Fabrication and thermal conductivity of copper matrix composites reinforced by tungsten-coated carbon nanotubes

Carbon nanotubes （CNTs） were coated by tungsten using metal organic chemical vapor deposition. Magnetic stirring was employed to disperse the W-coated CNTs （W-CNTs） in a Cu matrix, and then, the mixed powders were consolidated by spark plasma sintering. The W-CNTs obtained a uniform dispersion within the Cu matrix when the W-CNT content was less than 5.0vo1%, but high content of W-CNTs （10vol%） resulted in the presence of clusters. The W-CNT/Cu composites containing low content of W-CNTs （〈5.0vol%） exhibited a higher thermal conductivity than the sintered pure Cu, while the CNT/Cu composites exhibited no increase in thermal conductivity after the incorporation of uncoated CNTs. The W-CNT content was found to play a crucial role in determining the thermal conductivity of the W-CNT/Cu composites. The thermal conductivity of the W-CNT/Cu composites increased first and then decreased with the W-CNT content increasing. When the W-CNT content was 2.5vo1%, the W-CNT/Cu composite obtained the maximum value of thermal conductivity. The thermal resistance of the （W-CNT）-Cu interface was predicted in terms of Maxwell-Gamett effective medium approximation, and its calculated value was about 3.0× 10-9 m2.K.W-l.

Thermal conductivity of diamond/copper composites with a bimodal distribution of diamond particle sizes prepared by pressure infiltration method

The thermal conductivity of diamond/copper composites with bimodal particle sizes was studied. The composites were prepared through pressure infiltration of liquid copper into diamond preforms with a mixture of 40 and 100 pm-size diamonds. The permeability of the preforms with different coarse-to-fine volume ratios of diamonds was investigated. The thermal conductivity of the diamond/copper composites with bimodal size distribution was compared to the theoretical value derived from an analytical model developed by Chu. It is predicted that the diamond/copper composites could reach a higher thermal conductivity and their surface roughness could be improved by applying bimodal diamond particle sizes.

Sintering behavior and thermal conductivity of nickel-coated graphite flake/copper composites fabricated by spark plasma sintering

Nickel-coated graphite flakes/copper（GN/Cu） composites were fabricated by spark plasma sintering with the surface of graphite flakes（GFs） being modified by Ni–P electroless plating. The effects of the phase transition of the amorphous Ni–P plating and of Ni diffusion into the Cu matrix on the densification behavior, interfacial microstructure, and thermal conductivity（TC） of the GN/Cu composites were systematically investigated. The introduction of Ni–P electroless plating efficiently reduced the densification temperature of uncoated GF/Cu composites from 850 to 650℃ and slightly increased the TC of the X–Y basal plane of the GF/Cu composites with 20 vol%–30 vol% graphite flakes. However, when the graphite flake content was greater than 30 vol%, the TC of the GF/Cu composites decreased with the introduction of Ni–P plating as a result of the combined effect of the improved heat-transfer interface with the transition layer, P generated at the interface, and the diffusion of Ni into the matrix. Given the effect of the Ni content on the TC of the Cu matrix and on the interface thermal resistance, a modified effective medium approximation model was used to predict the TC of the prepared GF/Cu composites.

Thermo-physical Properties of Continuous Carbon Fiber Reinforced Copper Matrix Composites

Continuous carbon fiber reinforced copper matrix composites with 70%(volume fraction) of carbon fibers prepared by squeeze casting technique have been used for investigation of the coefficient of thermal expansion(CTE) and thermal conductivity.Thermo-physical properties have been measured in both,longitudinal and transversal directions to the fiber orientation.The results showed that Cf/Cu composites may be a suitable candidate for heat sinks because of its good thermo-physical properties e.g.the low CTE(4.18×10-6/K) in longitudinal orientation and(14.98×10-6/K) in transversal orientation at the range of 20-50℃,a good thermal conductivity(87.2 W/m·K) in longitudinal orientation and(58.2 W/m·K) in transversal orientation.Measured CTE and thermal conductivity values are compared with those predicted by several well-known models.Eshelby model gave better results for prediction of the CTE and thermal conductivity of the unidirectional composites.

Selective interfacial bonding and thermal conductivity of diamond/Cu-alloy composites prepared by HPHT technique

Cu-based and Cu-alloy-based diamond composites were made by high-pressure-high-temperature （HPHT） sintering with the aim of maximizing the thermal conductivity of the composites. Improvements in interfacial bonding strength and thermo-physical properties of the composites were achieved using an atomized copper alloy with minor additions of Co, Cr, 13, and Ti. The thermal conductivity （TC） oh- mined exhibited as high as 688 W.m-1.K-1, but also as low as 325 W.m-1.K-l. A large variation in TC can be rationalized by the discrepancy of diamond-matrix interfacial bonding. It was found from fractography that preferential bonding between diamond and the Cu-alloy matrix occurred only on the diamond {100} faces. EDS analysis and Raman spectra suggested that selective interfacial bonding may be attributed to amorphous carbon increasing the wettability between diamond and the Cu-alloy matrix. Amorphous carbon was found to significantly affect the TC of the composite by interface modification.

