ELECTROLESS PLATING COMPOSITE COATINGS OF Ni-Ti-Re ON THE SURFACE OF DIAMOND

The coating of Ni W P was deposited as base layer, and then the composite coating of Ni Ti(particles) Re(rare earth) was deposited subsequently on the surface of diamond using electroless plating by adding 2～3 μm Ti particles and trace rare earth salt to bath solution. Ti particles deposited on the surface of diamond were found by SEM and formation of TiC was verified by X ray diffraction analysis after heat treatment of the coatings in vacuum at 900 ℃. The binding strength between the coated diamond and the metal matrix was improved effectively in the diamond composite based on metal cement.

Effects of diamond particle size on microstructure and properties of diamond/Al-12Si composites prepared by vacuum-assisted pressure infiltration

Diamond/aluminium composites have attracted attention in the field of thermal management of electronic packaging for their excellent properties.In order to solve the interfacial problem between diamond and aluminium,a novel process combining pressure infiltration with vacuum-assisted technology was proposed to prepare diamond/aluminum composites.The effect of diamond particle size on the microstructure and properties of the diamond/Al-12Si composites was investigated.The results show that the diamond/Al-12Si composites exhibit high relative density and a uniform microstructure.Both thermal conductivity and coefficient of thermal expansion increase with increasing particle size,while the bending strength exhibits the opposite trend.When the average diamond particle size increases from 45μm to 425μm,the thermal conductivity of the composites increases from 455 W·m^(-1)·K^(-1)to 713 W·m^(-1)·K^(-1)and the coefficient of thermal expansion increases from 4.97×10^(-6)K^(-1)to 6.72×10^(-6)K^(-1),while the bending strength decreases from 353 MPa to 246 MPa.This research demonstrates that high-quality composites can be prepared by the vacuum-assisted pressure infiltration process and the thermal conductivity of the composites can be effectively improved by increasing the diamond particle size.

Application of ultra-smooth composite diamond film coated WC-Co drawing dies under water-lubricating conditions

A specific revised HFCVD apparatus and a novel process combining HFCVD and polishing technique were presented to deposit the micro-and nano-crystalline multilayered ultra-smooth diamond（USCD） film on the interior-hole surface of WC-Co drawing dies with aperture ranging from d1.0 mm to 60 mm.Characterization results indicate that the surface roughness values（Ra） in the entry zone,drawing zone and bearing zone of as-fabricated USCD coated drawing die were measured as low as 25.7,23.3 and 25.5 nm,respectively.Furthermore,the friction properties of USCD films were examined in both dry sliding and water-lubricating conditions,and the results show that the USCD film presents much superior friction properties.Its friction coefficients against ball-bearing steel,copper and silicon nitride balls（d4 mm）,is always lower than that of microcrystalline diamond（MCD） or WC-Co sample,regardless of the lubricating condition.Meanwhile,it still presents competitive wear resistance with the MCD films.Finally,the working lifetime and performance of as-fabricated USCD coated drawing dies were examined under producing low-carbon steel pipes in dry-sliding and water-lubricating conditions.Under the water-lubricating drawing condition,its production significantly increases by about 20 times compared with the conventional WC-Co drawing dies.

Properties and microstructure of Cu/diamond composites prepared by spark plasma sintering method

Cu/diamond composites have been considered as the next generation of thermal management material for electronic packages and heat sinks applications. Cu/diamond composites with different volume fractions of diamond were successfully prepared by spark plasma sintering（SPS） method. The sintering temperatures and volume fractions（50%, 60% and 70%） of diamond were changed to investigate their effects on the relative density, homogeneity of the microstructure and thermal conductivity of the composites. The results show that the relative density, homogeneity of the microstructure and thermal conductivity of the composites increase with decreasing the diamond volume fraction; the relative density and thermal conductivity of the composites increase with increasing the sintering temperature. The thermal conductivity of the composites is a result of the combined effect of the volume fraction of diamond, the homogeneity and relative density of the composites.

