Predicted interfacial thermal conductance and thermal conductivity of diamond/Al composites with various interfacial coatings

The interfacial thermal conductance （ITC） and thermal conductivity （TC） of diamond/Al composites with various coatings were theoretically studied and discussed. A series of predictions and numerical analyses were performed to investigate the effect of thickness, sound velocity, and other parameters of coating layers on the ITC and TC. It is found that both the ITC and TC decline with increasing coating thickness, especially for the coatings with relatively low thermal conductivity. Nevertheless, if the coating thickness is close to zero, or quite a small value, the ITC and TC are mainly determined by the constants of the coating material. Under this condition, coatings such as Ni, TiC, Mo 2 C, SiC, and Si can significantly improve the ITC and TC of diamond/Al composites. By contrast, coatings like Ag will exert the negative effect. Taking the optimization of interfacial bonding into account, conductive carbides such as TiC or Mo 2 C with low thickness can be the most suitable coatings for diamond/Al composites.

Microstructure of Cu-based Amorphous Composite Coatings on AZ91D Magnesium Alloy by Laser Cladding

To improve the sliding wear resistance of AZ91D magnesium alloy, Cu-based amorphous composite coatings made of CuaTTi34Zr11Nis and Cu47Ti34Zr11Ni8＋20 wt pct SiC powders were fabricated on AZ91D magnesium alloy by laser cladding, respectively. SEM （scanning electron microscopy）, EDS （energy dispersive X-ray spectroscopy）, XRD （X-ray diffraction） and TEM （transmission electron microscopy） techniques were employed to study the phases of the coatings. The results show that the coatings mainly consist of amorphous phase and different intermetallic compounds. The reason of formation of amorphous phase and the function of SiC particles were explained in details.

Effect of Fe content on microstructure and mechanical properties of Cu-Fe-based composite coatings by laser induction hybrid rapid cladding

To select the proper composition and obtain an overall material?microstructure?property relationship for Cu?Fe alloy, theeffect of Fe content on microstructure and properties of Cu?Fe-based composite coatings by laser induction hybrid rapid claddingwas investigated. Microstructure characterization of the composite coatings was tested utilizing SEM, XRD and EDS. Microhardnessmeasurement was executed to evaluate the mechanical properties of the composite coatings. The results show that for low Fe content,the composite coating presents a feature that Fe-rich equiaxed dendrites are embedded in the Cu-rich matrix. With increasing Fecontent, the Fe-rich particles are dispersed in the Cu-rich matrix. With further increasing Fe content, large amounts of Cu-richparticles are homogeneously dispersed in the interdendrite of the Fe-rich matrix. Correspondingly, the average microhardness of thecomposite coatings increases gradually with the increase of Fe content and the microhardness of Cu14.5Fe83Si2C0.5 coating is muchtwice higher than that of the substrate.

ELECTROLESS PLATING COMPOSITE COATINGS OF Ni-Ti-Re ON THE SURFACE OF DIAMOND

The coating of Ni W P was deposited as base layer, and then the composite coating of Ni Ti(particles) Re(rare earth) was deposited subsequently on the surface of diamond using electroless plating by adding 2～3 μm Ti particles and trace rare earth salt to bath solution. Ti particles deposited on the surface of diamond were found by SEM and formation of TiC was verified by X ray diffraction analysis after heat treatment of the coatings in vacuum at 900 ℃. The binding strength between the coated diamond and the metal matrix was improved effectively in the diamond composite based on metal cement.

Properties and microstructure of Cu/diamond composites prepared by spark plasma sintering method

Cu/diamond composites have been considered as the next generation of thermal management material for electronic packages and heat sinks applications. Cu/diamond composites with different volume fractions of diamond were successfully prepared by spark plasma sintering（SPS） method. The sintering temperatures and volume fractions（50%, 60% and 70%） of diamond were changed to investigate their effects on the relative density, homogeneity of the microstructure and thermal conductivity of the composites. The results show that the relative density, homogeneity of the microstructure and thermal conductivity of the composites increase with decreasing the diamond volume fraction; the relative density and thermal conductivity of the composites increase with increasing the sintering temperature. The thermal conductivity of the composites is a result of the combined effect of the volume fraction of diamond, the homogeneity and relative density of the composites.

