Low-temperature heat conduction characteristics of diamond/Cu composite by pressure infiltration method

In this paper,diamond/CuCr and diamond/CuB composites were prepared using the pressure infiltration method.The physical property measurement system(PPMS)was adopted to evaluate the thermal conductivity of diamond/Cu and MoCu composites within the range of100–350 K,and a scanning electron microscope(SEM)was utilized to analyze the microstructure and fracture appearance of the materials.The research indicates that the thermal conductivity of diamond/Cu composite within the range of100–350 K is 2.5–3.0 times that of the existing MoCu material,and the low-temperature thermal conductivity of diamond/Cu composite presents an exponential relationship with the temperature.If B element was added to a Cu matrix and a low-temperature binder was used for prefabricated elements,favorable interfacial adhesion,relatively high interfacial thermal conductivity,and favorable low-temperature heat conduction characteristics would be apparent.

Effect of sintering parameters on the microstructure and thermal conductivity of diamond/Cu composites prepared by high pressure and high temperature infiltration

Pure Cu composites reinforced with diamond particles were fabricated by a high pressure and high temperature （HPHT） infiltration technique. Their microstructural evolution and thermal conductivity were presented as a function of sintering parameters （temperature, pressure, and time）. The improvement in interfacial bonding strength and the maximum thermM conductivity of 750 W/（m.K） were achieved at the optimal sintering parameters of 1200℃, 6 GPa and 10 min. It is found that the thermal conductivity of the composites depends strongly on sintering pressure. When the sintering pressure is above 6 GPa, the diamond skeleton is detected, which greatly contributes to the excellent thermal conductivity.

Effect of sintering on the relative density of Cr-coated diamond/Cu composites prepared by spark plasma sintering

Cr-coated diamond/Cu composites were prepared by spark plasma sintering. The effects of sintering pressure, sintering temperature, sintering duration, and Cu powder particle size on the relative density and thermal conductivity of the composites were investigated in this paper. The influence of these parameters on the properties and microstructures of the composites was also discussed. The results show that the relative density of Cr-coated diamond/Cu reaches ~100% when the composite is gradually compressed to 30 MPa during the heating process. The densification temperature increases from 880 to 915℃ when the diamond content is increased from 45vol% to 60vol%. The densification temperature does not increase further when the content reaches 65vol%. Cu powder particles in larger size are beneficial for increasing the relative density of the composite.

Thermal Physical Properties of Al-coated Diamond/Cu Composites

To acquire a well bonded interface between the copper and the diamond particles in diamondcopper matrix composites, an available process to apply a vapor deposited aluminum（Al） coating onto diamond particles was used to solve this interfacial problem. The diamond-copper matrix composites were prepared by spark plasma sintering（SPS） process and the effect of Al-coated diamond particles was demonstrated. The experimental results showed that the densification, interfacial bonding and thermal conductivity of Al-coated composites were evidently improved compared to those of the uncoated composites. A maximum thermal conductivity（TC） of 565 W/（m·K） was obtained in the coated composite containing 50vol% diamond particles sintered at 1163 K. Additionally, the experimental data of thermal conductivity and coefficient of thermal expansion（CTE） were compared with the predictions from several theoretical models.

Effects of diamond particle size on microstructure and properties of diamond/Al-12Si composites prepared by vacuum-assisted pressure infiltration

Diamond/aluminium composites have attracted attention in the field of thermal management of electronic packaging for their excellent properties.In order to solve the interfacial problem between diamond and aluminium,a novel process combining pressure infiltration with vacuum-assisted technology was proposed to prepare diamond/aluminum composites.The effect of diamond particle size on the microstructure and properties of the diamond/Al-12Si composites was investigated.The results show that the diamond/Al-12Si composites exhibit high relative density and a uniform microstructure.Both thermal conductivity and coefficient of thermal expansion increase with increasing particle size,while the bending strength exhibits the opposite trend.When the average diamond particle size increases from 45μm to 425μm,the thermal conductivity of the composites increases from 455 W·m^(-1)·K^(-1)to 713 W·m^(-1)·K^(-1)and the coefficient of thermal expansion increases from 4.97×10^(-6)K^(-1)to 6.72×10^(-6)K^(-1),while the bending strength decreases from 353 MPa to 246 MPa.This research demonstrates that high-quality composites can be prepared by the vacuum-assisted pressure infiltration process and the thermal conductivity of the composites can be effectively improved by increasing the diamond particle size.

