Effects of diamond particle size on microstructure and properties of diamond/Al-12Si composites prepared by vacuum-assisted pressure infiltration

Diamond/aluminium composites have attracted attention in the field of thermal management of electronic packaging for their excellent properties.In order to solve the interfacial problem between diamond and aluminium,a novel process combining pressure infiltration with vacuum-assisted technology was proposed to prepare diamond/aluminum composites.The effect of diamond particle size on the microstructure and properties of the diamond/Al-12Si composites was investigated.The results show that the diamond/Al-12Si composites exhibit high relative density and a uniform microstructure.Both thermal conductivity and coefficient of thermal expansion increase with increasing particle size,while the bending strength exhibits the opposite trend.When the average diamond particle size increases from 45μm to 425μm,the thermal conductivity of the composites increases from 455 W·m^(-1)·K^(-1)to 713 W·m^(-1)·K^(-1)and the coefficient of thermal expansion increases from 4.97×10^(-6)K^(-1)to 6.72×10^(-6)K^(-1),while the bending strength decreases from 353 MPa to 246 MPa.This research demonstrates that high-quality composites can be prepared by the vacuum-assisted pressure infiltration process and the thermal conductivity of the composites can be effectively improved by increasing the diamond particle size.

电子封装用diamond/Al复合材料研究进展

Diamond/Al复合材料作为第四代电子封装材料,具有高热导率、低热膨胀系数和低密度等优良性能,成为研究重点。论述diamond/Al复合材料研究概况,分析挤压铸造、浸渗法和放电等离子烧结制备方法的优点和缺点,讨论热导率和热膨胀系数等热物理性能的影响因素,并对其发展前景进行展望。

Predicted interfacial thermal conductance and thermal conductivity of diamond/Al composites with various interfacial coatings

The interfacial thermal conductance （ITC） and thermal conductivity （TC） of diamond/Al composites with various coatings were theoretically studied and discussed. A series of predictions and numerical analyses were performed to investigate the effect of thickness, sound velocity, and other parameters of coating layers on the ITC and TC. It is found that both the ITC and TC decline with increasing coating thickness, especially for the coatings with relatively low thermal conductivity. Nevertheless, if the coating thickness is close to zero, or quite a small value, the ITC and TC are mainly determined by the constants of the coating material. Under this condition, coatings such as Ni, TiC, Mo 2 C, SiC, and Si can significantly improve the ITC and TC of diamond/Al composites. By contrast, coatings like Ag will exert the negative effect. Taking the optimization of interfacial bonding into account, conductive carbides such as TiC or Mo 2 C with low thickness can be the most suitable coatings for diamond/Al composites.

Microstructural evolution and thermal conductivity of diamond/Al composites during thermal cycling

The microstructural evolution and performance of diamond/Al composites during thermal cycling has rarely been investigated.In the present work,the thermal stability of diamond/Al composites during thermal cycling for up to 200 cycles was explored.Specifically,the thermal conductivity(λ)of the composites was measured and scanning electron microscopy of specific areas in the same samples was carried out to achieve quasi-in situ observations.The interface between the(100)plane of diamond and the Al matrix was well bonded with a zigzag morphology and abundant needle-like Al4C3 phases.By contrast,the interface between the(111)plane of diamond and the Al matrix showed weak bonding and debonded during thermal cycling.The debonding length increased rapidly over the first 100 thermal cycles and then increased slowly in the following 100 cycles.Theλof the diamond/Al composites decreased abruptly over the initial 20 cycles,increased afterward,and then decreased monotonously once more with increasing number of thermal cycles.Decreases in theλof the Al matrix and the corresponding stress concentration at the diamond/Al interface caused by thermal mismatch,rather than interfacial debonding,may be the main factors influencing the decrease inλof the diamond/Al composites,especially in the initial stages of thermal cycling.

