Amorphous indium-gallium-zinc-oxide （a-IGZO） thin-film transistor （TFT） backplane technology is the best candidate for flat panel displays （FPDs）. In this paper, a-IGZO TFT structures are described. The effects ...Amorphous indium-gallium-zinc-oxide （a-IGZO） thin-film transistor （TFT） backplane technology is the best candidate for flat panel displays （FPDs）. In this paper, a-IGZO TFT structures are described. The effects of etch parameters （rf power, dc-bias voltage and gas pressure） on the etch rate and etch profile are discussed. Three kinds of gas mixtures are compared in the dry etching process of a-IGZO thin films. Lastly, three problems are pointed out that need to be addressed in the dry etching process of a-IGZO TFTs.展开更多
In order to improve the light efficiency of the conventional GaN-based light-emitting diodes （LEDs）, the indium tin oxide （ITO） film is introduced as the current spreading layer and the light anti-reflecting layer...In order to improve the light efficiency of the conventional GaN-based light-emitting diodes （LEDs）, the indium tin oxide （ITO） film is introduced as the current spreading layer and the light anti-reflecting layer on the p-GaN surface. There is a big problem with the ITO thin film＇s corrosion during the electrode preparation. In this paper, at least, the edge of the ITO film was lateral corroded 3.5μm width, i.e. 6.43%-1/3 of ITO film＇s area. An optimized simple process, i.e. inductively couple plasma （ICP）, was introduced to solve this problem. The ICP process not only prevented the ITO film from lateral corrosion, but also improved the LED＇s light intensity and device performance. The edge of the ITO film by ICP dry etching is steep, and the areas of ITO film are whole. Compared with the chip by wet etching, the areas of light emission increase by 6.43% at least and the chip＇s lop values increase by 45.9% at most.展开更多
The dry etching characteristic of AlSbTe film was investigated by using a CF/Ar gas mixture.The experimental control parameters were gas flow rate into the chamber,CF/Ar ratio,the Oaddition,the chamber background pres...The dry etching characteristic of AlSbTe film was investigated by using a CF/Ar gas mixture.The experimental control parameters were gas flow rate into the chamber,CF/Ar ratio,the Oaddition,the chamber background pressure,and the incident RF power applied to the lower electrode.The total flow rate was 50 sccm and the behavior of etch rate of AlSbTe thin films was investigated as a function of the CF/Ar ratio,the Oaddition,the chamber background pressure,and the incident RF power.Then the parameters were optimized.The fast etch rate was up to 70.8 nm/min and a smooth surface was achieved using optimized etching parameters of CFconcentration of 4%,power of 300 W and pressure of 80 mTorr.展开更多
文摘Amorphous indium-gallium-zinc-oxide （a-IGZO） thin-film transistor （TFT） backplane technology is the best candidate for flat panel displays （FPDs）. In this paper, a-IGZO TFT structures are described. The effects of etch parameters （rf power, dc-bias voltage and gas pressure） on the etch rate and etch profile are discussed. Three kinds of gas mixtures are compared in the dry etching process of a-IGZO thin films. Lastly, three problems are pointed out that need to be addressed in the dry etching process of a-IGZO TFTs.
文摘In order to improve the light efficiency of the conventional GaN-based light-emitting diodes （LEDs）, the indium tin oxide （ITO） film is introduced as the current spreading layer and the light anti-reflecting layer on the p-GaN surface. There is a big problem with the ITO thin film＇s corrosion during the electrode preparation. In this paper, at least, the edge of the ITO film was lateral corroded 3.5μm width, i.e. 6.43%-1/3 of ITO film＇s area. An optimized simple process, i.e. inductively couple plasma （ICP）, was introduced to solve this problem. The ICP process not only prevented the ITO film from lateral corrosion, but also improved the LED＇s light intensity and device performance. The edge of the ITO film by ICP dry etching is steep, and the areas of ITO film are whole. Compared with the chip by wet etching, the areas of light emission increase by 6.43% at least and the chip＇s lop values increase by 45.9% at most.
基金supported by National Key Basic Research Program of China(Nos.2010CB934300,2011CBA00607,2011CB932800)the National Integrated Circuit Research Program of China(No.2009ZX02023-003)+1 种基金the National Natural Science Foundation of China(Nos.60906004, 60906003,61006087,61076121)the Science and Technology Council of Shanghai,China(No.1052nm07000)
文摘The dry etching characteristic of AlSbTe film was investigated by using a CF/Ar gas mixture.The experimental control parameters were gas flow rate into the chamber,CF/Ar ratio,the Oaddition,the chamber background pressure,and the incident RF power applied to the lower electrode.The total flow rate was 50 sccm and the behavior of etch rate of AlSbTe thin films was investigated as a function of the CF/Ar ratio,the Oaddition,the chamber background pressure,and the incident RF power.Then the parameters were optimized.The fast etch rate was up to 70.8 nm/min and a smooth surface was achieved using optimized etching parameters of CFconcentration of 4%,power of 300 W and pressure of 80 mTorr.