Effect of heat treatment on microstructure and thermophysical properties of diamond/2024 Al composites

50%diamond particle （5μm） reinforced 2024 aluminum matrix （diamond/2024 Al） composites were prepared by pressure infiltration method. Diamond particles were distributed uniformly without any particle clustering, and no apparent porosities or significant casting defects were observed in the composites. The diamond-Al interfaces of as-cast and annealed diamond/2024 Al composites were clean, smooth and free from interfacial reaction product. However, a large number of Al2Cu precipitates were found at diamond-Al interface after aging treatment. Moreover, needle-shaped Al2MgCu precipitates in Al matrix were observed after aging treatment. The coefficient of thermal expansion （CTE） of diamond/2024 Al composites was about 8.5×10-6 °C-1 between 20 and 100 °C, which was compatible with that with chip materials. Annealing treatment showed little effect on thermal expansion behavior, and aging treatment could further decrease the CTE of the composites. The thermal conductivity of obtained diamond/2024 Al composites was about 100 W/（m？K）, and it was slightly increased after annealing while decreased after aging treatment.

Microstructure and thermophysical properties of SiC/Al composites mixed with diamond

The thermophysical properties of the SiC /Al composites mixed with diamond（SiC-Dia/Al） were studied through theoretical calculation and experiments. The thermal conductivity and the thermal expansion coefficient of the SiC-Dia/Al were calculated by differential effective medium（DEM） theoretical model and extended Turner model, respectively. The microstructure of the SiC-Dia/Al shows that the combination between SiC particles and Al is close, while that between diamond particles and Al is not close. The experimental results of the thermophysical properties of the SiC-Dia/Al are consistent with the calculated ones. The calculation results show that when the volume ratio of the diamond particles to the SiC particles is 3：7, the thermal conductivity and the thermal expansion coefficient can be improved by 39% and 30% compared to SiC/Al composites, respectively. In other words, by adding a small amount of diamond particles, the thermophysical properties of the composites can be improved effectively, while the cost increases little.

Preparation and characterization of diamond film on Cu substrate using Cu-diamond composite interlayer

Large area diamond films were fabricated on copper substrates by a multi-step process comprised of electroplating Cu-diamond composite layer on Cu substrate, plating a Cu layer to fix the protruding diamond particles, and depositing continuous diamond film on composite interlayer by hot-filament chemical vapor deposition （HFCVD）. The interface characteristics, internal stress and adhesion strength were investigated by scanning electron microscopy, Raman analysis and indentation test. The results show that the continuous film without cracks is successfully obtained. The microstructure of the film is a mixture of large cubo-octahedron grains grown from homo-epitaxial growth and small grains with （111） apparent facets grown from lateral second nuclei. The improved adhesion between diamond film and substrate results from the deep anchoring of the diamond particles in the Cu matrix and the low residual stress in the film.

Thermodynamic and kinetic study on interfacial reaction and diamond graphitization of Cu Fe-based diamond composite

Cu-Fe based diamond composites used for saw-blade segments are directly fabricated by vacuum and pressureassisted sintering. The carbide forming elements Cr and Ti are added to improve interfacial bonding between diamond and the Cu-Fe matrix. The interfacial reactions between diamond/graphite and Cr or Ti, and diamond graphitization are investigated by thermodynamics/kinetics analyses and experimental methods. The results show that interfacial reactions and graphitization of diamond can automatically proceed thermodynamically. The Cr3C2, Cr7C3, Cr23C6, and TiC are formed at the interfaces of composites by reactions between diamond and Cr or Ti; diamond graphitization does not occur because of the kinetic difficulty at 1093 K under the pressure of 13 MPa.

