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Molecular dynamics study of thermal stress and heat propagation in tungsten under thermal shock 被引量:1
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作者 付宝勤 赖文生 +4 位作者 袁悦 徐海燕 李纯 贾玉振 刘伟 《Chinese Physics B》 SCIE EI CAS CSCD 2013年第12期376-382,共7页
Using molecular dynamics (MD) simulation, we study the thermal shock behavior of tungsten (W), which has been used for the plasma facing material (PFM) of tokamaks. The thermo-elastic stress wave, corresponding ... Using molecular dynamics (MD) simulation, we study the thermal shock behavior of tungsten (W), which has been used for the plasma facing material (PFM) of tokamaks. The thermo-elastic stress wave, corresponding to the collective displacement of atoms, is analyzed with the Lagrangian atomic stress method, of which the reliability is also analyzed. The stress wave velocity corresponds to the speed of sound in the material, which is not dependent on the thermal shock energy. The peak pressure of a normal stress wave increases with the increase of thermal shock energy. We analyze the temperature evolution of the thermal shock region according to the Fourier transformation. It can be seen that the “obvious” velocity of heat propagation is less than the velocity of the stress wave; further, that the thermo-elastic stress wave may contribute little to the transport of kinetic energy. The heat propagation can be described properly by the heat conduction equation. These results may be useful for understanding the process of the thermal shock of tungsten. 展开更多
关键词 molecular dynamics simulation thermal shock thermo-elastic stress heat propagation tungsten
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DYNAMIC OPTIMIZATION OF THERMAL STRUCTURE
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作者 Chen Jifeng Duan Degao(8-th Dep, Northwestern Polytechnical University, Hi’an, China, 710072)Wang Jingen(3-rd Dep, Air Force Missiie Institute, Shaanxi, China, 7 1 3800) 《Chinese Journal of Aeronautics》 SCIE EI CAS CSCD 1994年第3期213-218,共6页
he temperature distnbution on the surface of a flight vehicle and the va-riation of the modulus of elasticity with respect to temperature are considered. The minimum weight structural design with constraints on freque... he temperature distnbution on the surface of a flight vehicle and the va-riation of the modulus of elasticity with respect to temperature are considered. The minimum weight structural design with constraints on frequency, on the coordinates ofmodal nodes and on the upper and lower bounds of the design vanables are studied us-ing Kuhn-Tucker conditions as optimal cntenon. The vanation of the flrst three ordernatural frequencies, modal shapes and minimum structural weight vs temperature gra-dient are discussed. It is pointed out that it is imperative to take into account the effectof aerodynamic heating on structural dynamic optimization. Calculation example showsthat the method obtained is feasible and efficient. 展开更多
关键词 thermal stresses dynamic structural analysis structural design optimization
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MD simulation of a copper rod under thermal shock 被引量:3
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作者 Rong-Hou Xia Xiao-Geng Tian Ya-Peng Shen 《Acta Mechanica Sinica》 SCIE EI CAS CSCD 2010年第4期599-604,共6页
In this paper, thermoelastic problem of onedimensional copper rod under thermal shock is simulated using molecular dynamics method by adopting embedded atom method potential. The rod is on axis x, the left outermost s... In this paper, thermoelastic problem of onedimensional copper rod under thermal shock is simulated using molecular dynamics method by adopting embedded atom method potential. The rod is on axis x, the left outermost surface of which is traction free and the right outermost surface is fixed. Free boundary condition is imposed on the outermost surfaces in direction y and z. The left and right ends of the rod are subjected to hot and cold baths, respectively. Temperature, displacement and stress distributions are obtained along the rod at different moments, which are shown to be limited in the mobile region, indicating that the heat propagation speed is limited rather than infinite. This is consistent with the prediction given by generalized thermoelastic theory. From simulation results we find that the speed of heat conduction is the same as the speed of thermal stress wave. In the present paper, the simulations are conducted using the large-scale atomic/molecular massively parallel simulator and completed visualization software. 展开更多
关键词 Embedded atom method potential Molecular dynamics simulation Thermoelastic coupling thermal stress
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