Recent Advances in Interface Modification of Cu/graphite Composites and Layered Ternary Carbides of Modified Layer Candidate

We review the fundamental properties and significant issues related to Cu/graphite composites.In particular,recent research on the interfacial modification of Cu/graphite composites is addressed,including the metal-modified layer,carbide-modified layer,and combined modified layer.Additionally,we propose the use of ternary layered carbide as an interface modification layer for Cu/graphite composites.

Properties and microstructure of Cu/diamond composites prepared by spark plasma sintering method

Cu/diamond composites have been considered as the next generation of thermal management material for electronic packages and heat sinks applications. Cu/diamond composites with different volume fractions of diamond were successfully prepared by spark plasma sintering（SPS） method. The sintering temperatures and volume fractions（50%, 60% and 70%） of diamond were changed to investigate their effects on the relative density, homogeneity of the microstructure and thermal conductivity of the composites. The results show that the relative density, homogeneity of the microstructure and thermal conductivity of the composites increase with decreasing the diamond volume fraction; the relative density and thermal conductivity of the composites increase with increasing the sintering temperature. The thermal conductivity of the composites is a result of the combined effect of the volume fraction of diamond, the homogeneity and relative density of the composites.

Preparation and characterization of diamond film on Cu substrate using Cu-diamond composite interlayer

Large area diamond films were fabricated on copper substrates by a multi-step process comprised of electroplating Cu-diamond composite layer on Cu substrate, plating a Cu layer to fix the protruding diamond particles, and depositing continuous diamond film on composite interlayer by hot-filament chemical vapor deposition （HFCVD）. The interface characteristics, internal stress and adhesion strength were investigated by scanning electron microscopy, Raman analysis and indentation test. The results show that the continuous film without cracks is successfully obtained. The microstructure of the film is a mixture of large cubo-octahedron grains grown from homo-epitaxial growth and small grains with （111） apparent facets grown from lateral second nuclei. The improved adhesion between diamond film and substrate results from the deep anchoring of the diamond particles in the Cu matrix and the low residual stress in the film.

Revealing the Role of Defect in 3D Graphene-Based Photocatalytic Composite for Efficient Elimination of Antibiotic and Heavy Metal Combined Pollution

Defect engineering can give birth to novel properties for adsorption and photocatalysis in the control of antibiotics and heavy metal combined pollution with photocatalytic composites.However,the role of defects and the process mechanism are complicated and indefinable.Herein,TiO_(2)/CN/3DC was fabricated and defects were introduced into the tripartite structure with separate O_(2)plasma treatment for the single component.We find that defect engineering can improve the photocatalytic activity,attributing to the increase of the contribution from h^(+)and OH.In contrast to TiO_(2)/CN/3DC with a photocatalytic tetracycline removal rate of 75.2%,the removal rate of TC with D-TiO_(2)/CN/3DC has increased to 88.5%.Moreover,the reactive sites of tetracycline can be increased by adsorbing on the defective composites.The defect construction on TiO_(2)shows the advantages in tetracycline degradation and Cu^(2+)adsorption,but also suffers significant inhibition for the tetracycline degradation in a tetracycline/Cu^(2+)combined system.In contrast,the defect construction on graphene can achieve the cooperative removal of tetracycline and Cu^(2+).These findings can provide new insights into water treatment strategies with defect engineering.

Investigation on the Novel High-performance Copper/Graphene Composite Conductor for High Power Density Motor

High-performance Cu/Graphene composite wire synergistically strengthened by nano Cr_(3)C_(2) phase was directly synthesized via hot press sintering followed by severe cold plastic deformation, using liquid paraffin and CuCr alloy powder as the raw materials. Since graphene is in situ formed under the catalysis of copper powder during the sintering process, the problem that graphene is easy to agglomerate and difficult to disperse uniformly in the copper matrix has been solved. The nano Cr_(3)C_(2)-particles nailed at the interface favor to improve the interface bonding. The Cu/Graphene composite possesses high electrical conductivity, hardness, and plasticity. The composite wire exhibits high electrical conductivity of 96.93% IACS, great tensile strength of 488MPa, and excellent resistance to softening. Even after annealing at 400℃ for 1 h, the tensile strength can still reach 268 MPa with a conductivity of about 99.14% IACS.The wire's temperature coefficient of resistance(TCR) is largely reduced to 0.0035/℃ due to the complex structure,which leads the wire to present low resistivity at higher temperatures. Such Cu/Graphene composite wire with excellent comprehensive performance has a good application prospect in high-power density motors.

