Continuum-based discrete element method(CDEM)is an explicit numerical method used for simulation of progressive failure of geological body.To improve the efficiency of contact detection and simplify the calculation st...Continuum-based discrete element method(CDEM)is an explicit numerical method used for simulation of progressive failure of geological body.To improve the efficiency of contact detection and simplify the calculation steps for contact forces,semi-spring and semi-edge are introduced in calculation.Semispring is derived from block vertex,and formed by indenting the block vertex into each face(24semisprings for a hexahedral element).The formation process of semi-edge is the same as that of semi-spring(24semi-edges for a hexahedral element).Based on the semi-springs and semi-edges,a new type of combined contact model is presented.According to this model,six contact types could be reduced to two,i.e.the semi-spring target face contact and semi-edge target edge contact.By the combined model,the contact force could be calculated directly(the information of contact type is not necessary),and the failure judgment could be executed in a straightforward way(each semi-spring and semi-edge own their characteristic areas).The algorithm has been successfully programmed in C++program.Some simple numerical cases are presented to show the validity and accuracy of this model.Finally,the failure mode,sliding distance and critical friction angle of Jiweishan landslide are studied with the combined model.展开更多
The study is carried out in imperfect contact with a concrete slab wall attached to a panel based on rice straw compressed in a dynamic frequency regime. We will propose the characterization of thermal insulation for ...The study is carried out in imperfect contact with a concrete slab wall attached to a panel based on rice straw compressed in a dynamic frequency regime. We will propose the characterization of thermal insulation for thermal resistance of contact (<i><span style="font-family:Verdana;">x</span></i><span style="font-family:Verdana;"> = 0.05 m). The impact of heat exchange coefficients on the front face (</span><i><span style="font-family:Verdana;">x</span></i><span style="font-family:Verdana;"> = 0 m) and the rear face (</span><i><span style="font-family:Verdana;">x</span></i><span style="font-family:Verdana;"> = 0.1 m) on these resistors is shown.</span>展开更多
Structural superlubricity(SSL) refers to a state of ultralow friction and zero wear when two solid surfaces slide against each other. Recent investigations have identified amorphous carbon at the edge of the graphite ...Structural superlubricity(SSL) refers to a state of ultralow friction and zero wear when two solid surfaces slide against each other. Recent investigations have identified amorphous carbon at the edge of the graphite mesa as the primary source of friction in such SSL systems. Here, the tensile stress of metal thin film is exploited to engineer vertically conductive edge-warping graphite mesas(EWGM). Through this approach, robust SSL performance is realized, demonstrated by sliding an 8 μm side length square EWGM on an atomically smooth Au substrate for 10000 cycles at a constant voltage of 1 m V. In this SSL system,differential friction coefficients lower than 1.5 × 10^(-4) are achieved, with static contact resistance between EWGM and Au substrate as low as 28Ω and sliding contact resistance as low as 32Ω. Moreover, the EWGM exhibits SSL behavior on polished Si wafer substrates. Furthermore, because of the no-edge contact with the substrate during sliding, friction is independent of the sliding speed of the EWGM. This study presents the first successful fabrication of conductive EWGM. Remarkably, in both EWGM-Au and EWGM-Si SSL systems, the measured frictions are more than one order of magnitude lower than those of ordinary self-retracting graphite mesas with no-edge warping, and no wear is observed during extended current-carrying sliding.Overall, these findings establish a solid groundwork for the future realization of macroscale conductive SSL systems.展开更多
Printed circuit boards(PCBs)are representative composite materials,and their high-quality drilling machining remains a persistent challenge in the industry.The finishing of the cutting edge of a microdrill is crucial ...Printed circuit boards(PCBs)are representative composite materials,and their high-quality drilling machining remains a persistent challenge in the industry.The finishing of the cutting edge of a microdrill is crucial to drill performance in machining fine-quality holes with a prolonged tool life.The miniature size involving submicron scale geometric dimensions,a complex flute shape,and low fracture toughness makes the cutting edge of microdrills susceptible to breakage and has been the primary limiting factor in edge preparation for microdrills.In this study,a newly developed cutting edge preparation method for microdrills was tested experimentally on electronic printed circuit boards.The proposed method,namely,shear thickening polishing,limited the cutting edge burrs and chipping on the cutting edge,and this in turn transformed the cutting edge’s radius from being sharp to smooth.Moreover,the edge–edge radius could be regulated by adjusting the processing time.PCB drilling experiments were conducted to investigate the influence of different cutting edge radii on wear,hole position accuracy,nail head value,and hole wall roughness.The proposed approach showed 20%enhancement in hole position accuracy,33%reduction in the nail head value,and 19%reduction in hole wall roughness compared with the original microdrill.However,a threshold is needed;without it,excessive shear thickening polishing will result in a blunt edge,which may accelerate the wear of the microdrill.Wear was identified as the primary factor that reduced hole quality.The study indicates that in printed circuit board machining,microdrills should effectively eliminate grinding defects and maintain the sharpness of the cutting edge as much as possible to obtain excellent drilling quality.Overall,shear thickening polishing is a promising method for cutting edge preparation of microdrills.Further research and optimization can lead to additional improvements in microdrill performance and contribute to the continued advancement of printed circuit board manufacturing.展开更多