Effect of sintering parameters on the microstructure and thermal conductivity of diamond/Cu composites prepared by high pressure and high temperature infiltration

Pure Cu composites reinforced with diamond particles were fabricated by a high pressure and high temperature （HPHT） infiltration technique. Their microstructural evolution and thermal conductivity were presented as a function of sintering parameters （temperature, pressure, and time）. The improvement in interfacial bonding strength and the maximum thermM conductivity of 750 W/（m.K） were achieved at the optimal sintering parameters of 1200℃, 6 GPa and 10 min. It is found that the thermal conductivity of the composites depends strongly on sintering pressure. When the sintering pressure is above 6 GPa, the diamond skeleton is detected, which greatly contributes to the excellent thermal conductivity.

Researches for higher electrical conductivity copper-based materials

Copper and copper-based materials are widely used in power electronics,auto-mobiles,mechanical manufacturing and high-tech manufacturing fields such as aerospace,telecommunications and integrated circuits owing to their compre-hensive advantages in mechanical,electrical conductivity and processing prop-erties.With the rapid development of technology,many emerging technical fields have introduced more challenging requirements for the electrical conductivity of copper.This article reviews the research status of high-conductivity copper-based materials and introduces three methods to improve electrical conductivity,including purification,alloying and addition of nanocarbon materials.We sum-marise the advantages,disadvantages and future development trends of methods for improving copper conductivity.The key to producing high-conductivity copper-based materials is development of low-cost,continuous and stable processes.

Influence of nano-Al_2O_3-reinforced oxide-dispersion-strengthened Cu on the mechanical and tribological properties of Cu-based composites

The mechanical and tribological properties of Cu-based powder metallurgy （P/M） friction composites containing 10wt%-50wt% oxide-dispersion-strengthened （ODS） Cu reinforced with nano-Al2O3 were investigated. Additionally, the friction and wear behaviors as well as the wear mechanism of the Cu-based composites were characterized by scanning electron microscopy （SEM） in conjunction with energy-dispersive X-ray spectroscopy （EDS） elemental mapping. The results indicated that the Cu-based friction composite containing 30wt% ODS Cu exhibited the highest hardness and shear strength. The average and instantaneous friction coefficient curves of this sample, when operated in a high-speed train at a speed of 300 km/h, were similar to those of a commercial disc brake pad produced by Knorr-Bremse AG （Germany）. Additionally, the lowest linear wear loss of the obtained samples was （0.008 ± 0.001） mm per time per face, which is much lower than that of the Knorr-Bremse pad （（0.01 ± 0.001） mm）. The excellent performance of the developed pad is a consequence of the formation of a dense oxide composite layer and its close combination with the pad body.

Pressure infiltrated Cu/diamond composites for LED applications

Diamond reinforced copper （Cu/diamond） composites were prepared by a pressure infilla＇ation technique. The composites show a super high conductivity of 713 W.m-1.K-1 in combination with an extremely low coefficient of thermal expansion （CTE） of 7.72 × 10-6 K-1 （25-100℃）, which are achieved by modifying the copper matrix with adding 0.3 wt.% of boron to get a good thermal contact between the matrix and the diamond particles. By adopting a series of postmachining techniques the composites were made into near-net-shape parts, and an electroless silver coating was also successfully plated on the composites. Finally, their potential applications in the thermal management of fight emitting diodes （LED） were illustrated via prototype examples.

Microstructural characterization and dry sliding wear behavior of spark plasma sintered Cu-YSZ composites

In the present study, yttria stabilized zirconia （YSZ） reinforced Cu matrix composite specimens were produced by spark plasma sintering （SPS）. For comparison, pure Cu specimen was also produced in the same conditions. The effect of particles content on microstructure, relative density, electrical conductivity, and Vickers hardness was evaluated. The pin-on-disk test was also performed to determine dry sliding wear behavior of specimens under different wear conditions. After sliding wear tests, the worn surfaces were examined by field emission scanning electron microscopy （FE-SEM）. Microstructural study showed satisfactory distribution of reinforcement particles in copper matrix. The relative density up to 95%was obtained for all specimens. By increasing YSZ content from 0 to 5% （volume fraction）, the electrical conductivity of specimens decreased from 99.2%IACS to 65%IACS, correspondingly. The hardness of Cu-5%YSZ composite specimen was two times greater than that of pure copper. The volume loss and wear rate of pure Cu specimen were 1.48 mm^3 and 1.5±10^-3 mm^3/m under 50 N applied load and 1000 m sliding distance. However, for composite containing 5% YSZ particles, these values dropped to 0.97 mm^3 and 0.9±10^-3 mm^3/m, respectively. Moreover, the friction coefficient of specimens was changed from 0.6 to 0.4. The worn surface and debris observation indicate local plastic deformation and delamination as dominant wear mechanisms for pure copper, while oxidation and ploughing for composite specimen. Accordingly, it can be concluded that the Cu-YSZ composite could be a good candidate for the electrical contact applications in relays, contactors, switches and circuit breakers requiring good electrical and thermal conductivity and capability to resist wearing.