Selective interfacial bonding and thermal conductivity of diamond/Cu-alloy composites prepared by HPHT technique

Cu-based and Cu-alloy-based diamond composites were made by high-pressure-high-temperature （HPHT） sintering with the aim of maximizing the thermal conductivity of the composites. Improvements in interfacial bonding strength and thermo-physical properties of the composites were achieved using an atomized copper alloy with minor additions of Co, Cr, 13, and Ti. The thermal conductivity （TC） oh- mined exhibited as high as 688 W.m-1.K-1, but also as low as 325 W.m-1.K-l. A large variation in TC can be rationalized by the discrepancy of diamond-matrix interfacial bonding. It was found from fractography that preferential bonding between diamond and the Cu-alloy matrix occurred only on the diamond {100} faces. EDS analysis and Raman spectra suggested that selective interfacial bonding may be attributed to amorphous carbon increasing the wettability between diamond and the Cu-alloy matrix. Amorphous carbon was found to significantly affect the TC of the composite by interface modification.

Pressure infiltrated Cu/diamond composites for LED applications

Diamond reinforced copper （Cu/diamond） composites were prepared by a pressure infilla＇ation technique. The composites show a super high conductivity of 713 W.m-1.K-1 in combination with an extremely low coefficient of thermal expansion （CTE） of 7.72 × 10-6 K-1 （25-100℃）, which are achieved by modifying the copper matrix with adding 0.3 wt.% of boron to get a good thermal contact between the matrix and the diamond particles. By adopting a series of postmachining techniques the composites were made into near-net-shape parts, and an electroless silver coating was also successfully plated on the composites. Finally, their potential applications in the thermal management of fight emitting diodes （LED） were illustrated via prototype examples.

Effect of carbide formers on microstructure and thermal conductivity of diamond-Cu composites for heat sink materials

Diamond-copper composites were prepared by powder metallurgy,in which the diamond particles were pre-coated by magnetic sputtering with copper alloy containing a small amount of carbide forming elements(including B,Cr,Ti,and Si).The influence of the carbide forming element additives on the microstructure and thermal conductivity of diamond composites was investigated.It is found that the composites fabricated with Cu-0.5B coated diamond particles has a relatively higher density and its thermal conductivity approaches 300 W/(m·K).Addition of 0.5%B improves the interfacial bonding and decreases thermal boundary resistance between diamond and Cu,while addition of 1%Cr makes the interfacial layer break away from diamond surface.The actual interfacial thermal conductivity of the composites with Cu-0.5B alloy coated on diamond is much higher than that of the Cu-1Cr layer,which suggests that the intrinsic thermal conductivity of the interfacial layer is an important factor for improving the thermal conductivity of the diamond composites.

Thermodynamic and kinetic study on interfacial reaction and diamond graphitization of Cu Fe-based diamond composite

Cu-Fe based diamond composites used for saw-blade segments are directly fabricated by vacuum and pressureassisted sintering. The carbide forming elements Cr and Ti are added to improve interfacial bonding between diamond and the Cu-Fe matrix. The interfacial reactions between diamond/graphite and Cr or Ti, and diamond graphitization are investigated by thermodynamics/kinetics analyses and experimental methods. The results show that interfacial reactions and graphitization of diamond can automatically proceed thermodynamically. The Cr3C2, Cr7C3, Cr23C6, and TiC are formed at the interfaces of composites by reactions between diamond and Cr or Ti; diamond graphitization does not occur because of the kinetic difficulty at 1093 K under the pressure of 13 MPa.

Effect of Boron Addition on the Thermal Properties of Diamond-Particle-Dispersed Cu-Matrix Composites Fabricated by SPS

Diamond particle dispersed copper (Cu) matrix composites were fabricated from the powder mixture composed of diamond, pure-Cu and boron (B) by spark plasma sintering (SPS). The composites were consolidated at 1173 K for 600 s by SPS. The reaction between the diamond particle and the Cu matrix in the composite was not confirmed by SEM observation and X-ray diffraction (XRD) analysis. The relative packing density of the Cu/diamond composites increased with B addition and attained 93.2% - 95.8% at the B content range between 1.8 vol.% and 13.8 vol.%. The thermal conductivity of the diamond-dispersed Cu composite drastically increased with B addition and reached the maximum value of 689 W/mK at 7.2 vol% B. Numerous transgranular fractures of diamond particles were observed on bending fracture surfaces of Cu-B/diamond composites. This indicates strong bonding between the diamond particle and the Cu matrix in the composite. The coefficient of thermal expansion of the composite falls in the upper line of Kerner’s model.

