al6061 samples under different aging conditions. The experimental results show that, the protruding on the chip surface is mainly Mg_(2)Si and the scratches on the machined surface mostly come from the iron-containing phase(α-, β-AlFeSi).Moreover, the generated Mg_(2)Si and α-, β-AlFeSi affect the surface integrity and the diamond turned surface roughness. Especially, the achieved surface roughness in SPDT is consistent with the variation of the number of AlFeSi and Mg_(2)Si with the medium size(more than 1 μm and less than 2 μm) in Al6061.

Numerical simulation of materials-oriented ultra-precision diamond cutting:review and outlook

Ultra-precision diamond cutting is a promising machining technique for realizing ultra-smooth surface of different kinds of materials.While fundamental understanding of the impact of workpiece material properties on cutting mechanisms is crucial for promoting the capability of the machining technique,numerical simulation methods at different length and time scales act as important supplements to experimental investigations.In this work,we present a compact review on recent advancements in the numerical simulations of material-oriented diamond cutting,in which representative machining phenomena are systematically summarized and discussed by multiscale simulations such as molecular dynamics simulation and finite element simulation:the anisotropy cutting behavior of polycrystalline material,the thermo-mechanical coupling tool-chip friction states,the synergetic cutting responses of individual phase in composite materials,and the impact of various external energetic fields on cutting processes.In particular,the novel physics-based numerical models,which involve the high precision constitutive law associated with heterogeneous deformation behavior,the thermo-mechanical coupling algorithm associated with tool-chip friction,the configurations of individual phases in line with real microstructural characteristics of composite materials,and the integration of external energetic fields into cutting models,are highlighted.Finally,insights into the future development of advanced numerical simulation techniques for diamond cutting of advanced structured materials are also provided.The aspects reported in this review present guidelines for the numerical simulations of ultra-precision mechanical machining responses for a variety of materials.

Tool Wear and Its Effect on Surface Roughness in Diamond Cutting of Glass Soda-lime

For the technology of diamond cutting of optical glass, the high tool wear rate is a main reason for hindering the practical application of this technology. Many researches on diamond tool wear in glass cutting rest on wear phenomenon describing simply without analyzing the genesis of wear phenomenon and interpreting the formation process of tool wear in mechanics. For in depth understanding of the tool wear and its effect on surface roughness in diamond cutting of glass, experiments of diamond turning with cutting distance increasing gradually are carried out on soda-lime glass. The wear morphology of rake face and flank face, the corresponding surface features of workpiece and the surface roughness, and the material compositions of flank wear area are detected. Experimental results indicate that the flank wear is predominant in diamond cutting glass and the flank wear land is characterized by micro-grooves, some smooth crater on the rake face is also seen. The surface roughness begins to increase rapidly, when the cutting mode changes from ductile to brittle for the aggravation of tool wear with the cutting distance over 150 m. The main mechanisms of inducing tool wear in diamond cutting of glass are diffusion, mechanical friction, thermo-chemical action and abrasive wear. The proposed research makes analysis and research from wear mechanism on the tool wear and its effect on surface roughness in diamond cutting of glass, and provides theoretical basis for minimizing the tool wear in diamond cutting brittle materials, such as optical glass.

Scratching and Turning Experiments on Machinability of Optical Glass SF6 in Diamond Cutting Process

To improve the machinability of optical glass and achieve optical parts with satisfied surface quality and dimensional accuracy, scratching experiments with increasing cutting depth were conducted on glass SF6 to evaluate the influence of cutting fluid properties on the machinability of glass. The sodium carbonate solution of 10.5% concentration was chosen as cutting fluid. Then the critical depths in scratching experiments with and without cutting fluid were examined. Based on this, turning experiments were carried out, and the surface quality of SF6 was assessed. Compared with the process of dry cutting, the main indexes of surface roughness decrease by over 70% totally. Experimental results indicated that the machinability of glass SF6 can be improved by using the sodium carbonate solution as cutting fluid.