Microstructure and thermal expansion of Ti coated diamond/Al composites

A titanium coating fabricated via vacuum vapor deposition for diamond/Al composites was used to improve the interfacial bonding strength between diamond particles and Al matrix,and the Ti coated diamond particles reinforced Al matrix composites were prepared by gas pressure infiltration for electronic packaging.The surface structure of the Ti coated diamond particles was investigated by XRD and SEM.The interfacial characteristics and fracture surfaces were observed by SEM and EDS.The coefficient of thermal expansion(CTE)of 50%(volume fraction)Ti coated diamond particles reinforced Al matrix composites was measured. The Ti coating on diamond before infiltration consists of inner TiC layer and outer TiO2 layer,and the inner TiC layer is very stable and cannot be removed during infiltration process.Fractographs of the composites illustrate that aluminum matrix fracture is the dominant fracture mechanism,and the stepped breakage of a diamond particle indicates strong interfacial bonding between the Ti coated diamond particles and the Al matrix.The measured low CTEs(5.07×10-6-9.27×10 -6K -1)of the composites also show the strong interfacial bonding between the Ti coated diamond particles and the Al matrix.

Revealing the atomic mechanism of diamond–iron interfacial reaction

Diamond,with ultrahigh hardness,high wear resistance,high thermal conductivity,and so forth,has attracted worldwide attention.However,researchers found emergent reactions at the interfaces between diamond and ferrous materials,which significantly affects the performance of diamond-based devices.Herein,combing experiments and theoretical calculations,taking diamond–iron(Fe)interface as a prototype,the counter-diffusion mechanism of Fe/carbon atoms has been established.Surprisingly,it is identified that Fe and diamond first form a coherent interface,and then Fe atoms diffuse into diamond and prefer the carbon vacancies sites.Meanwhile,the relaxed carbon atoms diffuse into the Fe lattice,forming Fe_(3)C.Moreover,graphite is observed at the Fe_(3)C surface when Fe_(3)C is over-saturated by carbon atoms.The present findings are expected to offer new insights into the atomic mechanism for diamondferrous material's interfacial reactions,benefiting diamond-based device applications.

Precipitates Generation Mechanism and Surface Quality Improvement for Aluminum Alloy 6061 in Diamond Cutting

To improve the surface quality for aluminum alloy 6061(Al6061) in ultra-precision machining, we investigated the factors affecting the surface finish in single point diamond turning(SPDT)by studying influence of the precipitates generation of Al6061 on surface integrity and surface roughness.Based on the Johnson-Mehl-Avrami solid phase transformation kinetics equation, theoretical and experimental studies were conducted to build the relationship between the aging condition and the type, size and number of the precipitates for Al6061. Diamond cutting experiments were conducted to machine Al6061 samples under different aging conditions. The experimental results show that, the protruding on the chip surface is mainly Mg_(2)Si and the scratches on the machined surface mostly come from the iron-containing phase(α-, β-AlFeSi).Moreover, the generated Mg_(2)Si and α-, β-AlFeSi affect the surface integrity and the diamond turned surface roughness. Especially, the achieved surface roughness in SPDT is consistent with the variation of the number of AlFeSi and Mg_(2)Si with the medium size(more than 1 μm and less than 2 μm) in Al6061.

Growth of two-inch free-standing heteroepitaxial diamond on Ir/YSZ/Si(001)substrates via laser-patterned templates

As an ultra-wide bandgap semiconductor,diamond garners significant interest due to its exceptional physical properties^([1–3]).These superior characteristics make diamonds highly promising for applications in power electronics^([4]),deep-ultraviolet detectors^([5]),high-energy particle detectors^([6]),and quantum devices based on color centers^([7]).

Observation of flat-band localized state in a one-dimensional diamond momentum lattice of ultracold atoms

We investigated the one-dimensional diamond ladder in the momentum lattice platform. By inducing multiple twoand four-photon Bragg scatterings among specific momentum states, we achieved a flat band system based on the diamond model, precisely controlling the coupling strength and phase between individual lattice sites. Utilizing two lattice sites couplings, we generated a compact localized state associated with the flat band, which remained localized throughout the entire time evolution. We successfully realized the continuous shift of flat bands by adjusting the corresponding nearest neighbor hopping strength, enabling us to observe the complete localization process. This opens avenues for further exploration of more complex properties within flat-band systems, including investigating the robustness of flat-band localized states in disordered flat-band systems and exploring many-body localization in interacting flat-band systems.

