It is vital to choose a factual and reasonable micro-structural model of braided composites for improving the calculating precision of thermal property of 3-D braided composites by finite element method （FEM）. On th...It is vital to choose a factual and reasonable micro-structural model of braided composites for improving the calculating precision of thermal property of 3-D braided composites by finite element method （FEM）. On the basis of new microstructure model of braided composites proposed recently, the model of FEM calculation for thermal conductivity of 3-dimennsional and 4-directional braided composites is set up in this paper. The curves of coefficient of effective thermal conductivity versus fiber volume ratio and interior braiding angle are obtained. Furthermore, comparing the results of FEM with the available experimental data, the reasonability and veracity of calculation are confirmed at the same time.展开更多
Based on a tight-binding disordered model describing a single electron band, we establish a direct current （de） electronic hopping transport conductance model of one-dimensional diagonal disordered systems, and also...Based on a tight-binding disordered model describing a single electron band, we establish a direct current （de） electronic hopping transport conductance model of one-dimensional diagonal disordered systems, and also derive a dc conductance formula. By calculating the dc conductivity, the relationships between electric field and conductivity and between temperature and conductivity are analysed, and the role played by the degree of disorder in electronic transport is studied. The results indicate the conductivity of systems decreasing with the increase of the degree of disorder, characteristics of negative differential dependence of resistance on temperature at, low temperatures in diagonal disordered systems, and the conductivity of systems decreasing with the increase of electric field, featuring the non-Ohm＇s law conductivity.展开更多
The model of transient behavior of semiconductor with heat-conduction is an initial and boundary problem. Alternating-direction multistep preconditioned iterative methods and theory analyses are given in this paper. E...The model of transient behavior of semiconductor with heat-conduction is an initial and boundary problem. Alternating-direction multistep preconditioned iterative methods and theory analyses are given in this paper. Electric potential equation is approximated by mixed finite element method, concentration and heat-conduction equations are approximated by Galerkin alternating-direction multistep methods. Error estimates of optimal order in L2 are demonstrated.展开更多
A method for predicting effective thermal conductivities(ETCs) of three-dimensional five-directional(3D5D) braided composites is presented. The effective thermal conductivity prediction method contains a digital image...A method for predicting effective thermal conductivities(ETCs) of three-dimensional five-directional(3D5D) braided composites is presented. The effective thermal conductivity prediction method contains a digital image processing technology. Multiple scanning electron microscopy(SEM)images of composites are analyzed to obtain actual microstructural features. These actual microstructural features of 3D5D braided composites are introduced into representative volume element(RVE) modeling. Apart from applying actual microstructural features,compression effects between yarns are considered in the modeling of RVE,making the RVE more realistic. Therefore,the ETC prediction method establishes a representative unit cell model that better reflects the true microstructural characteristics of the 3D5D braided composites. The ETCs are predicted with the finite element method. Then thermal conductivity measurements are carried out for a 3D5D braided composite sample.By comparing the predicted ETC with the measured thermal conductivity, the whole process of the ETC prediction method is proved to be effective and accurate,where a relative error of only 2.9 % is obtained.Furthermore,the effects of microstructural features are investigated,indicating that increasing interior braiding angles and fiber fill factor can lead to higher transverse ETCs. Longitudinal ETCs decrease with increasing interior braiding angles,but increase with increasing fiber fill factor. Finally,the influence of variations of microstructure parameters observed in digital image processing are investigated. To explore the influence of variations in microstructural features on variations in predicted ETCs,the actual probability distributions of microstructural features obtained from the 3D5D braided composite sample are introduced into the ETC investigation. The results show that,compared with the interior braiding angle,variations in the fiber fill factor exhibit more significant effects on variations in ETCs.展开更多