Cutting path-dependent machinability of SiCp/Al composite under multi-step ultra-precision diamond cutting

Particle-tool interactions,which govern the synergetic deformation of SiC particle reinforced Al matrix composites under mechanical machining,strongly depend on the geometry of particle position residing on cutting path.In the present work,we investigate the influence of cutting path on the machinability of a SiCp/Al composite in multi-step ultra-precision diamond cutting by combining finite element simulations with experimental observations and characterization.Be consistent with experimentally characterized microstructures,the simulated SiCp/Al composite is considered to be composed of randomly distributed polygonally-shaped SiC particles with a volume fraction of 25 vol%.A multi-step cutting strategy with depths of cut ranging from 2 to 10 lm is adopted to achieve an ultimate depth of cut of 10 lm.Intrinsic material parameters and extrinsic cutting conditions utilized in finite element simulations of SiCp/Al cutting are consistent with those used in corresponding experiments.Simulation results reveal different particle-tool interactions and failure modes of SiC particles,as well as their correlations with machining force evolution,residual stress distribution and machined surface topography.A detailed comparison between numerical simulation results and experimental data of multi-step diamond cutting of SiCp/Al composite reveals a substantial impact of the number of cutting steps on particle-tool interactions and machined surface quality.These findings provide guidelines for achieving high surface finish of SiCp/Al composites by ultra-precision diamond cutting.

Anisotropy-Related Machining Characteristics in Ultra-Precision Diamond Cutting of Crystalline Copper

Deformation behavior at grain levels greatly affects the machining characteristics of crystalline materials.In the present work,we investigate the influence of material anisotropy on ultra-precision diamond cutting of single crystalline and polycrystalline copper by experiments and crystal plasticity finite element simulations.Specifically,diamond turning and in situ SEM orthogonal cutting experiments are carried out to provide direct experimental evidence of the material anisotropy-dependent cutting results in terms of machined surface morphology and chip profile.Corresponding numerical simulations with the analysis of built stress further validate experimental results and reveal the mechanisms governing the material anisotropy influence.The above findings provide insight into the fabrication of ultra-smooth surfaces of polycrystalline metals by ultraprecision diamond turning.

Approach for Polishing Diamond Coated Complicated Cutting Tool: Abrasive Flow Machining(AFM)

Lower surface roughness and sharper cutting edge are beneficial for improving the machining quality of the cut?ting tool, while coatings often deteriorate them. Focusing on the diamond coated WC?Co milling cutter, the abrasive flow machining(AFM) is selected for reducing the surface roughness and sharpening the cutting edge. Comparative cutting tests are conducted on di erent types of coated cutters before and after AFM, as well as uncoated WC?Co one, demonstrating that the boron?doped microcrystalline and undoped fine?grained composite diamond coated cutter after the AFM(AFM?BDM?UFGCD) is a good choice for the finish milling of the 6063 Al alloy in the present case, because it shows favorable machining quality close to the uncoated one, but much prolonged tool lifetime. Besides, compared with the micro?sized diamond films, it is much more convenient and e cient to finish the BDM?UFGCD coated cutter covered by nano?sized diamond grains, and resharpen its cutting edge by the AFM, owing to the lower initial surface roughness and hardness. Moreover, the boron incorporation and micro?sized grains in the underly?ing layer can enhance the film?substrate adhesion, avoid the rapid film removal in the machining process, and thus maximize the tool life(1040 m, four times more than the uncoated one). In general, the AFM is firstly proposed and discussed for post?processing the diamond coated complicated cutting tools, which is proved to be feasible for improving the cutting performance

Investigation of Surface Micro Waviness in Single Point Diamond Fly Cutting

Single point diamond fly cutting is widely used in the manufacture of large-aperture ultra-precision optical elements. However,some micro waviness( amplitude about 30 nm,wavelength about 15 mm) along the cutting direction which will decrease the quality of the optical elements can always be found in the processed surface,and the axial vibration of the spindle caused by the cut-in process is speculated as the immediate cause of this waviness. In this paper,the analytical method of dynamic mesh is applied for simulating the dynamic behavior of the vertical spindle. The consequence is then exerted to the fly cutter and the processed surface profile is simulated. The wavelength of the simulation result coincides well with the experimental result which proves the importance of the cut-in process during the single point diamond fly cutting.