Rational design of diamond through microstructure engineering:From synthesis to applications

Diamond possesses excellent thermal conductivity and tunable bandgap.Currently,the high-pressure,high-temperature,and chemical vapor deposition methods are the most promising strategies for the commercial-scale production of synthetic diamond.Although diamond has been extensively employed in jewelry and cutting/grinding tasks,the realization of its high-end applications through microstructure engineering has long been sought.Herein,we discuss the microstructures encountered in diamond and further concentrate on cutting-edge investigations utilizing electron microscopy techniques to illuminate the transition mechanism between graphite and diamond during the synthesis and device constructions.The impacts of distinct microstructures on the electrical applications of diamond,especially the photoelectrical,electrical,and thermal properties,are elaborated.The recently reported elastic and plastic deformations revealed through in situ microscopy techniques are also summarized.Finally,the limitations,perspectives,and corresponding solutions are proposed.

Edge effect during microwave plasma chemical vapor deposition diamond-film:Multiphysics simulation and experimental verification

This study focused on the investigation of the edge effect of diamond films deposited by microwave plasma chemical vapor de-position.Substrate bulge height△h is a factor that affects the edge effect,and it was used to simulate plasma and guide the diamond-film deposition experiments.Finite-element software COMSOL Multiphysics was used to construct a multiphysics(electromagnetic,plasma,and fluid heat transfer fields)coupling model based on electron collision reaction.Raman spectroscopy and scanning electron microscopy were performed to characterize the experimental growth and validate the model.The simulation results reflected the experimental trends observed.Plasma discharge at the edge of the substrate accelerated due to the increase in△h(△h=0-3 mm),and the values of electron density(n_(c)),molar concentration of H(C_(H)),and molar concentration of CH_(3)(C_(CH_(3)))doubled at the edge(for the special concave sample with△h=−1 mm,the active chemical groups exhibited a decreased molar concentration at the edge of the substrate).At=0-3 mm,a high diamond growth rate and a large diamond grain size were observed at the edge of the substrate,and their values increased with.The uniformity of film thickness decreased with.The Raman spectra of all samples revealed the first-order characteristic peak of dia-mond near 1332 cm^(−1).When△h=−1 mm,tensile stress occurred in all regions of the film.When△h=1-3 mm,all areas in the film ex-hibited compressive stress.

Effects of Diamond on the Mechanical Properties and Thermal Conductivity of Si_(3)N_(4)Composites Fabricated Using Spark Plasma Sintering

Micrometer-sized diamonds were incorporated into silicon nitride(Si_(3)N_(4))matrix to manufacture high-performance Si_(3)N_(4)-based composites using spark plasma sintering at 1500℃under 50 MPa.The effects of the diamond content on the phase composition,microstructure,mechanical properties and thermal conductivity of the composites were investigated.The results showed that the addition of diamond could effectively improve the hardness of the material.The thermal conductivity of Si_(3)N_(4)increased to 52.97 W/m·k at the maximum with the addition of 15 wt%diamond,which was 27.5%higher than that of the monolithic Si_(3)N_(4).At this point,the fracture toughness was 7.54 MPa·m^(1/2).Due to the addition of diamond,the composite material generated a new substance,MgSiN2,which effectively combined Si_(3)N_(4)with diamond.MgSiN2 might improve the hardness and thermal conductivity of the materials.

Investigation on photonic crystal nanobeam cavity based on mixed diamond–circular holes

A photonic crystal nanobeam cavity(M-PCNC)with a structure incorporating a mixture of diamond-shaped and circular air holes is pro-posed.The performance of the cavity is simulated and studied theoretically.Using thefinite-difference time-domain method,the parameters of the M-PCNC,including cavity thickness and width,lattice constant,and radii and numbers of holes,are optimized,with the quality factor Q and mode volume Vm as performance indicators.Mutual modulation of the lattice constant and hole radius enable the proposed M-PCNC to realize outstanding performance.The optimized cavity possesses a high quality factor Q 1.45105 and an ultra-small mode=×volume Vm 0.01(λ/n)[Zeng et al.,Opt Lett 2023:48;3981–3984]in the telecommunications wavelength range.Light can be progres-=sively squeezed in both the propagation direction and the perpendicular in-plane direction by a series of interlocked anti-slots and slots in the diamond-shaped hole structure.Thereby,the energy can be confined within a small mode volume to achieve an ultra-high Q/Vm ratio.

