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QUICK ASSESSMENT METHODOLOGY FOR RELIABILITY OF SOLDER JOINTS IN BALL GRID ARRAY (BGA) ASSEMBLY——PART Ⅰ: CREEP CONSTITUTIVE RELATION AND FATIGUE MODEL 被引量:3
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作者 史训清 王志平 +2 位作者 John HL Pang 张学仁 聂景旭 《Acta Mechanica Sinica》 SCIE EI CAS CSCD 2002年第3期274-287,共14页
In this study, a new unified creep constitutive relation and a mod- ified energy-based fatigue model have been established respectively to describe the creep flow and predict the fatigue life of Sn-Pb solders. It is f... In this study, a new unified creep constitutive relation and a mod- ified energy-based fatigue model have been established respectively to describe the creep flow and predict the fatigue life of Sn-Pb solders. It is found that the relation successfully elucidates the creep mechanism related to current constitutive relations. The model can be used to describe the temperature and frequency dependent low cycle fatigue behavior of the solder. The relation and the model are further employed in part Ⅱ to develop the numerical simulation approach for the long-term reliability assessment of the plastic ball grid array (BGA) assembly. 展开更多
关键词 dislocation controlled creep flow creep-fatigue interaction constitutive relation life prediction model solder joint reliability
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