Challenges in Processing Diamond Wire Cut and Black Silicon Wafers in Large-Scale Manufacturing of High Efficiency Solar Cells

Texturing of diamond wire cut wafers using a standard wafer etch process chemistry has always been a challenge in solar cell manufacturing industry. This is due to the change in surface morphology of diamond wire cut wafers and the abundant presence of amorphous silicon content, which are introduced from wafer manufacturing industry during sawing of multi-crystalline wafers using ultra-thin diamond wires. The industry standard texturing process for multi-crystalline wafers cannot deliver a homogeneous etched silicon surface, thereby requiring an additive compound, which acts like a surfactant in the acidic etch bath to enhance the texturing quality on diamond wire cut wafers. Black silicon wafers on the other hand require completely a different process chemistry and are normally textured using a metal catalyst assisted etching technique or by plasma reactive ion etching technique. In this paper, various challenges associated with cell processing steps using diamond wire cut and black silicon wafers along with cell electrical results using each of these wafer types are discussed.

Novel Pretreatment of Hard Metal Substrate for Better Performance of Diamond Coated Cutting Tools

A surface engineering approach for a novel pre-treatment of hard metal tool substrate for optimum adhesion of diamond coatings is presented. Firsfly, an alkaline solution was used to etch the WC grains to generate a rough surface for better mechanical interlocking. Subsequently, surface Co was removed by etching in acid solution. Then the hard metal substrate was boronized to form a compound interlayer which acted as an efficient diffusion barrier to prevent the outward diffusion of Co. Novel nano-microcrystalline composite diamond film coatings with a very smooth surface was deposited on the surface engineering pre-treated hard metal surface. Promising results of measurement in adhesion strength as well as field cutting tests have been obtained.

The glass roller cutter made of CVD diamond film

As a cutting tool,diamond films made by chemical vapor deposition(CVD) outperformed polycrystalline diamond(PCD) sintered under ultrahigh pressure.For example,the longevity of the CVD tools may be 2～5 times that of PCD inserts.In addition,the former cutting paths are strainghter with less chipping on the edge.However,there have been no report on CVD diamond films that were used as a roller scriber for splitting large glass panels.Our research demonstrated that the CVD diamond film could concentrate the energy in a smaller area(about 1/4),so the glass compressed by the tip of the diamond film was under a larger tensile stress in perpendicular to the direction of compression.The tensile stress then initiated the microcracks that were more in line with the direction of the compression. The reason that CVD diamond film could concentrate the compressive stress was due to its 100%diamond content.The high diamond content could allow the tip to be polished sharper.In contrast,the PCD cutting tip contained micro grains of cobalt that were softer than glass.As a result,the compressional stress was spreading out due to the larger area of contact.Consequently,the microcracks initiated at the PCD tip were random and they might not propagate along the direction of cutting.

激光技术在金刚石加工中的研究及应用进展

激光加工是目前金刚石的主流加工方法,相较于传统的机械加工形式,激光加工精度高、效率高、普适性强,因而在金刚石切割、微孔成型、微槽道加工及平整化等方面均得到广泛应用。文中阐述了金刚石激光加工原理,介绍了不同类型激光与金刚石材料相互作用机制,重点总结了近几年多种激光加工金刚石模式的发展现状,分析了新型的激光加工方法的特点,探讨了现阶段激光技术在金刚石加工领域面临的问题、挑战及未来的发展趋势。

