Effects of rare earth element lanthanum on the microstructure of copper matrix diamond tool materials

Effects of rare earth element La on the microstructure of Cumatrix diamond tools were researched under the conditions of variousmaterials components and the process parameters in order to improvematerials properties. SEM, XPS and X-ray were used to investigate thefracture section, microstructure and the element valence inmaterials. The Results shown that the combination of rare earthelement La and transition element Ti is advantageous to the bondingstate Between diamond particles and matrix, so it can improve thematerials properties. Suitable sintering temperature is 790 deg. C.

Fabrication and Characterization of FeNiCr Matrix-TiC Composite for Polishing CVD Diamond Film

Dynamic friction polishing （DFP） is one of the most promising methods appropriate for polishing CVD diamond film with high efficiency and low cost. By this method CVD diamond film is polished through being simply pressed against a metal disc rotating at a high speed utilizing the thermochemical reaction occurring as a result of dynamic friction between them in the atmosphere. However, the relatively soft materials such as stainless steel, cast iron and nickel alloy widely used for polishing CVD diamond film are easy to wear and adhere to diamond film surface, which may further lead to low efficiency and poor polishing quality. In this paper, FeNiCr matrix-TiC composite used as grinding wheel for polishing CVD diamond film was obtained by combination of mechanical alloying （MA） and spark plasma sintering （SPS）. The process of ball milling, composition, density, hardness, high-temperature oxidation resistance and wear resistance of the sintered piece were analyzed. The results show that TiC was introduced in MA-SPS process and had good combination with FeNiCr matrix and even distribution in the matrix. The density of composite can be improved by mechanical alloying. The FeNiCr matrix-TiC composite obtained at 1273 K was found to be superior to at 1173 K sinterin8 in hardness, high-temperature oxidation resistance and wearability. These properties are more favorable than SUS304 for the preparation of high-performance grinding wheel for polishing CVD diamond film.

New Nanocrystalline Matrix Materials for Sintered Diamond Tools

The work presents the possibility of substitution of expensive, wear resistant Co-WC powders, that have been traditionally used in the production of sintered diamond tools, with cheap iron-base counterparts manufactured by ball milling. It has been shown that ball-milled Fe-Ni-Cu-Sn-C powders can be consolidated to a virtually pore-free condition by hot pressing at 900 ℃. The as-consolidated material has nanocrystalline structure and is characterised by a combination of high hardness, mechanical strength and excellent resistance to abrasion. Its properties can be widely modified by changing the milling conditions.

芯片用金刚石增强金属基复合材料研究进展

随着电子设备集成化程度越来越高,对高导热封装材料的需求也越来越大,金刚石增强金属基复合材料凭借其高导热性能成为研究焦点。然而,由于金刚石颗粒与金属基体之间的不润湿特性,具有高导热性的金刚石增强金属基复合材料难以制备。文中综述了金刚石增强金属基复合材料的研究进展,包括界面改性、工艺参数优化和复合材料制备方法,并指出了金刚石增强金属基复合材料目前存在的问题和今后的研究方向。

激光粉末床熔融成形金刚石增强铝基复合材料

添加质量分数3%金刚石颗粒并利用激光粉末床熔融技术制备6061铝基复合材料。采用光学显微镜、扫描电子显微镜、X射线衍射仪、电子密度计、电子式万能试验机对3%金刚石/6061铝基复合材料的微观组织、相对密度和拉伸性能进行了表征与分析。结果表明:金刚石与Al基体反应生成了针状Al4C3相,并沉积在α-Al基体上,导致晶界位错密度增加,强度提高,抗失效能力增强。金刚石的添加促使6061铝基体中热裂纹消失,但存在孔洞缺陷。较低的扫描速度增加了激光光斑与被加工材料接触的时间,导致金刚石颗粒部分石墨化,铝基体部分蒸发,进而形成内部缺陷,降低了复合材料的相对密度(97%)。金刚石的加入显著提高了激光粉末床熔融技术成形金刚石/6061铝基复合材料的抗拉强度,当激光功率为350 W、扫描速度为800 mm·s-1时,复合材料的极限抗拉强度达到最大值244.2 MPa,屈服强度211.6 MPa,伸长率2.1%。

金刚石/铜-硼复合材料界面结构及其对热导率和力学性能的影响

通过控制硼含量制备不同界面结构的金刚石/铜复合材料,研究复合材料的界面显微组织及其对热性能和力学性能的影响。结果表明,界面处形成微米级B4C齿状结构,该结构为界面结合提供冶金结合和机械啮合的双重作用。金刚石/铜-硼复合材料获得最高为695 W/(m·K)的热导率和535 MPa的弯曲强度。金刚石与B4C之间形成具有金刚石(111)//B4C (104)取向关系的半共格界面。微纳米级齿状结构可提高界面声子传输效率和界面结合强度。