Microstructure and thermal conductivity of copper matrix composites reinforced with mixtures of diamond and SiC particles

The thermal conductivity of diamond hybrid SiC/Cu,diamond/Cu and SiC/Cu composite were calculated by using the extended differential effective medium (DEM) theoretical model in this paper.The effects of the particle volume fraction,the particle size and the volume ratio of the diamond particles to the total particles on the thermal conductivity of the composite were studied.The DEM theoretical calculation results show that,for the diamond hybrid SiC/Cu composite,when the particle volume fraction is above 46% and the volume ratio of the diamond particles to the SiC particles is above 13:12,the thermal conductivity of the composite can reach 500 W·m-1·K-1.The thermal conduc-tivity of the composite has little change when the particle size is above 200μm.The experimental results show that Ti can improve the wettability of the SiC and Cu.The thermal conductivity of the diamond hybrid SiCTi/Cu is almost two times better than that of the diamond hybrid SiC/Cu.It is feasible to predict the thermal conductivity of the composite by DEM theoretical model.

Predicted interfacial thermal conductance and thermal conductivity of diamond/Al composites with various interfacial coatings

The interfacial thermal conductance （ITC） and thermal conductivity （TC） of diamond/Al composites with various coatings were theoretically studied and discussed. A series of predictions and numerical analyses were performed to investigate the effect of thickness, sound velocity, and other parameters of coating layers on the ITC and TC. It is found that both the ITC and TC decline with increasing coating thickness, especially for the coatings with relatively low thermal conductivity. Nevertheless, if the coating thickness is close to zero, or quite a small value, the ITC and TC are mainly determined by the constants of the coating material. Under this condition, coatings such as Ni, TiC, Mo 2 C, SiC, and Si can significantly improve the ITC and TC of diamond/Al composites. By contrast, coatings like Ag will exert the negative effect. Taking the optimization of interfacial bonding into account, conductive carbides such as TiC or Mo 2 C with low thickness can be the most suitable coatings for diamond/Al composites.

Selective interfacial bonding and thermal conductivity of diamond/Cu-alloy composites prepared by HPHT technique

Cu-based and Cu-alloy-based diamond composites were made by high-pressure-high-temperature （HPHT） sintering with the aim of maximizing the thermal conductivity of the composites. Improvements in interfacial bonding strength and thermo-physical properties of the composites were achieved using an atomized copper alloy with minor additions of Co, Cr, 13, and Ti. The thermal conductivity （TC） oh- mined exhibited as high as 688 W.m-1.K-1, but also as low as 325 W.m-1.K-l. A large variation in TC can be rationalized by the discrepancy of diamond-matrix interfacial bonding. It was found from fractography that preferential bonding between diamond and the Cu-alloy matrix occurred only on the diamond {100} faces. EDS analysis and Raman spectra suggested that selective interfacial bonding may be attributed to amorphous carbon increasing the wettability between diamond and the Cu-alloy matrix. Amorphous carbon was found to significantly affect the TC of the composite by interface modification.

Effect of sintering parameters on the microstructure and thermal conductivity of diamond/Cu composites prepared by high pressure and high temperature infiltration

Pure Cu composites reinforced with diamond particles were fabricated by a high pressure and high temperature （HPHT） infiltration technique. Their microstructural evolution and thermal conductivity were presented as a function of sintering parameters （temperature, pressure, and time）. The improvement in interfacial bonding strength and the maximum thermM conductivity of 750 W/（m.K） were achieved at the optimal sintering parameters of 1200℃, 6 GPa and 10 min. It is found that the thermal conductivity of the composites depends strongly on sintering pressure. When the sintering pressure is above 6 GPa, the diamond skeleton is detected, which greatly contributes to the excellent thermal conductivity.