Wear Behaviour of Electroless Ni-P-Diamond Composite Coatings

The wear behaviour of composite coatings is related to the nature of embedded particles.The effects of particle size on the wear behaviour of composite coatings are analyzed.Electroless nickel composite coatings containing diamond particles with the sizes in the range of 0—0.5,0.5—1,1—2μm are prepared.The surface morphology of diamond particles and composite coatings are observed by scanning electron microscopy(SEM).The wear tests of composite coatings are comparatively evaluated by sliding against a cemented tungsten carbide ball.The 3D morphology of worn scar is evaluated by using a 3Dprofiler.The results show that the hardness and wear resistance of composite coatings can increase with the increase of particle sizes.The mixture mechanism of adhesive wear and abrasive wear turn into single abrasive wear with the increase of particle sizes as well.The transformation of wear behaviour is mainly attributed to particle roles during wear process.

Application of ultra-smooth composite diamond film coated WC-Co drawing dies under water-lubricating conditions

A specific revised HFCVD apparatus and a novel process combining HFCVD and polishing technique were presented to deposit the micro-and nano-crystalline multilayered ultra-smooth diamond（USCD） film on the interior-hole surface of WC-Co drawing dies with aperture ranging from d1.0 mm to 60 mm.Characterization results indicate that the surface roughness values（Ra） in the entry zone,drawing zone and bearing zone of as-fabricated USCD coated drawing die were measured as low as 25.7,23.3 and 25.5 nm,respectively.Furthermore,the friction properties of USCD films were examined in both dry sliding and water-lubricating conditions,and the results show that the USCD film presents much superior friction properties.Its friction coefficients against ball-bearing steel,copper and silicon nitride balls（d4 mm）,is always lower than that of microcrystalline diamond（MCD） or WC-Co sample,regardless of the lubricating condition.Meanwhile,it still presents competitive wear resistance with the MCD films.Finally,the working lifetime and performance of as-fabricated USCD coated drawing dies were examined under producing low-carbon steel pipes in dry-sliding and water-lubricating conditions.Under the water-lubricating drawing condition,its production significantly increases by about 20 times compared with the conventional WC-Co drawing dies.

Preparation and thermal conductivity of tungsten coated diamond/copper composites

Tungsten was plated on the surface of diamond by using thermal diffusion method.Different process parameters were employed to prepare the composites with tungsten,diamond and copper.The micro morphology of different samples was observed,and the thermal conductivity of samples was measured by laser flash method.The optimal process parameters for preparing diamond/copper composites with high thermal conductivity were investigated.The results indicated that plating tungsten on diamond could modify the interface bonding.When the diamond was plated for 60 min,the coating appeared intact,uniform and flat,and the thermal conductivity of the sample could reach as high as 486 W/(m·K).The integrity and uniformity were more important than thickness for the coating.When the tungsten-plated diamond was further annealed,the metallurgical bonding between the coating and the diamond was enhanced,and the thermal conductivity rose to 559 W/(m·K).

Low-temperature heat conduction characteristics of diamond/Cu composite by pressure infiltration method

In this paper,diamond/CuCr and diamond/CuB composites were prepared using the pressure infiltration method.The physical property measurement system(PPMS)was adopted to evaluate the thermal conductivity of diamond/Cu and MoCu composites within the range of100–350 K,and a scanning electron microscope(SEM)was utilized to analyze the microstructure and fracture appearance of the materials.The research indicates that the thermal conductivity of diamond/Cu composite within the range of100–350 K is 2.5–3.0 times that of the existing MoCu material,and the low-temperature thermal conductivity of diamond/Cu composite presents an exponential relationship with the temperature.If B element was added to a Cu matrix and a low-temperature binder was used for prefabricated elements,favorable interfacial adhesion,relatively high interfacial thermal conductivity,and favorable low-temperature heat conduction characteristics would be apparent.