Al含量提高对IN 617合金持久性能及组织稳定性的影响

采用高温持久实验、扫描电镜(SEM)及透射电镜(TEM)等研究了Al含量提高对IN 617合金持久性能及组织稳定性的影响。结果表明:Al含量提高后,基于超过4万小时的实验数据,IN 617合金700℃、10万小时的外推持久强度超过170 MPa,持久性能显著提高,合金的持久断裂机制仍以微孔聚集长大为主;Al含量的提高会明显促进IN 617合金中γ′相的析出,提高其含量,同时也会促进合金中μ相和σ相等TCP相(Topologically close-packed phases)的析出,从而提高合金的硬度与持久性能,但尚未发现TCP相会对合金持久强度产生不利影响;时效处理时间越长,晶界析出相尺寸越大且愈加连续,致使晶界结合强度降低,而Al含量的提高又会提高晶内强度。二者共同作用,会使IN 617合金的持久塑性降低。

Al-Mg系合金中合金化元素作用及其对力学性能的影响

铝镁合金是轻量化材料应用领域中一种重要的金属材料,属于中高强度铝合金,具有较高的塑性、良好的耐蚀性以及优良的焊接性等优势,目前在航空航天、交通运输和军工制造等领域具有广阔的应用前景。笔者综述了铝镁合金力学性能特点以及用途,介绍了Al-Mg系合金中的强化机制,重点阐述了Al-Mg系合金中主合金化元素Mg及其含量对合金微观组织和力学性能的影响规律及机理,详细论述了Mn、Zr、Ti、Sc、Er、Y等微合金化元素的作用以及对Al-Mg系合金微观组织和力学性能的影响规律。最后,结合Al-Mg系合金当前研究现状,提出了今后值得研究的方向。

超声振动辅助车削SiCp/Al切屑形成机理及表面粗糙度研究

目的研究切屑形成机理对加工过程的影响。方法超声振动辅助车削技术通过刀具振动的拟间歇切削特征控制切屑尺寸和切屑形态,从而提高了加工表面质量。针对SiCp/Al复合材料的切屑形成机理,探究常规车削和超声振动辅助车削的切屑形成过程。研究了颗粒分布对第一变形区变形阶段的影响,以及不同加工方式下切削参数对切屑形态的影响。最后,描述了切屑自由表面和刀-屑接触界面的颗粒损伤形式,以直观地描述常规车削与超声振动辅助车削SiCp/Al复合材料加工中切屑的形成过程。结果通过测试加工后工件表面形貌发现超声振动辅助车削的切屑更加连续、切屑尺寸较小的加工表面粗糙度更小,常规车削的表面粗糙度为0.805μm,超声振动辅助车削的表面粗糙度为0.404μm,超声振动辅助车削比常规车削的表面粗糙度降低了49.8%。结论与常规车削相比,超声振动辅助车削有利于减小切屑厚度。超声振动辅助车削得到的切屑更加连续,避免了切屑碎裂,促进了切屑的顺利排出。通过对切屑形态进行研究,选择最优切削参数可以有效提高工件表面质量。

超声振动辅助切削SiCp/Al复合材料的加工机理及试验

切削加工过程中材料损伤形式对加工表面质量会产生较大影响,现有仿真分析难以模拟真实颗粒失效行为,通过建立二维微观多相有限元模型能够深入了解材料损伤与表面质量的关系。基于常规切削(Conventional cutting,CC)与超声振动辅助切削(Ultrasonic vibration-assisted cutting,UVAC)两种加工方式,通过有限元仿真软件Abaqus对20%SiCp/Al复合材料的切削过程进行仿真模拟,阐释加工过程中刀具与工件的相互作用机理,并在同一参数下验证有限元仿真的准确性。通过设计单因素试验,对比两种加工方式及不同加工参数对切削力和表面粗糙度的影响规律,得出最佳加工参数组合,并对最佳加工参数下表面形貌进行分析。模拟和试验结果表明,SiC颗粒断裂、颗粒耕犁、颗粒拔出以及Al基体撕裂是影响SiCp/Al复合材料加工质量的主要原因,刀具与颗粒不同的相对作用位置会产生不同的损伤形式。与常规切削相比,施加超声振动后可以有效抑制颗粒失效和基体损伤,使加工中的平均切削力(主切削力)降低33%,工件已加工表面粗糙度值最大减小量为531 nm,显著提高了表面质量。所建立的二维微观多相有限元模型,能够有效模拟铝基复合材料的加工缺陷和裂纹损伤问题,对提高难加工材料的高质量表面制备有重要借鉴意义。