Effects of Rare Earth and Hot Pressing Sintering Temperature on the Transverse Rupture Strength of Fe-based Diamond Composites

Effects of sintering temperature in hot pressing, t yp es, states and amounts of rare earth as well as TiH 2 on the transverse rupture strength (TRS) of Fe-based composites are studied by means of orthogonal test and variance analysis in this paper. It is found that sintering temperature has a significant effect on the TRS of Fe-based diamond composites. The optimal sin tering temperature is 780～860 ℃. On the contrary, the effects of RE additi v es on values of TRS of the diamond composites have on distinct difference no mat ter the RE is in the state of mixture or compound or oxidization. Experimental r esults demonstrate that Fe-based diamond composites with RE additives exhibit h igher TRS, which results in an increase in diamond retention capacity. The degre e of increment of TRS is different at different sintering temperatures. The opti mal amount of rare earth was found to be about 1% in weight. The effect of RE is more significant at lower sintering temperature. The experimental results also reveal that TiH 2 additive has a negative effect on the TRS of Fe-based compos ites. Microscope observations demonstrate that specimen without TiH 2 additives , shows fewer pores and denser structures in the base metal. It can also be seen from the SEM observation of the resulting fracturing surface of bending test sp ecimens that the bonding of the diamond-matrix interface is better in the speci men without TiH 2 than in the specimen with TiH 2. Also the fracture surface o f the specimen without TiH 2 reveals ductile cup and cone behavior.

Pressure infiltrated Cu/diamond composites for LED applications

Diamond reinforced copper （Cu/diamond） composites were prepared by a pressure infilla＇ation technique. The composites show a super high conductivity of 713 W.m-1.K-1 in combination with an extremely low coefficient of thermal expansion （CTE） of 7.72 × 10-6 K-1 （25-100℃）, which are achieved by modifying the copper matrix with adding 0.3 wt.% of boron to get a good thermal contact between the matrix and the diamond particles. By adopting a series of postmachining techniques the composites were made into near-net-shape parts, and an electroless silver coating was also successfully plated on the composites. Finally, their potential applications in the thermal management of fight emitting diodes （LED） were illustrated via prototype examples.

Thermal conductivity of diamond/copper composites with a bimodal distribution of diamond particle sizes prepared by pressure infiltration method

The thermal conductivity of diamond/copper composites with bimodal particle sizes was studied. The composites were prepared through pressure infiltration of liquid copper into diamond preforms with a mixture of 40 and 100 pm-size diamonds. The permeability of the preforms with different coarse-to-fine volume ratios of diamonds was investigated. The thermal conductivity of the diamond/copper composites with bimodal size distribution was compared to the theoretical value derived from an analytical model developed by Chu. It is predicted that the diamond/copper composites could reach a higher thermal conductivity and their surface roughness could be improved by applying bimodal diamond particle sizes.

Microstructural evolution and thermal conductivity of diamond/Al composites during thermal cycling

The microstructural evolution and performance of diamond/Al composites during thermal cycling has rarely been investigated.In the present work,the thermal stability of diamond/Al composites during thermal cycling for up to 200 cycles was explored.Specifically,the thermal conductivity(λ)of the composites was measured and scanning electron microscopy of specific areas in the same samples was carried out to achieve quasi-in situ observations.The interface between the(100)plane of diamond and the Al matrix was well bonded with a zigzag morphology and abundant needle-like Al4C3 phases.By contrast,the interface between the(111)plane of diamond and the Al matrix showed weak bonding and debonded during thermal cycling.The debonding length increased rapidly over the first 100 thermal cycles and then increased slowly in the following 100 cycles.Theλof the diamond/Al composites decreased abruptly over the initial 20 cycles,increased afterward,and then decreased monotonously once more with increasing number of thermal cycles.Decreases in theλof the Al matrix and the corresponding stress concentration at the diamond/Al interface caused by thermal mismatch,rather than interfacial debonding,may be the main factors influencing the decrease inλof the diamond/Al composites,especially in the initial stages of thermal cycling.

