Different sized single droplets of Cu-6%Sn alloy were prepared by drop on demand(DOD)technique.The secondarydendrite arm spacing was measured and correlated with the droplet cooling rate by a semi-empirical formula.Th...Different sized single droplets of Cu-6%Sn alloy were prepared by drop on demand(DOD)technique.The secondarydendrite arm spacing was measured and correlated with the droplet cooling rate by a semi-empirical formula.The microstructure ofdroplets was observed by optical microscopy(OM)and electro backscatter diffraction(EBSD).The dendrite feature of singledroplets depends on solidification rate,cooling medium and flight distance.When droplets collide with each other at temperaturesbetween solidus and liquidus,the dendrites and grains are refined obviously possibly because the collision enhances the heat transfer.The cooling rate of colliding droplets is estimated to be more than4×104K/s based on a Newton’s cooling model.The dendritesgrow along the colliding direction because of the temperature gradient induced by the internal flow inside the droplets.展开更多
Pulsed electrohydrodynamic printing （EHDP） is used to fabricate conductive silver patterns with micrometer resolution. The silver ink pendant experiences swelling, pulsation, and ejection under an applied pulse volt...Pulsed electrohydrodynamic printing （EHDP） is used to fabricate conductive silver patterns with micrometer resolution. The silver ink pendant experiences swelling, pulsation, and ejection under an applied pulse voltage of 20 Hz. The droplet deposi- tion frequency is equal to the applied voltage frequency so that the EHDP can deposit silver ink on demand. A low applied voltage favors uniform and non-scattering silver patterns while a high applied voltage results in ink scattering. Discrete drop- lets with 45-55 gm in diameter and continuous tracks with 60 gm in width are generated by using a ll0-i.tm-cailber nozzle. The feature size of deposited patterns is about half of the nozzle caliber, and a finer resolution can be achieved with the intro- duction of smaller nozzle calibers. Furthermore, the appropriate curing condition is investigated for sufficient combustion of ink solvent. The minimum resistivity of 3.3 gf~ cm is demonstrated for a continuous track cured at 200~C for 10 min. Eventu- ally, several passive electrical components, such as coated resistors, interdigitated capacitors （6 pF）, and spiral inductors （0.6 gH）, are successfully fabricated.展开更多
基金Project(51301143)supported by the National Natural Science Foundation of ChinaProject(2014M560727)supported by the National Postdoctoral Foundation of China+1 种基金Project(2015GZ0228)supported by the Sichuan Province Science-Technology Support Plan,ChinaProject(2682014CX001)supported by the Science and Technology Innovation Project of SWJTU University,China
文摘Different sized single droplets of Cu-6%Sn alloy were prepared by drop on demand(DOD)technique.The secondarydendrite arm spacing was measured and correlated with the droplet cooling rate by a semi-empirical formula.The microstructure ofdroplets was observed by optical microscopy(OM)and electro backscatter diffraction(EBSD).The dendrite feature of singledroplets depends on solidification rate,cooling medium and flight distance.When droplets collide with each other at temperaturesbetween solidus and liquidus,the dendrites and grains are refined obviously possibly because the collision enhances the heat transfer.The cooling rate of colliding droplets is estimated to be more than4×104K/s based on a Newton’s cooling model.The dendritesgrow along the colliding direction because of the temperature gradient induced by the internal flow inside the droplets.
基金supported by the National Natural Science Foundation of China (Grant No. 51035002)the Key Project of Chinese Ministry of Edu-cation (Grant No. 708055)the Fundamental Research Funds for the Central Universities (Grant No. 2010121039)
文摘Pulsed electrohydrodynamic printing （EHDP） is used to fabricate conductive silver patterns with micrometer resolution. The silver ink pendant experiences swelling, pulsation, and ejection under an applied pulse voltage of 20 Hz. The droplet deposi- tion frequency is equal to the applied voltage frequency so that the EHDP can deposit silver ink on demand. A low applied voltage favors uniform and non-scattering silver patterns while a high applied voltage results in ink scattering. Discrete drop- lets with 45-55 gm in diameter and continuous tracks with 60 gm in width are generated by using a ll0-i.tm-cailber nozzle. The feature size of deposited patterns is about half of the nozzle caliber, and a finer resolution can be achieved with the intro- duction of smaller nozzle calibers. Furthermore, the appropriate curing condition is investigated for sufficient combustion of ink solvent. The minimum resistivity of 3.3 gf~ cm is demonstrated for a continuous track cured at 200~C for 10 min. Eventu- ally, several passive electrical components, such as coated resistors, interdigitated capacitors （6 pF）, and spiral inductors （0.6 gH）, are successfully fabricated.