镀铝对CoCrNiAlY-YSZ-LaMgAl_(11)O_(19)双陶瓷热障涂层高温抗氧化行为的影响

采用电弧离子镀(AIP)技术在CoCrNiAlY-YSZ-LaMA双陶瓷涂层表面沉积一层Al镀层,利用XRD、SEM和EDS等微尺度分析表征方法,全面解析涂层在大气暴露过程中的高温氧化行为。研究结果表明,未镀铝LaMA层在氧化过程中发生严重体积收缩,导致纵向微裂纹萌生和扩展。这些微裂纹成为氧气向内部扩散的通道,导致涂层呈现持续氧化增重趋势、TGO快速生长和严重的元素扩散,并最终加剧涂层断裂失效。但镀铝涂层样品表现出更好的高温抗氧化性能与结构稳定性,高温氧化过程中,表面Al镀层与氧气发生原位反应生成致密Al2O3屏障层,有效阻止或延迟氧气内部渗透,使TGO缓慢生长,其氧化增重从20h时的8.59mg/cm^(2)略微上升到80h时的9.46mg/cm^(2)。本研究结果为双陶瓷热障涂层的延寿设计与界面热生长应力调控开辟出全新技术途径和理论视野。

粉末套管法Ti/Al/Ti复合板的界面结合性能

采用粉末套管法,通过“热轧+中间退火+进一步冷轧”工艺制备Ti/Al/Ti复合板。利用扫描电镜、电子探针、能谱仪、XRD分析以及万能实验机,研究不同制备参数下Ti/Al/Ti复合带材的界面形貌、元素分布、物相种类和界面结合强度。结果表明,单一脆性金属间化合物TiAl_(3)的产生会阻碍Ti/Al元素的扩散,扩散层厚度发生减薄。500℃退火,扩散层主要是由扩散形成的冶金结合层,局部区域有少量的金属间化合物TiAl_(3)生成,界面结合强度受冶金结合强度与机械结合强度的动态变化影响,随着压下率升高,结合强度先降低后升高再降低;550℃退火,界面反应增强,TiAl_(3)相逐渐增多,扩散层强度增加,冶金结合强度提高,由14.3 N/mm(500℃)增加至35.1 N/mm(550℃),随着压下率的增大,化合物层破碎程度增加,界面结合强度逐渐降低。

SiCp/Al复合材料纳米压痕/划痕下的脆塑性行为研究

为探究SiCp/Al复合材料中两相材料相互作用引起的力学性能差异,研究微观尺度下法向载荷变化对SiCp/Al复合材料形变和去除的影响。采用纳米压痕实验,基于Oliver-Pharr法测得其硬度和弹性模量,并对其压痕表面进行观察,结合有限元仿真分析产生力学性能差异的原因;同时,根据纳米压痕实验所得力学参数进行变载荷纳米划痕仿真,并配合实验后划痕表面观察结果分析材料的形变和脆塑性行为。结果表明:当金刚石压头作用于SiC颗粒时,颗粒出现破碎和二次压入现象,所测硬度与弹性模量小于单晶SiC的理论值;当金刚石压头作用于基体相时,由于SiC颗粒阻碍基体压入,复合材料的硬度与弹性模量测量结果偏大。在纳米划痕过程中,复合材料的去除形式随载荷变化体现为划擦、耕犁和切削阶段,其中的基体相通过塑性流动产生塑性脊堆积并伴随有涂覆现象,SiC颗粒则以脱黏、断裂破碎和拔出等脆性机制而去除,且SiC颗粒的二次压入、断裂、破碎和拔出是导致复合材料力学性能与单晶SiC的力学性能产生巨大差异的主要原因。随着划痕载荷增加,SiC体积分数为45%的SiCp/Al复合材料的去除机制更多取决于以塑性去除为主的基体相,而SiC颗粒则主要表现为脆性去除。