Effect of carbide formers on microstructure and thermal conductivity of diamond-Cu composites for heat sink materials

Diamond-copper composites were prepared by powder metallurgy,in which the diamond particles were pre-coated by magnetic sputtering with copper alloy containing a small amount of carbide forming elements(including B,Cr,Ti,and Si).The influence of the carbide forming element additives on the microstructure and thermal conductivity of diamond composites was investigated.It is found that the composites fabricated with Cu-0.5B coated diamond particles has a relatively higher density and its thermal conductivity approaches 300 W/(m·K).Addition of 0.5%B improves the interfacial bonding and decreases thermal boundary resistance between diamond and Cu,while addition of 1%Cr makes the interfacial layer break away from diamond surface.The actual interfacial thermal conductivity of the composites with Cu-0.5B alloy coated on diamond is much higher than that of the Cu-1Cr layer,which suggests that the intrinsic thermal conductivity of the interfacial layer is an important factor for improving the thermal conductivity of the diamond composites.

Microstructure and thermal expansion of Ti coated diamond/Al composites

A titanium coating fabricated via vacuum vapor deposition for diamond/Al composites was used to improve the interfacial bonding strength between diamond particles and Al matrix,and the Ti coated diamond particles reinforced Al matrix composites were prepared by gas pressure infiltration for electronic packaging.The surface structure of the Ti coated diamond particles was investigated by XRD and SEM.The interfacial characteristics and fracture surfaces were observed by SEM and EDS.The coefficient of thermal expansion(CTE)of 50%(volume fraction)Ti coated diamond particles reinforced Al matrix composites was measured. The Ti coating on diamond before infiltration consists of inner TiC layer and outer TiO2 layer,and the inner TiC layer is very stable and cannot be removed during infiltration process.Fractographs of the composites illustrate that aluminum matrix fracture is the dominant fracture mechanism,and the stepped breakage of a diamond particle indicates strong interfacial bonding between the Ti coated diamond particles and the Al matrix.The measured low CTEs(5.07×10-6-9.27×10 -6K -1)of the composites also show the strong interfacial bonding between the Ti coated diamond particles and the Al matrix.

Microstructure and Thermal Properties of SiCp/Cu Composites with Mo Coating on SiC Particles

SiCp/Cu composites with a compact microstructure were successfully fabricated by vacuum hot-pressing method. In order to suppress the detrimental interfacial reactions and ameliorate the interfacial bonding between copper and silicon carbide, molybdenum coating was deposited on the surface of silicon carbide by magnetron sputtering method and crystallized heat-treatment. The effects of the interfacial design on the thermo-physical properties of Si Cp/Cu composites were studied in detail. Thermal conductivity and expansion test results showed that silicon carbide particles coated with uniform and compact molybdenum coating have improved the comprehensive thermal properties of the Si Cp/Cu composites. Furthermore, the adhesion of the interface between silicon carbide and copper was significantly strengthened after molybdenum coating. Si Cp/Cu composites with a maximum thermal conductivity of 274.056 W/（m·K） and a coefficient of thermal expansion of 9 ppm/K were successfully prepared when the volume of silicon carbide was about 50%, and these Si Cp/Cu composites have potential applications for the electronic packageing of the high integration electronic devices.

Cu-Diamond复合材料的多次电弧烧蚀性能研究

采用真空热压烧结法制得金刚石分布均匀,且与铜基结合良好的Cu-Diamond复合材料(金刚石体积分数为5%)。在空气气氛中对Cu-5vol.%Diamond复合材料进行多次电弧烧蚀,通过场发射扫描电子显微镜(SEM)和三维激光共聚焦显微镜(3D LSCM)对烧蚀表面进行观察分析,利用能谱仪(EDS)和X射线光电子能谱仪(XPS)对烧蚀后的成分进行分析,结果表明,经过100次9 kV高电压电弧烧蚀后,复合材料烧蚀区域中的铜基体出现熔化和溅射,并被氧化成了CuO和Cu_(2)O,同时金刚石颗粒较大幅度提高了该复合材料的抗电弧烧蚀能力。