刀具磨损和变摩擦系数对切削力的影响

刀具磨损和摩擦系数对切削力、表面质量有显著影响。为进一步研究刀具磨损和摩擦系数对切削力的影响规律,提出了同时考虑刀具磨损和变摩擦系数的切削力模型。首先分析了刀具磨损对刃口半径的影响规律,指出随刀具磨损增加,刃口半径增加;其次明确了刀具磨损及刃口半径对最小切削厚度的影响规律,认为最小切削厚度随刀具磨损、刃口半径的增加而增加。进一步用单晶金刚石刀具切削铝合金,并在切削深度、进给速度、刀具刃口半径、刀具磨损宽度以及恒定摩擦系数与变摩擦系数等方面进行了对比。研究表明,随切削深度、进给速度增加,法向切削力与切向切削力增加;随刃口半径从150 nm增加到450 nm,切向力增加了1.13倍,法向力增加了2.12倍;随刀具磨损宽度从0增加到0.55μm,切向力增加了1倍,法向力增加了约7倍;恒定摩擦系数切削力最大误差高达41%,变摩擦系数切削力最大误差在11%以内。因此,同时考虑了刀具磨损与变摩擦系数的切削模型与实际切削过程更加吻合。

镍磷合金微沟槽金刚石切削泊松毛刺形成机理

为了探究镍磷合金超精密切削过程中泊松毛刺的形成原因及规律,并且寻求泊松毛刺尺寸更精准的表征方式,本文通过对镍磷合金泊松毛刺的形成机理进行理论分析,建立其正交切削过程中的泊松毛刺高度和宽度预测模型,并通过实验分析切削参数对泊松毛刺高度和宽度的影响,通过实验观察可知,切削深度对毛刺尺寸影响显著,切削深度由3μm增加至9μm时,毛刺高度增加了0.0998μm,毛刺宽度增加了1.06μm,而切削速度对毛刺高度及宽度的影响很小。且通过对比实验得到的毛刺数据和预测数据可知,毛刺高度和宽度预测模型的平均相对误差值分别为5.43%和8.17%,验证了预测模型的准确性。同时目前的泊松毛刺高度和宽度表征方法具有一定的误差,因此本文提出了利用积分法计算泊松毛刺体积的方法,并基于体积法建立了更准确的泊松毛刺尺寸表征方法,通过计算得到体积的预测模型平均相对误差值为4.81%,可知泊松毛刺体积的预测模型准确度相对更高。研究结果为镍磷合金正交切削过程中合理选择切削参数和泊松毛刺尺寸评估方法提供了理论指导。

单磨粒金刚石微切削碳化硅晶体仿真与实验研究

采用有限元软件Abaqus建立金刚石锥形磨粒微切削碳化硅晶体的模型,通过预仿真模型确定切削深度和切削速度的选择范围,分析影响切削力的主、次要因素,研究单一切削参数对碳化硅晶体切削效果的影响;并借助赫兹接触理论,验证加载力对摩擦力、切削边缘形貌、切削深度的影响。结果表明:切削深度是影响切削力的显著因素,预仿真模型确定的切削深度不超过1.50μm;碳化硅晶体切削的最优方案为切削深度取0.50μm、切削速度取76 m/s、磨料切削刃角度取60°。通过控制切削深度可以提高切削稳定性,且在保证切削质量的前提下适当提高切削速度可以提高切削效率。金刚石探针压入晶体的深度与摩擦系数、摩擦力和切削力呈正相关,获得的碳化硅晶体切削边缘的三维轮廓相对平整、光滑。

不同阴极运动状态下镍-金刚石刀具性能研究

利用复合电沉积技术制备了超薄镍-金刚石刀具。利用扫描电子显微镜(SEM)、能谱分析(EDS)对刀具的成分及微观组织结构进行了表征。探究了不同阴极运动状态对刀具微观结构、硬度、耐磨性及金刚石微粒均匀性的影响。首次采用阴极自旋转方式制备镍-金刚石刀具。结果表明:阴极旋转所制备的刀具要优于阴极不旋转所制备的刀具。

