Measurement and Characteristics of the Integration of China’s Trade in Services into Digital Global Value Chain

In this paper,the characteristics of digital trade in services of China are measured and revealed from the perspective of digitalization of trade in services.A digital global value chain is constructed and comprehensively analyzed at the three levels of path decomposition,two-way digital connection and bilateral connection.The study finds that the digital added value of China’s services driven by domestic demand outweighs that driven by foreign demand,and most countries engage in digital trade in services with China through simple participation;the role of China’s services in the digital global value chain is shifting from“digital value input”to“digital value output”,but its relative position is still low;China’s dependence on the import of digital intermediate products from developed countries has been significantly reduced,and the country has become the main source of digital intermediate imports for most countries,acting as a“hub”in the digital global value chain.This study comprehensively evaluates the strategic positioning and paths of integrating China’s services into the digital global value chain in multiple dimensions under the unifi ed accounting framework.It provides the reference for further improving the statistics accounting framework of China’s digital trade and promoting the high-quality development of the digital economy.

Enhanced CMOS image sensor by flexible 3D nanocone anti-reflection film

Complementary metal oxide semiconductor(CMOS) image sensors(CIS) are being widely used in digital video cameras, web cameras, digital single lens reflex camera(DSLR), smart phones and so on, owing to their high level of integration, random accessibility, and low-power operation. It needs to be installed with the cover glass in practical applications to protect the sensor from damage, mechanical issues,and environmental conditions, which, however, limits the accuracy and usability of the sensor due to the reflection in the optical path from air-to-cover glass-to-air. In this work, the flexible 3D nanocone anti-reflection(AR) film with controlled aspect ratio was firstly employed to reduce the light reflection at air/cover glass/air interfaces by directly attaching onto the front and rear sides of the CIS cover glass.As both the front and rear sides of cover glass were coated by the AR film, the output image quality was found to be improved with external quantum efficiency increased by 7%, compared with that without AR film. The mean digital data value, root-mean-square contrast, and dynamic range are increased by45.14%, 38.61% and 57, respectively, for the output image with AR films. These results provide a novel and facile pathway to improve the CIS performance and also could be extended to rational design of other image sensors and optoelectronic devices.