复合电镀强化金刚石颗粒对钻头性能的影响

为提高孕镶金刚石钻头的碎岩效率和钻进寿命,提出复合电镀强化金刚石颗粒形成钻头胎体局部非均质化的思路,将金刚石在钻头胎体中的出刃效果和包镶强度分离开来。采用化学镀和复合电镀强化了金刚石颗粒,热压烧结制备了金刚石钻头胎体。研究了金刚石颗粒在复合电镀强化后的性能变化、钻头胎体的摩擦磨损特性、金刚石在钻头胎体中的出刃状态和结合界面。结果表明,复合电镀强化金刚石颗粒表面获得一层改性金属镀层,镀层形貌致密均匀,与金刚石结合状态良好;复合电镀强化金刚石颗粒有效提高了金刚石的表面润湿性和抗冲击性能;非均质化胎体结构保证了金刚石缓慢出刃过程和出刃高度。复合电镀强化金刚石颗粒有效提高了金刚石钻头的综合性能。

钻探施工中孕镶金刚石钻头的适应性选择

孕镶金刚石钻头是进行地质岩心钻探必不可少的利器之一。本文总结全球3大知名公司金刚石钻头的特性及其与不同地层的对应选择关系,认为他们在钻头对地层的适应性及钻头分类方式方面较国内有一定的优势。在此基础上,针对国内目前存在的钻头胎体分类繁杂、选择困难、对地层的适应性较差的问题,本研究从钻头胎体类型、地层岩性和施工案例等3个方面,提出钻井施工中切实有效的钻头与地层对应选择方案,并研发出4种胎体配方能够满足从软岩层、中硬岩层—硬岩层、极硬岩层钻进需求,采用“字母+数字方式”对衍生的K系列、S系列钻头胎体进行标注,并在工程实践中取得良好应用效果。

液相色谱串联质谱法测定鸡蛋中金刚乙胺残留量的研究

目的:建立液相色谱串联质谱法测定鸡蛋中金刚乙胺残留量的分析方法,为鸡蛋食品安全检测工作提供技术支持。方法:采用液相色谱串联质谱法测定鸡蛋中金刚乙胺的残留量。结果:在质量浓度为1~20 ng·mL^(-1),金刚乙胺的线性关系良好,相关系数为0.999 8,回收率为84.3%~91.6%,定量限为1 μg·kg^(-1)。结论:该方法检测效果良好,可以应用于鸡蛋中金刚乙胺含量的实际监测工作中。

金属包覆FeCuNi粉末对金刚石工具胎体性能的影响

为解决Co基金刚石工具成本高,Fe基金刚石工具烧结温度高、把持力弱、胎体易烧死等问题,通过化学法将Cu、Sn、Bi等金属分别包覆于FeCuNi合金粉末表面,制备成金属包覆FeCuNi合金粉末。结果表明:配方中添加金属包覆FeCuNi合金粉末后,三点抗弯强度提高近20%;金属包覆FeCuNi合金粉末烧结过程中,FeCuNi颗粒表面的Sn、Bi率先熔化,与Cu反应形成的Cu-Sn、Cu-Bi等液相能够形成连续的网络状结构,将FeCuNi、Fe、Ni等颗粒包裹和黏结,使得金刚石工具胎体的成分和组织结构分布更加均匀、更加致密,避免了成分偏析的发生。通过以上试验得到初步结论,金属包覆FeCuNi合金粉末可等效替代贵重金属Co,极大地降低金刚石工具生产成本,具有显著的经济效益。

Effect of sintering on the relative density of Cr-coated diamond/Cu composites prepared by spark plasma sintering

Cr-coated diamond/Cu composites were prepared by spark plasma sintering. The effects of sintering pressure, sintering temperature, sintering duration, and Cu powder particle size on the relative density and thermal conductivity of the composites were investigated in this paper. The influence of these parameters on the properties and microstructures of the composites was also discussed. The results show that the relative density of Cr-coated diamond/Cu reaches ~100% when the composite is gradually compressed to 30 MPa during the heating process. The densification temperature increases from 880 to 915℃ when the diamond content is increased from 45vol% to 60vol%. The densification temperature does not increase further when the content reaches 65vol%. Cu powder particles in larger size are beneficial for increasing the relative density of the composite.