The purpose of this paper is to study large-sized copper billets refined with 5N ultrahigh purity after vacuum melting and directional solidifi-cation （VMDS）. The precise impurity analysis of copper billets was carr...The purpose of this paper is to study large-sized copper billets refined with 5N ultrahigh purity after vacuum melting and directional solidifi-cation （VMDS）. The precise impurity analysis of copper billets was carried out with a glow discharge mass spectrometer （GDMS）. The re-sults demonstrate that the total concentration of twenty-two impurities is decreased by 63.1wt.%-66.5 wt.%. Ag, P, S, Na, Mg, Se, Zn, In and Bi are easy to be removed due to lgPimp - lgPCu 1.5, and they can be removed effectively under the vacuum condition of 1650-1700 K for 30 min. The electrical conductivity of 5N copper is higher than that of the raw material as the impurity concentrations decrease. The segrega-tion effect in directional solidification can be remarkable when the equilibrium distribution coefficient （k0） value is less than 0.65 due to the strong affinity of Cu for some metallic and non-metallic impurities.展开更多
Zn-5wt% Al eutectic alloy was directionally solidified with different growth rates （5.32-250.0μm/s） at a constant temperature gradient of 8.50 K/mm using a Bridgman-type growth apparatus.The values of eutectic spac...Zn-5wt% Al eutectic alloy was directionally solidified with different growth rates （5.32-250.0μm/s） at a constant temperature gradient of 8.50 K/mm using a Bridgman-type growth apparatus.The values of eutectic spacing were measured from transverse sections of the samples.The dependences of the eutectic spacing and undercooling on growth rate are determined as λ=9.21V-0.53 and ΔT=0.0245V0.53,respectively.The results obtained in this work were compared with the Jackson-Hunt eutectic theory and the similar experimental results in the literature.Microhardness of directionally solidified samples was also measured by using a microhardness test device.The dependency of the microhardness on growth rate is found as Hv=115.64V0.13.Afterwards,the electrical resistivity （r） of the casting alloy changes from 40×10-9 to 108×10-9 Ω·m with the temperature rising in the range of 300-630 K.The enthalpy of fusion （ΔH） and specific heat （Cp） for the Zn-Al eutectic alloy are calculated to be 113.37 J/g and 0.309 J/（g·K）,respectively by means of differential scanning calorimetry （DSC） from heating trace during the transformation from liquid to solid.展开更多
A suspension of 15nm diameter gold nanoparti-cles has been deposited along a line on a silicon substrate with the assistance of a jet generated in an electric field. In order to control the evaporation of the solvent ...A suspension of 15nm diameter gold nanoparti-cles has been deposited along a line on a silicon substrate with the assistance of a jet generated in an electric field. In order to control the evaporation of the solvent used to suspend the gold nanoparticles, a heating device was used to change the substrate temperature. Layer-by- layer deposition enabled the direct writing of gold tracks having an electrical resistivity of 1.8 × 10-7 Ωm, only about an order of magnitude above the electrical resistivity of bulk gold.展开更多
A Bi-2.0Zn-0.2A1 （wt%） ternary eutectic alloy was prepared using a vacuum melting furnace and a casting furnace. The samples were directionally solidified upwards at a constant growth rate （V= 18.4 μm/s） under di...A Bi-2.0Zn-0.2A1 （wt%） ternary eutectic alloy was prepared using a vacuum melting furnace and a casting furnace. The samples were directionally solidified upwards at a constant growth rate （V= 18.4 μm/s） under different temperature gradients （G = 1.15-3.44 K/mm） and at a constant temperature gradient （G = 2.66 K/mm） under different growth rates （V= 8.3-500 μm/s） in a Bridgman-type directional so- lidification furnace. The dependence ofmicrostructure parameter （2） on the solidification parameters （G and V） and that of the microhardness （Hv） on the microstructure and solidification parameters were investigated. The resistivity （ρ） measurements of the studied alloy were per- formed using the standard four-point-probe method, and the temperature coefficient of resistivity （α） was calculated from the ρ-Tcurve. The enthalpy （AH） and the specific heat （Cp） values were determined by differential scanning calorimetry analysis. In addition, the thermal conductivities of samples, obtained using the Wiedemann-Franz and Smith-Palmer equations, were compared with the experimental results. The results revealed that, the thermal conductivity values obtained using the Wiedemarm-Franz and Smith-Palmer equations for the Bi-2.0Zn-0.2Al （wt%） alloy are in the range of 5.2-6.5 W/Km and 15.2-16.4 W/Km, respectively.展开更多
