期刊文献+
共找到2篇文章
< 1 >
每页显示 20 50 100
NANOSCALE CUTTING OF MONOCRYSTALLINE SILICON USING MOLECULAR DYNAMICS SIMULATION 被引量:2
1
作者 LI Xiaoping CAI Minbo RAHMAN Mustafizur 《Chinese Journal of Mechanical Engineering》 SCIE EI CAS CSCD 2007年第5期8-11,共4页
It has been found that the brittle material, monocrystalline silicon, can be machined in ductile mode in nanoscale cutting when the tool cutting edge radius is reduced to nanoscale and the undeformed chip thickness is... It has been found that the brittle material, monocrystalline silicon, can be machined in ductile mode in nanoscale cutting when the tool cutting edge radius is reduced to nanoscale and the undeformed chip thickness is smaller than the tool edge radius. In order to better understand the mechanism of ductile mode cutting of silicon, the molecular dynamics (MD) method is employed to simulate the nanoscale cutting of monocrystalline silicon. The simulated variation of the cutting forces with the tool cutting edge radius is compared with the cutting force results from experimental cutting tests and they show a good agreement. The results also indicate that there is silicon phase transformation from monocrystalline to amorphous in the chip formation zone that can be used to explain the cause of ductile mode cutting. Moreover, from the simulated stress results, the two necessary conditions of ductile mode cutting, the tool cutting edge radius are reduced to nanoscale and the undeformed chip thickness should be smaller than the tool cutting edge radius, have been explained. 展开更多
关键词 Ductile mode cutting Molecular dynamics Phase transformation force Stress
下载PDF
Investigation of a dynamics-oriented engineering approach to ultraprecision machining of freeform surfaces and its implementation perspectives
2
作者 Ali Khaghani Kai Cheng 《Nanotechnology and Precision Engineering》 CAS CSCD 2021年第4期12-23,共12页
In current precision and ultraprecision machining practice,the positioning and control of actuation systems,such as slideways and spindles,are heavily dependent on the use of linear or rotary encoders.However,position... In current precision and ultraprecision machining practice,the positioning and control of actuation systems,such as slideways and spindles,are heavily dependent on the use of linear or rotary encoders.However,positioning control is passive because of the lack of direct monitoring and control of the tool and workpiece positions in the dynamic machining process and also because it is assumed that the machining system is rigid and the cutting dynamics are stable.In ultraprecision machining of freeform surfaces using slow tool servo mode in particular,however,account must be taken of the machining dynamics and dynamic synchronization of the cutting tool and workpiece positioning.The important question also arises as to how ultraprecision machining systems can be designed and developed to work better in this application scenario.In this paper,an innovative dynamics-oriented engineering approach is presented for ultraprecision machining of freeform surfaces using slow tool servo mode.The approach is focused on seamless integration of multibody dynamics,cutting forces,and machining dynamics,while targeting the positioning and control of the tool–workpiece loop in the machining system.The positioning and motion control between the cutting tool and workpiece surface are further studied in the presence of interfacial interactions at the tool tip and workpiece surface.The interfacial cutting physics and dynamics are likely to be at the core of in-process monitoring applicable to ultraprecision machining systems.The approach is illustrated using a virtual machining system developed and supported with simulations and experimental trials.Furthermore,the paper provides further explorations and discussion on implementation perspectives of the approach,in combination with case studies,as well as discussing its fundamental and industrial implications. 展开更多
关键词 Ultraprecision machining Freeform surface dynamics-oriented approach dynamic cutting force Slow tool servo mode Microcutting
下载PDF
上一页 1 下一页 到第
使用帮助 返回顶部