Effect of particle size on thermo-physical properties of SiC_p/Cu composites fabricated by squeeze casting

For the electronic packaging applications, copper matrix composites reinforced with different sized SiC particles （10 μm, 20 μm and 63 μm） were fabricated by squeeze casting technology. And the effect of particle size on their thermo-physical properties was discussed. The composites are free of porosity and the SiC particles are distributed uniformly in the composites. It is found that the mean linear thermal expansion coefficients（20100 ℃） of SiCp/Cu composites are in the range of （8.49.2）×10-6/℃, and smaller expansion coefficient can be obtained for the composites with finer SiC particles because of the larger restriction in expansion through interfaces. Their thermal conductivities are reduced with the decrease of SiC sizes. This is attributed to the fact that the negative effect of interfacial thermal resistance becomes increasingly dominant as the particles becomes smaller.

石墨烯和碳纳米管增强铜基复合材料的研究进展

本文回顾了碳纳米管(CNT)和石墨烯(Gr)增强铜基复合材料的研究进展,探讨了这些复合材料的制备方法、性能提升机制及潜在应用前景。CNT和Gr因独特的物理化学特性,作为铜基复合材料的理想增强相,显著提升了材料的力学性能、导电性和热导率。首先回顾了铜基复合材料的传统制备技术,包括粉末冶金法和机械合金化法,随后介绍了新兴的化学气相沉积(CVD)和电沉积法,这些技术通过直接生长或电化学沉积实现更好的界面结合。对比分析了不同方法的优缺点,指出粉末冶金和机械合金化的成本较低但可能引起增强相分布不均,而CVD法虽能制备高质量材料但成本较高且环境影响敏感。进一步分析了CNT和Gr在铜基体中的分散性及界面结合对性能的影响,强调了良好分散性和强界面结合的重要性。在力学性能方面,CNT和Gr的分散性和界面结合对复合材料的强化机制起着关键作用,包括载荷转移、晶粒细化和Orowan强化等。此外,讨论了CNT和Gr增强铜基复合材料在耐腐蚀性、磨损性能及热管理等方面的应用潜力。尽管存在挑战,但这些复合材料在电力传输、电子器件和航空航天等领域显示出巨大应用前景。未来的研究将集中于微观结构控制、制备工艺创新和多功能复合材料开发,以实现更高性能的工业应用。

Hybrid effect on mechanical properties and high-temperature performance of copper matrix composite reinforced with micro-nano dual-scale particles

A dual-scale hybrid HfB_(2)/Cu-Hf composite with HfB_(2) microparticles and Cu_(5) Hf nanoprecipitates was designed and prepared.The contribution of the hybrid effect to the mechanical properties and high-temperature performances was studied from macro and micro perspectives,respectively.The hybrid of dual-scale particles can make the strain distribution of the composite at the early deformation stage more uniform and delay the strain concentration caused by the HfB_(2) particle.The dislocation pinning of HfB_(2) particles and the coherent strengthening of Cu_(5) Hf nanoprecipitates simultaneously play a strengthening role,but the strength of the hybrid composite is not a simple superposition of two strengthening mod-els.In addition,both Cu_(5) Hf nanoprecipitates and HfB_(2) microparticles contribute to the high-temperature performance of the composite,the growth and phase transition of nanoprecipitates at high temperature will reduce their contribution to strength,while the stable HfB_(2) particles can inhibit the coarsening of matrix grains and maintain the high-density geometrically necessary dislocations(GNDs)in the matrix,which ensures more excellent high-temperature resistance of the hybrid composite.As a result,the hy-brid structure can simultaneously possess the advantages of multiple reinforcements and make up for the shortcomings of each other.Finally,a copper matrix composite with high strength,high conductivity,and excellent high-temperature performance is displayed.