基于超声毛细效应的电镀金刚石线切割工作液供给基础研究

薄片化、细线化是太阳能硅片切割的重要发展趋势,有利于光伏行业降本增效、降低发电的度电成本。细线化切割导致硅片间距小于100μm,薄片化则降低硅片抗弯能力,因此硅片间极易发生硅片吸附贴合现象,从而增加了硅片破裂风险。为此,提出将超声波毛细效应用于电镀金刚石线硅片切割,以减少和抑制晶圆吸附。为探究平板间超声波毛细作用规律进而指导工业应用,分别研究了平行板间距、平板与超声水槽底面间距、平板间不平行、表面活性剂、工作液温度和超声作用时间对超声波毛细现象的影响规律。研究结论为工业应用提供了指导,有助于抑制晶圆吸附,减小晶圆弯曲度,降低细线切割硅片的表面裂纹损伤,提高其断裂强度。

金刚石线锯成形切割工程陶瓷圆弧试验研究

针对工程陶瓷圆形零件难以成形加工的问题,提出了一种金刚石线锯成形加工工程陶瓷圆弧件的新方法,以圆弧面的径向跳动为衡量圆度指标,采用单因素实验法分析了线速度、转台转速和张紧力等工艺参数对圆弧件形状精度圆度、加工效率、线弓角度、表面粗糙度、表面形貌的影响规律。试验结果得出:在本试验参数范围内,线速度越大圆弧面的圆度越好、加工效率越高、线弓角度越小、表面粗糙度越好、表面质量越好;转台转速越小圆弧面的圆度越好、加工效率越高、线弓角度越小、表面粗糙度越好、表面质量越好;张紧力越大圆弧面的圆度越好、加工效率越高、线弓角度越小、表面粗糙度越好、表面质量越好。

硅片切割线痕对太阳电池电性能影响的研究

金刚线切割是目前光伏行业主要的单晶硅片切割方式,但硅片被切割后其表面会留有线痕。首先对切割线痕在硅片表面的分布状态及线痕形貌在硅片碱制绒前后的变化进行了量化分析,然后针对硅片表面不同线痕深度对太阳电池电性能及良率的影响进行了研究,最后在硅片线痕深度小于等于15μm的基础上,分析了硅片线痕对细栅的影响机理。得到以下结论:1)金刚线切割的硅片存在多种状态的线痕,碱制绒只是在微观层面形成了金字塔结构,但并不能改变线痕宏观层面的轮廓曲线。2)切割线痕会造成硅片表面形成V形沟壑,且当细栅与沟壑垂直时,会对丝网印刷时栅线的连续性造成一定影响。3)对于线痕深度为10~15μm的硅片,采用细栅垂直于线痕的丝网印刷方式时,太阳电池出现了严重的EL断栅及发黑现象,并且影响到其电性能;而采用细栅平行于线痕的丝网印刷方式时,降低了EL断栅概率,并且太阳电池电性能基本不受影响,但存在一定概率的局部印刷粗细不均的情况。该研究对提升太阳电池光电转换效率和良率有积极的参考价值。

核电站厂房大型混凝土墙切割及断面处理施工技术

在“双碳”背景下,核电从单一发电到居民供暖,再到工业供汽,核能正在综合利用领域逐步摸索进化,从“单一型选手”向“多功能互补”转变。核电在转变进化过程中,厂房的结构改造越来越多,包括结构的拆除、开孔、增加结构和增加其他功能等。核电厂房物项繁多、结构复杂、墙体宽厚、钢筋密集和混凝土强度等级高,加上在运行期间,实施窗口受限;因此,针对核电厂房的改造难度大,传统的改造工艺已无法满足需要。通过对某核电站某项目闸门井改造施工技术进行研究,采用绳锯模块式切割拆除大型钢筋混凝土墙体,断面处理选用新型材料硅烷浸渍剂对灌浆层表面进行防腐处理,很好地解决核电升级转型过程中涉及大型混凝土墙体改造的需求。