针对COB-LED(Chip on Board-Light Emitting Diode)散热问题,文中基于二维热传导方程建立了一个可快速计算COB-LED散热器表面热分布的数学模型。为了便于模型求解,采用有限差分法求解该数学模型并选择交替方向隐格式作为其差分格式。根...针对COB-LED(Chip on Board-Light Emitting Diode)散热问题,文中基于二维热传导方程建立了一个可快速计算COB-LED散热器表面热分布的数学模型。为了便于模型求解,采用有限差分法求解该数学模型并选择交替方向隐格式作为其差分格式。根据模型中的边界条件和初始条件设计COB-LED常温点亮实验,并基于ANSYS有限元分析软件进行仿真分析。通过比较求解结果、仿真结果和实验结果验证该数学模型的合理性。结果表明,求解结果与实验结果中最高温度相对误差约23.57%,且两者的温度变化趋势一致。求解结果与仿真结果中最高温度相对误差约34.84%,且温度分布较为接近,证明了该数学模型的合理性与正确性。展开更多
基金Aeronautical Science Foundation of China (04B51045)
文摘It is vital to choose a factual and reasonable micro-structural model of braided composites for improving the calculating precision of thermal property of 3-D braided composites by finite element method （FEM）. On the basis of new microstructure model of braided composites proposed recently, the model of FEM calculation for thermal conductivity of 3-dimennsional and 4-directional braided composites is set up in this paper. The curves of coefficient of effective thermal conductivity versus fiber volume ratio and interior braiding angle are obtained. Furthermore, comparing the results of FEM with the available experimental data, the reasonability and veracity of calculation are confirmed at the same time.
文摘Based on a tight-binding disordered model describing a single electron band, we establish a direct current （de） electronic hopping transport conductance model of one-dimensional diagonal disordered systems, and also derive a dc conductance formula. By calculating the dc conductivity, the relationships between electric field and conductivity and between temperature and conductivity are analysed, and the role played by the degree of disorder in electronic transport is studied. The results indicate the conductivity of systems decreasing with the increase of the degree of disorder, characteristics of negative differential dependence of resistance on temperature at, low temperatures in diagonal disordered systems, and the conductivity of systems decreasing with the increase of electric field, featuring the non-Ohm＇s law conductivity.
基金This research was surpported by the National Natural Science Foundation , Mathematical TY Foun-dation (TY10126029) of China and the Youth Foundation of Shandong University.
文摘The model of transient behavior of semiconductor with heat-conduction is an initial and boundary problem. Alternating-direction multistep preconditioned iterative methods and theory analyses are given in this paper. Electric potential equation is approximated by mixed finite element method, concentration and heat-conduction equations are approximated by Galerkin alternating-direction multistep methods. Error estimates of optimal order in L2 are demonstrated.
文摘A method for predicting effective thermal conductivities(ETCs) of three-dimensional five-directional(3D5D) braided composites is presented. The effective thermal conductivity prediction method contains a digital image processing technology. Multiple scanning electron microscopy(SEM)images of composites are analyzed to obtain actual microstructural features. These actual microstructural features of 3D5D braided composites are introduced into representative volume element(RVE) modeling. Apart from applying actual microstructural features,compression effects between yarns are considered in the modeling of RVE,making the RVE more realistic. Therefore,the ETC prediction method establishes a representative unit cell model that better reflects the true microstructural characteristics of the 3D5D braided composites. The ETCs are predicted with the finite element method. Then thermal conductivity measurements are carried out for a 3D5D braided composite sample.By comparing the predicted ETC with the measured thermal conductivity, the whole process of the ETC prediction method is proved to be effective and accurate,where a relative error of only 2.9 % is obtained.Furthermore,the effects of microstructural features are investigated,indicating that increasing interior braiding angles and fiber fill factor can lead to higher transverse ETCs. Longitudinal ETCs decrease with increasing interior braiding angles,but increase with increasing fiber fill factor. Finally,the influence of variations of microstructure parameters observed in digital image processing are investigated. To explore the influence of variations in microstructural features on variations in predicted ETCs,the actual probability distributions of microstructural features obtained from the 3D5D braided composite sample are introduced into the ETC investigation. The results show that,compared with the interior braiding angle,variations in the fiber fill factor exhibit more significant effects on variations in ETCs.