Selective interfacial bonding and thermal conductivity of diamond/Cu-alloy composites prepared by HPHT technique

Cu-based and Cu-alloy-based diamond composites were made by high-pressure-high-temperature （HPHT） sintering with the aim of maximizing the thermal conductivity of the composites. Improvements in interfacial bonding strength and thermo-physical properties of the composites were achieved using an atomized copper alloy with minor additions of Co, Cr, 13, and Ti. The thermal conductivity （TC） oh- mined exhibited as high as 688 W.m-1.K-1, but also as low as 325 W.m-1.K-l. A large variation in TC can be rationalized by the discrepancy of diamond-matrix interfacial bonding. It was found from fractography that preferential bonding between diamond and the Cu-alloy matrix occurred only on the diamond {100} faces. EDS analysis and Raman spectra suggested that selective interfacial bonding may be attributed to amorphous carbon increasing the wettability between diamond and the Cu-alloy matrix. Amorphous carbon was found to significantly affect the TC of the composite by interface modification.

Predicted interfacial thermal conductance and thermal conductivity of diamond/Al composites with various interfacial coatings

The interfacial thermal conductance （ITC） and thermal conductivity （TC） of diamond/Al composites with various coatings were theoretically studied and discussed. A series of predictions and numerical analyses were performed to investigate the effect of thickness, sound velocity, and other parameters of coating layers on the ITC and TC. It is found that both the ITC and TC decline with increasing coating thickness, especially for the coatings with relatively low thermal conductivity. Nevertheless, if the coating thickness is close to zero, or quite a small value, the ITC and TC are mainly determined by the constants of the coating material. Under this condition, coatings such as Ni, TiC, Mo 2 C, SiC, and Si can significantly improve the ITC and TC of diamond/Al composites. By contrast, coatings like Ag will exert the negative effect. Taking the optimization of interfacial bonding into account, conductive carbides such as TiC or Mo 2 C with low thickness can be the most suitable coatings for diamond/Al composites.

Thermal conductivity of diamond/copper composites with a bimodal distribution of diamond particle sizes prepared by pressure infiltration method

The thermal conductivity of diamond/copper composites with bimodal particle sizes was studied. The composites were prepared through pressure infiltration of liquid copper into diamond preforms with a mixture of 40 and 100 pm-size diamonds. The permeability of the preforms with different coarse-to-fine volume ratios of diamonds was investigated. The thermal conductivity of the diamond/copper composites with bimodal size distribution was compared to the theoretical value derived from an analytical model developed by Chu. It is predicted that the diamond/copper composites could reach a higher thermal conductivity and their surface roughness could be improved by applying bimodal diamond particle sizes.

Pressure infiltrated Cu/diamond composites for LED applications

Diamond reinforced copper （Cu/diamond） composites were prepared by a pressure infilla＇ation technique. The composites show a super high conductivity of 713 W.m-1.K-1 in combination with an extremely low coefficient of thermal expansion （CTE） of 7.72 × 10-6 K-1 （25-100℃）, which are achieved by modifying the copper matrix with adding 0.3 wt.% of boron to get a good thermal contact between the matrix and the diamond particles. By adopting a series of postmachining techniques the composites were made into near-net-shape parts, and an electroless silver coating was also successfully plated on the composites. Finally, their potential applications in the thermal management of fight emitting diodes （LED） were illustrated via prototype examples.

Effects of diamond magnetism on the microstructure of electrodeposited diamond composites

Electroformed diamond tools have been used for many years in grinding and cutting fields while electrodeposited diamond composite coatings have been widely studied due to their desirable hardness,wear and corrosion resistance.This article reports the detrimental impact of diamond magnetism on the composites microstructure and gives explanations.Microstructure differences between composites that,respectively,contained no-further-treated diamond,magnetism-strengthening treated diamond and magnetism weakening treated diamond were carefully observed.It is shown that diamond magnetization treatment drastically harms the composite microstructure(e.g.,roughening the coating surface,coarsening the matrix grain,and more seriously,reducing the mechanical retention of diamond grains in the matrix) while demagnetization treatment does the opposite.All the observed facts could be explained by the electromagnetic interaction between magnetic fields produced by magnetic diamond grains and electric current(moving cations) during the electrodeposition process.

Effect of sintering parameters on the microstructure and thermal conductivity of diamond/Cu composites prepared by high pressure and high temperature infiltration

Pure Cu composites reinforced with diamond particles were fabricated by a high pressure and high temperature （HPHT） infiltration technique. Their microstructural evolution and thermal conductivity were presented as a function of sintering parameters （temperature, pressure, and time）. The improvement in interfacial bonding strength and the maximum thermM conductivity of 750 W/（m.K） were achieved at the optimal sintering parameters of 1200℃, 6 GPa and 10 min. It is found that the thermal conductivity of the composites depends strongly on sintering pressure. When the sintering pressure is above 6 GPa, the diamond skeleton is detected, which greatly contributes to the excellent thermal conductivity.