Microstructure and thermal conductivity of copper matrix composites reinforced with mixtures of diamond and SiC particles

The thermal conductivity of diamond hybrid SiC/Cu,diamond/Cu and SiC/Cu composite were calculated by using the extended differential effective medium (DEM) theoretical model in this paper.The effects of the particle volume fraction,the particle size and the volume ratio of the diamond particles to the total particles on the thermal conductivity of the composite were studied.The DEM theoretical calculation results show that,for the diamond hybrid SiC/Cu composite,when the particle volume fraction is above 46% and the volume ratio of the diamond particles to the SiC particles is above 13:12,the thermal conductivity of the composite can reach 500 W·m-1·K-1.The thermal conduc-tivity of the composite has little change when the particle size is above 200μm.The experimental results show that Ti can improve the wettability of the SiC and Cu.The thermal conductivity of the diamond hybrid SiCTi/Cu is almost two times better than that of the diamond hybrid SiC/Cu.It is feasible to predict the thermal conductivity of the composite by DEM theoretical model.

超音速激光沉积Cu-Al_(2)O_(3)-石墨复合涂层微观结构及耐磨损性能

目的研究不同石墨含量对超音速激光沉积Cu-Al_(2)O_(3)-石墨复合涂层的微观组织、显微硬度、耐磨损性能的影响。方法利用扫描电子显微镜、能量色谱仪、维氏硬度计、激光共聚焦扫描显微系统、X射线衍射仪、摩擦磨损测试对复合涂层的微观组织、显微硬度、耐磨损性能及磨损机制进行分析。结果随着原始粉末中镀铜石墨质量占比的增加,Cu-Al_(2)O_(3)-石墨复合涂层的沉积效率逐渐降低。基于Al_(2)O_(3)颗粒的原位喷丸效应及激光辐照的加热软化效应,复合涂层具有致密的微观组织,且复合涂层与基体界面结合良好。单一添加Al_(2)O_(3)颗粒可以将Cu涂层的硬度从108.19HV0.2提高至121.82HV0.2。随着石墨含量的增大,涂层的显微硬度逐渐降低,镀铜石墨在原始粉末中的质量分数从5%增至15%,Cu-Al_(2)O_(3)-石墨复合涂层的硬度从116.09HV0.2降至94.17HV0.2。添加石墨能够在复合涂层表面形成固体润滑层,降低复合涂层的摩擦因数,提升涂层的耐磨损性能。CuAlGr10复合涂层具有最优的耐磨损性能,磨损率为0.7×10^(−4)mm^(3)/(N·m)。此外,由于激光辐照促进了复合涂层内部颗粒间的界面结合,均匀分散在石墨润滑相中的Al_(2)O_(3)颗粒作为负载支撑和耐磨相,可进一步降低复合涂层的磨损率。结论Cu-Al_(2)O_(3)-石墨复合涂层优异的耐磨性能是润滑相石墨颗粒和硬质增强相Al_(2)O_(3)颗粒共同作用的结果,石墨的添加能够降低复合涂层的摩擦因数,提升涂层的耐磨损性能,但过量的石墨颗粒会对涂层产生割裂作用,导致增强相Al_(2)O_(3)颗粒脱离涂层,从而加剧涂层的磨损。

Cu-Sn、Ni-Cr、Co烧结助剂对Ni_(3)Al基金刚石复合材料性能的影响

采用真空热压法制备了Ni_(3)Al基金刚石复合材料,研究了不同烧结助剂对复合材料力学性能和微观结构的影响,并对Ni_(3)Al基金刚石钻头的钻孔性能进行了测试。结果表明,在添加0~30vol%的Cu-Sn、Ni-Cr、Co烧结助剂后,Ni_(3)Al基金刚石刀头的致密度、抗弯强度、硬度得到提高。Ni3Al基金刚石复合材料的抗弯强度随着Ni-Cr、Co烧结助剂含量的增加而提高。Cu-Sn、Ni-Cr烧结助剂中的Cr元素在金刚石的表面出现了富集现象。将添加Cu-Sn、Ni-Cr烧结助剂的Ni_(3)Al基金刚石复合材料制备成工具进行钻削测试,发现Ni_(3)Al基金刚石复合材料的失效形式可以分为微破碎、磨耗、宏观破碎3种形式,钻削试验中并没有发现整颗金刚石脱落的现象,表明Ni_(3)Al基对金刚石的把持力较大,强度较高。