粉末冶金制备碳纳米管增强铜基复合材料研究进展

碳纳米管具有优异的力学性能和导电、导热性能,作为增强体引入铜基体中有望开发出新一代高强、结构功能一体化的复合材料。然而,碳纳米管在铜基体中的分散性较差及其与铜的润湿性问题,成为制备碳纳米管增强铜基(CNTs/Cu)复合材料的主要挑战,并显著影响了复合材料的性能。本文对目前有关制备碳纳米管增强铜基复合材料的主要方法包括碳纳米管前期预处理方法、碳纳米管在铜粉末中分散的方法、复合材料的烧结方法进行总结,概述复合材料的力学性能、摩擦磨损性能以及导电导热性能的研究进展,并提出思考和展望,以便为制备CNTs/Cu复合材料研究提供参考。

挤压速度对搅拌摩擦反挤压法制备Cu-5%Ti_(2)SnC复合丝材性能的影响

对粉末冶金法制备的含5%(体积分数)Ti_(2)Sn CMAX相的初始复合材料进行搅拌摩擦反挤压(FSBE)处理,研究FSBE工艺的轴向横移速度对Cu-Ti_(2)Sn C复合线材显微组织、力学性能、电学性能和磨损性能的影响。结果表明,随着挤压速度的增加,显微组织中孪晶增多,Ti_(2)SnC颗粒细化,MAX相和Cu基体之间的界面结合改善。当转速为600r/min,轴向横移速度为25mm/min时,Cu-Ti_(2)SnC复合线材具有最大的硬度、屈服强度和极限抗拉强度,分别为HV 132.7、278.34MPa和485.15MPa,这是其更强的界面结合和更细的MAX相导致的。此外,当转速为600 r/min,轴向横移速度为25 mm/min时,Cu-Ti_(2)SnC复合丝的电导率最高,达到89.21%(IACS),磨损率最低,为0.0015 mg/m,这是其更大的晶粒尺寸、更强的界面结合与更低的密度导致的。

高导电高耐热铜合金及铜基复合材料的研究现状与展望

高导耐热铜基材料作为现代高新技术用关键材料之一,已被广泛应用于轨道交通、电子通信和航空航天等领域。本文从铜合金和铜基复合材料两大领域入手,介绍了常见高导耐热铜材料的设计思路、制备方法、微观组织结构、力学性能和物理性能,并对其导电机制和高温强化机理进行了归纳和阐释,最后对高导耐热铜基材料的研究现状和未来发展进行了总结与展望。

弥散强化型导电铜基复合材料的研究进展

弥散强化铜基材料是一类具有优良综合性能的新型结构功能一体化材料,综述了弥散强化型导电铜基复合材料的理论研究进展、国内外的应用,以及近年来该材料制备方法的研究新进展,总结了该类材料的主要复合体系,指出解决增强相粉体的细化及增强相与基体铜之间的界面适配性问题是该类材料发展的关键性技术。

石墨烯增强铜基复合材料的制备及性能

为了解决石墨烯在铜基体中分散不均匀的问题,采用电荷吸引的方法将带负电荷的氧化石墨烯纳米片均匀的吸附在带正电荷的铜粉的表面,然后用粉末冶金的方法制备石墨烯增强铜基复合材料。采用扫描电镜,透射电镜,拉伸和导热测试等对石墨烯增强铜基复合材料的显微结构,力学性能和导热性能进行了研究。结果表明:石墨烯均匀的分散在铜基复合材料中,石墨烯在基体中的均匀分散和紧密的界面结合有效的提高了复合材料的性能。

粉末冶金法制备Cu/Al_2O_3复合材料及其性能研究

以纳米Al2O3为增强相,用粉末冶金法制备了铜基复合材料。研究了表面活性剂、Al2O3的比例、混粉方式对复合材料硬度、耐磨性和电导率的影响。结果表明,先用表面活性剂将纳米Al2O3制成单分散悬浮液再与铜粉湿磨混合,可有效改善弥散相的分布,其中Al2O3量以2%为最佳。最佳工艺制得的Cu基复合材料电导率为81%IACS,硬度达到98 HV0.1,相对纯铜而言,平均磨损体积下降46%,呈现出良好的高导高耐磨性。

石墨烯含量对铜基复合材料的导电、导热、耐腐蚀和力学性能的影响（英文）

采用电场压力激活辅助合成工艺(Field activated and pressure assisted synthesis process (FAPAS))制备铜基石墨烯复合材料,研究不同的石墨烯含量对铜基体材料的微观结构和性能的影响机理。结果表明,石墨烯的添加能提高材料的位错密度、阻止位错在晶界移动,硬度提升17.6%;由于石墨烯添加量少,对铜基复合材料的位错密度和晶粒尺寸影响有限,片状的石墨烯能有效地弥补制备产生的缺陷,使材料的热导率和电导率分别提升2.9%和4.4%;石墨烯的添加使腐蚀电池两极间的电位差减小,降低了铜离子在氧化膜中的扩散能力,使复合材料的阻抗提升5.3%,腐蚀电流密度下降28.2%,有效地提升了铜基复合材料的耐腐蚀性能。铜基石墨烯复合材料的石墨烯最佳添加量为0.5 wt.%。