Evolution of thermo-physical properties of diamond/Cu composite materials under thermal shock load

In this paper, the two-flume method was used to study the change laws of the thermal conductivity and thermal expansion coefficient of diamond/Cu composite materials with 100, 300, and 500 cycle numbers, under the action of thermal shock load between-196 and 85 °C; the X-ray diffraction method（XRD） was used to study the change of the residual stress in the thermal shock process of the diamond/Cu composite materials; and the evolution of the fracture microstructure with different thermal shock cycle numbers was observed through scanning electron microscopy（SEM）. The results of the study show that the increase of the binder residue at the interface reduces the thermal shock stability of the diamond/Cu composite materials. In addition, under the thermal shock load between-196 and 85 °C, the residual stress of the diamond/Cu composite materials increases continuously with the increase of the cycle numbers, the increase of residual stress leads to a small amount of interface debonding, an increase of the interfacial thermal resistances, and a decrease of the constraints of low-expansion component on material deformation, thus the thermal conductivity decreases slightly and the thermal expansion coefficient increases slightly.

Morphology and Frictional Characteristics Under Electrical Currents of Al_2O_3/Cu Composites Prepared by Internal Oxidation

Two Al2O3/Cu composites containing 0.24 wt.% Al2O3 and 0.60 wt.% Al2O3 separately are prepared by internal oxidation. Effects of sliding speed and pressure on the frictional characteristics of the composites and copper against brass are investigated and compared. The changes in morphology of the sliding surface and subsurface are examined with scanning electron microscope （SEM） and energy dispersive X-ray spectrum （EDS）. The results show that the wear resistance of the Al2O3/Cu composites is superior to that of copper under the same conditions, Under a given electrical current, the wear rate of Al2O3/Cu composites decreases as the Al2O3-content increases, However, the wear rates of the Al2O3/Cu composites and copper increase as the sliding speed and pressure increase under dry sliding condition. The main wear mechanisms for Al2O3/Cu composites are of abrasion and adhesion; for copper, it is adhesion, although wear by oxidation and electrical erosion can also be observed as the speed and pressure rise.

Effect of electrical current on tribological property of Cu matrix composite reinforced by carbon nanotubes

Cu matrix composite reinforced with 10%（volume fraction） carbon nanotubes（CNTs/Cu） and pure Cu bulk were prepared by powder metallurgy techniques under the same consolidation processing condition.The effect of electrical current on tribological property of the materials was investigated by using a pin-on-disk friction and wear tester.The results show that the friction coefficient and wear rate of CNTs/Cu composite as well as those of pure Cu bulk increase with increasing the electrical current without exception,and the effect of electrical current is more obvious on tribological property of pure Cu bulk than on that of CNTs/Cu composite;the dominant wear mechanisms are arc erosion wear and plastic flow deformation,respectively;CNTs can improve tribological property of Cu matrix composites with electrical current.

Effect of heat treatment on microstructure and thermophysical properties of diamond/2024 Al composites

50%diamond particle （5μm） reinforced 2024 aluminum matrix （diamond/2024 Al） composites were prepared by pressure infiltration method. Diamond particles were distributed uniformly without any particle clustering, and no apparent porosities or significant casting defects were observed in the composites. The diamond-Al interfaces of as-cast and annealed diamond/2024 Al composites were clean, smooth and free from interfacial reaction product. However, a large number of Al2Cu precipitates were found at diamond-Al interface after aging treatment. Moreover, needle-shaped Al2MgCu precipitates in Al matrix were observed after aging treatment. The coefficient of thermal expansion （CTE） of diamond/2024 Al composites was about 8.5×10-6 °C-1 between 20 and 100 °C, which was compatible with that with chip materials. Annealing treatment showed little effect on thermal expansion behavior, and aging treatment could further decrease the CTE of the composites. The thermal conductivity of obtained diamond/2024 Al composites was about 100 W/（m？K）, and it was slightly increased after annealing while decreased after aging treatment.

Microstructural development and its effects on mechanical properties of Al/Cu laminated composite

The microstructural development and its effect on the mechanical properties of Al/Cu laminated composite produced by asymmetrical roll bonding and annealing were studied. The composite characterizations were conducted by transmission electron microscope（TEM）, scanning electron microscope（SEM）, peeling tests and tensile tests. It is found that the ultra-fine grained laminated composites with tight bonding interface are prepared by the roll bonding technique. The annealing prompts the atomic diffusion in the interface between dissimilar matrixes, and even causes the formation of intermetallic compounds. The interfacial bonding strength increases to the maximum value owing to the interfacial solution strengthening at 300 °C annealing, but sharply decreases by the damage effect of intermetallic compounds at elevated temperatures. The composites obtain high tensile strength due to the Al crystallization grains and Cu twins at 300 °C. At 350 °C annealing, however, the composites get high elongation by the interfacial interlayer with submicron thickness.