高导热金刚石/Cu复合材料的研究进展

随着大数据、人工智能等信息技术的飞速发展,电子元器件逐渐向便携、轻量、高性能等方向发展。金刚石/Cu复合材料具有热导率高、热膨胀系数与电子元器件匹配度高等优点,目前已成为第三代先进电子封装材料。综述了国内外金刚石/Cu复合材料的制备方法、影响金刚石/Cu复合材料热导率的因素,尤其是界面改性对热导率的影响。此外,还对金刚石/Cu复合材料的未来发展方向进行了预测,为金刚石/Cu复合材料的研制提供参考。

石墨含量对车用镀Ni石墨/Cu复合材料摩擦磨损性能的影响

石墨添加量是影响Cu基复合材料摩擦学性能的关键因素之一。为此,研究了镀Ni石墨含量(2、4、6和8 mass%)对镀Ni石墨/Cu复合材料摩擦学行为的影响,分析了石墨含量与复合材料的微观组织、物理性能及硬度的关系,以确定最佳的石墨添加量。结果表明:复合材料中石墨与Cu之间的结合性较好,没有出现明显的空隙和裂纹;随镀Ni石墨由2 mass%增加到8 mass%,复合材料的致密度和导电率分别减小了3.7%和43.5%,硬度先由60.3 HV0.1增大到63.4 HV0.1后再减小到59.7 HV0.1,其中转折点在6 mass%镀Ni石墨,而摩擦系数和磨损率均为先减小后增大。因此,理想的镀Ni石墨添加量为6 mass%,此时,复合材料的磨损机制以磨粒磨损为主,粘着和氧化磨损为辅。

钛合金脉冲电沉积Cu-WC复合镀层的硬度与摩擦磨损性能

为有效提高钛合金的抗摩擦磨损性能,在钛合金表面脉冲电沉积Cu-WC复合镀层。分别研究了平均电流密度、脉冲占空比对复合镀层的微观形貌、WC颗粒含量、硬度以及摩擦磨损性能的影响。结果表明:当平均电流密度为1.5 A/dm^(2)、脉冲占空比为20%时,电沉积的Cu-WC复合镀层致密性最好,WC颗粒含量接近2.4%,其硬度(240.4 HV)约为纯Cu镀层的2倍,还表现出良好的抗摩擦磨损性能,平均摩擦系数较钛合金降低约38%。适当增大平均电流密度(0.5~1.5 A/dm^(2))或提高脉冲占空比(10~20%)能使较多WC颗粒参与电沉积过程,起到明显细化晶粒作用和弥散强化作用,促进形成结构致密的Cu-WC复合镀层,因而具有较高硬度和良好的抗摩擦磨损性能。

Novel Pretreatment of Hard Metal Substrate for Better Performance of Diamond Coated Cutting Tools

A surface engineering approach for a novel pre-treatment of hard metal tool substrate for optimum adhesion of diamond coatings is presented. Firsfly, an alkaline solution was used to etch the WC grains to generate a rough surface for better mechanical interlocking. Subsequently, surface Co was removed by etching in acid solution. Then the hard metal substrate was boronized to form a compound interlayer which acted as an efficient diffusion barrier to prevent the outward diffusion of Co. Novel nano-microcrystalline composite diamond film coatings with a very smooth surface was deposited on the surface engineering pre-treated hard metal surface. Promising results of measurement in adhesion strength as well as field cutting tests have been obtained.