文摘The purpose of this paper is to study large-sized copper billets refined with 5N ultrahigh purity after vacuum melting and directional solidifi-cation （VMDS）. The precise impurity analysis of copper billets was carried out with a glow discharge mass spectrometer （GDMS）. The re-sults demonstrate that the total concentration of twenty-two impurities is decreased by 63.1wt.%-66.5 wt.%. Ag, P, S, Na, Mg, Se, Zn, In and Bi are easy to be removed due to lgPimp - lgPCu 1.5, and they can be removed effectively under the vacuum condition of 1650-1700 K for 30 min. The electrical conductivity of 5N copper is higher than that of the raw material as the impurity concentrations decrease. The segrega-tion effect in directional solidification can be remarkable when the equilibrium distribution coefficient （k0） value is less than 0.65 due to the strong affinity of Cu for some metallic and non-metallic impurities.
基金supported by Erciyes University Scientific Research Project Unit (No.FBA-10-3376)
文摘Zn-5wt% Al eutectic alloy was directionally solidified with different growth rates （5.32-250.0μm/s） at a constant temperature gradient of 8.50 K/mm using a Bridgman-type growth apparatus.The values of eutectic spacing were measured from transverse sections of the samples.The dependences of the eutectic spacing and undercooling on growth rate are determined as λ=9.21V-0.53 and ΔT=0.0245V0.53,respectively.The results obtained in this work were compared with the Jackson-Hunt eutectic theory and the similar experimental results in the literature.Microhardness of directionally solidified samples was also measured by using a microhardness test device.The dependency of the microhardness on growth rate is found as Hv=115.64V0.13.Afterwards,the electrical resistivity （r） of the casting alloy changes from 40×10-9 to 108×10-9 Ω·m with the temperature rising in the range of 300-630 K.The enthalpy of fusion （ΔH） and specific heat （Cp） for the Zn-Al eutectic alloy are calculated to be 113.37 J/g and 0.309 J/（g·K）,respectively by means of differential scanning calorimetry （DSC） from heating trace during the transformation from liquid to solid.
文摘A suspension of 15nm diameter gold nanoparti-cles has been deposited along a line on a silicon substrate with the assistance of a jet generated in an electric field. In order to control the evaporation of the solvent used to suspend the gold nanoparticles, a heating device was used to change the substrate temperature. Layer-by- layer deposition enabled the direct writing of gold tracks having an electrical resistivity of 1.8 × 10-7 Ωm, only about an order of magnitude above the electrical resistivity of bulk gold.
基金financially supported by the Nigde University Scientific Research Project Unit(No.FEB 2009/02)
文摘A Bi-2.0Zn-0.2A1 （wt%） ternary eutectic alloy was prepared using a vacuum melting furnace and a casting furnace. The samples were directionally solidified upwards at a constant growth rate （V= 18.4 μm/s） under different temperature gradients （G = 1.15-3.44 K/mm） and at a constant temperature gradient （G = 2.66 K/mm） under different growth rates （V= 8.3-500 μm/s） in a Bridgman-type directional so- lidification furnace. The dependence ofmicrostructure parameter （2） on the solidification parameters （G and V） and that of the microhardness （Hv） on the microstructure and solidification parameters were investigated. The resistivity （ρ） measurements of the studied alloy were per- formed using the standard four-point-probe method, and the temperature coefficient of resistivity （α） was calculated from the ρ-Tcurve. The enthalpy （AH） and the specific heat （Cp） values were determined by differential scanning calorimetry analysis. In addition, the thermal conductivities of samples, obtained using the Wiedemann-Franz and Smith-Palmer equations, were compared with the experimental results. The results revealed that, the thermal conductivity values obtained using the Wiedemarm-Franz and Smith-Palmer equations for the Bi-2.0Zn-0.2Al （wt%） alloy are in the range of 5.2-6.5 W/Km and 15.2-16.4 W/Km, respectively.
文摘针对COB-LED(Chip on Board-Light Emitting Diode)散热问题,文中基于二维热传导方程建立了一个可快速计算COB-LED散热器表面热分布的数学模型。为了便于模型求解,采用有限差分法求解该数学模型并选择交替方向隐格式作为其差分格式。根据模型中的边界条件和初始条件设计COB-LED常温点亮实验,并基于ANSYS有限元分析软件进行仿真分析。通过比较求解结果、仿真结果和实验结果验证该数学模型的合理性。结果表明,求解结果与实验结果中最高温度相对误差约23.57%,且两者的温度变化趋势一致。求解结果与仿真结果中最高温度相对误差约34.84%,且温度分布较为接近,证明了该数学模型的合理性与正确性。