Thermal entanglement of the spin-1 Ising-Heisenberg diamond chain with biquadratic interaction

We investigate the thermal entanglement of the spin-1 Ising-Heisenberg diamond chain, which can be regarded as a theoretical model for the homometallic molecular ferrimagnet [Ni_3（C_4H_2O_4）_2-（μ_3-OH）_2（H_2O）_4]n ·（2H_2O）n. Two cases,i.e., the isotropic Heisenberg（Ising-XXX） coupling model and anisotropic Heisenberg（Ising-XXZ） coupling model, are discussed respectively. The negativity is chosen as the measurement of the thermal entanglement. By means of the transfermatrix approach, we focus on the effects of biquadratic interaction parameters on the negativity of the infinite spin-1 Ising-Heisenberg diamond chain. In the Ising-XXX coupling model, it is shown that for the case with ferromagnetic coupling the thermal entanglement can be induced by the biquadratic interaction, but the external magnetic field will suppress the occurrence of the entanglement induced by the biquadratic interaction. In the Ising-XXZ coupling model,for the case with antiferromagnetic coupling, due to the biquadratic interaction the effect of the anisotropy parameter on the entanglement will be suppressed at near-zero temperature. Moreover, the biquadratic interaction makes the threshold temperature increase. The effects of the external magnetic field on the thermal entanglement are also discussed, and it is observed that the entanglement revival phenomena exist in both models considered.

提高烧结压力对孕镶金刚石钻头性能的影响研究

传统的热压孕镶金刚石钻头胎体配方多为单质金属体系,采用WC或YG8作为骨架材料,Cu合金作为粘结材料,Ni、Co、Fe和Mn等金属作为中间材料。受配方中粘结材料和骨架材料成分及含量的影响,其适宜的烧结压力有限(≤16 MPa),且烧结温度则相对较高(≥930℃),常造成金刚石钻头胎体实际密度与理论密度之比偏低(≤98%),且高烧结温度会对金刚石产生热损伤,从而使钻头难以同时兼顾机械钻速和使用寿命。采用混料回归试验方法优选了2种全预合金成分的孕镶金刚石钻头胎体配方,并以钻头胎体的硬度(HRC)、磨损量和相对密度作为评价指标,分别开展了上述2种配方的烧结温度和烧结压力的单因素试验,以及配方2的烧结温度(930、940、950℃)和烧结压力(17、18、19、20 MPa)优化试验。试验结果表明,钻头胎体试样的最高压入硬度可达30.1(HRC),对应磨损量和相对密度分别为134 mg和99.1%。基于此,采用配方2及其优选的热压烧结工艺参数,试制了3只ø75/49 mm规格的普通双管钻头,并在河南洛阳栾川某金矿钻探现场进行了野外钻进试验,其平均机械钻速达到2.02 m/h,平均使用寿命达到121.4 m。同机台使用的其他厂家的金刚石钻头,其平均机械钻速为1.81 m/h,单只钻头平均使用寿命为89 m。野外钻进试验结果表明,相较于其他厂家的常规孕镶金刚石钻头,采用全预合金配方体系和优化配合的烧结压力与烧结温度制备的孕镶金刚石钻头具有明显的优势,可以同时兼顾高效与长寿命的钻进效果。

孕镶金刚石钻头设计与制造新技术回顾与展望

高性能孕镶金刚石钻头的研制是钻探工程尤其是深部坚硬地层提高钻探效率、降低钻探成本的关键手段之一。本文从钻头胎体、结构和制造工艺3方面综述了孕镶金刚石钻头设计与制造的新技术,针对钻头胎体设计,介绍了胎体对金刚石把持力的调控研究,特别是胎体强化和胎体弱化这2大方向,并阐述了胎体自润滑钻头的设计机理;从唇面结构和水路系统的设计等方面论述了孕镶金刚石钻头结构设计的新思路;讨论了典型孕镶金刚石钻头设计技术,分析了钻头制造工艺现存的问题,并认为未来采用3D打印制造复杂结构孕镶金刚石钻头具有广阔的应用前景。对及时了解和掌握国内外孕镶金刚石钻头设计与制造技术和理论的最新进展,加快高性能孕镶金刚石钻头的研发具有重要意义。