Fabrication and Characterization of FeNiCr Matrix-TiC Composite for Polishing CVD Diamond Film

Dynamic friction polishing （DFP） is one of the most promising methods appropriate for polishing CVD diamond film with high efficiency and low cost. By this method CVD diamond film is polished through being simply pressed against a metal disc rotating at a high speed utilizing the thermochemical reaction occurring as a result of dynamic friction between them in the atmosphere. However, the relatively soft materials such as stainless steel, cast iron and nickel alloy widely used for polishing CVD diamond film are easy to wear and adhere to diamond film surface, which may further lead to low efficiency and poor polishing quality. In this paper, FeNiCr matrix-TiC composite used as grinding wheel for polishing CVD diamond film was obtained by combination of mechanical alloying （MA） and spark plasma sintering （SPS）. The process of ball milling, composition, density, hardness, high-temperature oxidation resistance and wear resistance of the sintered piece were analyzed. The results show that TiC was introduced in MA-SPS process and had good combination with FeNiCr matrix and even distribution in the matrix. The density of composite can be improved by mechanical alloying. The FeNiCr matrix-TiC composite obtained at 1273 K was found to be superior to at 1173 K sinterin8 in hardness, high-temperature oxidation resistance and wearability. These properties are more favorable than SUS304 for the preparation of high-performance grinding wheel for polishing CVD diamond film.

Preparation and thermal conductivity of tungsten coated diamond/copper composites

Tungsten was plated on the surface of diamond by using thermal diffusion method.Different process parameters were employed to prepare the composites with tungsten,diamond and copper.The micro morphology of different samples was observed,and the thermal conductivity of samples was measured by laser flash method.The optimal process parameters for preparing diamond/copper composites with high thermal conductivity were investigated.The results indicated that plating tungsten on diamond could modify the interface bonding.When the diamond was plated for 60 min,the coating appeared intact,uniform and flat,and the thermal conductivity of the sample could reach as high as 486 W/(m·K).The integrity and uniformity were more important than thickness for the coating.When the tungsten-plated diamond was further annealed,the metallurgical bonding between the coating and the diamond was enhanced,and the thermal conductivity rose to 559 W/(m·K).

Low-temperature heat conduction characteristics of diamond/Cu composite by pressure infiltration method

In this paper,diamond/CuCr and diamond/CuB composites were prepared using the pressure infiltration method.The physical property measurement system(PPMS)was adopted to evaluate the thermal conductivity of diamond/Cu and MoCu composites within the range of100–350 K,and a scanning electron microscope(SEM)was utilized to analyze the microstructure and fracture appearance of the materials.The research indicates that the thermal conductivity of diamond/Cu composite within the range of100–350 K is 2.5–3.0 times that of the existing MoCu material,and the low-temperature thermal conductivity of diamond/Cu composite presents an exponential relationship with the temperature.If B element was added to a Cu matrix and a low-temperature binder was used for prefabricated elements,favorable interfacial adhesion,relatively high interfacial thermal conductivity,and favorable low-temperature heat conduction characteristics would be apparent.

Influence of Li2O Addition on the Performance of Vitrified Bond and Vitrified Diamond Composites

In order to develop high-performance diamond wheels,the vitrified bond with different contents of Li2O addition and corresponding diamond composites were prepared.The experimental results show that the addition of a small content of Li2O leads the formation of the mullite phase in vitrified bond.When the Li2O content is 3wt%,the mullite content in the vitrified bond reaches the maximum.Whereas,the vitrified bond turns into a pure glass phase when the Li2O content further increases to 5wt%.The softening temperature of vitrified bond,wetting angle between the vitrified bond and the diamond film decrease with the increasing of the Li2O content.The softening point of the vitrified bond with 5wt% Li2O is 537 ℃ and the contact angle is 32°,which are 44 ℃ and 44° lower than those of the sample without Li2O.The CTE (coefficient of thermal expansion),the flexural strength and hardness of the diamond composite sample first increase and then decrease with the increasing of the Li2O content.When the Li2O addition is 3wt%,the flexural strength and hardness of the composites reaches the maximum values of 93 MPa and 98 HRB,respectively,which are 43.1% and 12.6% higher than those of the sample without Li2O.