基金the National Basic Research Program of the Ministry of Science and Technology of China (Grant No. 2010CB731506)the National Key Technology Research and Development Program of the Ministry of Science and Technology of China (Grant No. 2012BAK10B01)the Youth Science Fund of National Natural Science Foundation of China (Grant No. 11302230)
文摘Continuum-based discrete element method(CDEM)is an explicit numerical method used for simulation of progressive failure of geological body.To improve the efficiency of contact detection and simplify the calculation steps for contact forces,semi-spring and semi-edge are introduced in calculation.Semispring is derived from block vertex,and formed by indenting the block vertex into each face(24semisprings for a hexahedral element).The formation process of semi-edge is the same as that of semi-spring(24semi-edges for a hexahedral element).Based on the semi-springs and semi-edges,a new type of combined contact model is presented.According to this model,six contact types could be reduced to two,i.e.the semi-spring target face contact and semi-edge target edge contact.By the combined model,the contact force could be calculated directly(the information of contact type is not necessary),and the failure judgment could be executed in a straightforward way(each semi-spring and semi-edge own their characteristic areas).The algorithm has been successfully programmed in C++program.Some simple numerical cases are presented to show the validity and accuracy of this model.Finally,the failure mode,sliding distance and critical friction angle of Jiweishan landslide are studied with the combined model.
文摘The study is carried out in imperfect contact with a concrete slab wall attached to a panel based on rice straw compressed in a dynamic frequency regime. We will propose the characterization of thermal insulation for thermal resistance of contact (<i><span style="font-family:Verdana;">x</span></i><span style="font-family:Verdana;"> = 0.05 m). The impact of heat exchange coefficients on the front face (</span><i><span style="font-family:Verdana;">x</span></i><span style="font-family:Verdana;"> = 0 m) and the rear face (</span><i><span style="font-family:Verdana;">x</span></i><span style="font-family:Verdana;"> = 0.1 m) on these resistors is shown.</span>
基金supported by the National Natural Science Foundation of China (Grant Nos. 12204321, 51961145304)Guangdong Basic and Applied Basic Research Foundation (Grant No. 2022B1515120040)+1 种基金Shenzhen Science and Technology Program (Grant Nos. RCBS20210609104540088, JCYJ20200109150608043, JCYJ20210324100600001, and JSGG20220831095802004)Shenzhen Key Laboratory of Superlubricity Technology (Grant No. ZDSYS20230626091701002)。
文摘Structural superlubricity(SSL) refers to a state of ultralow friction and zero wear when two solid surfaces slide against each other. Recent investigations have identified amorphous carbon at the edge of the graphite mesa as the primary source of friction in such SSL systems. Here, the tensile stress of metal thin film is exploited to engineer vertically conductive edge-warping graphite mesas(EWGM). Through this approach, robust SSL performance is realized, demonstrated by sliding an 8 μm side length square EWGM on an atomically smooth Au substrate for 10000 cycles at a constant voltage of 1 m V. In this SSL system,differential friction coefficients lower than 1.5 × 10^(-4) are achieved, with static contact resistance between EWGM and Au substrate as low as 28Ω and sliding contact resistance as low as 32Ω. Moreover, the EWGM exhibits SSL behavior on polished Si wafer substrates. Furthermore, because of the no-edge contact with the substrate during sliding, friction is independent of the sliding speed of the EWGM. This study presents the first successful fabrication of conductive EWGM. Remarkably, in both EWGM-Au and EWGM-Si SSL systems, the measured frictions are more than one order of magnitude lower than those of ordinary self-retracting graphite mesas with no-edge warping, and no wear is observed during extended current-carrying sliding.Overall, these findings establish a solid groundwork for the future realization of macroscale conductive SSL systems.
基金support from the National Natural Science Foundation of China(Grant No.52175441)the Natural Science Foundation of Zhejiang Province,China(Grant No.LD22E050010)+4 种基金the travel scholarship from the China Scholarship Council(Grant No.202208330333)for secondment of Jiahuan Wang at London South Bank University(LSBU)for working closely with Prof.GoelSaurav Goel would like to acknowledge the funding support from UK Research and Innovation,UKRI(Grant Nos.EP/S036180/1 and EP/T024607/1)the feasibility study awards to LSBU from the UKRI National Interdisciplinary Circular Economy Hub(Grant No.EP/V029746/1)Transforming the Foundation Industries:A Network+(Grant No.EP/V026402/1)the International Exchange Cost Share Award by the Royal Society(Grant No.IEC\NSFC\223536).This work accessed the supercomputing service(Isambard-AI,Bristol,UK)via the Resource Allocation Panel and Kittrick(LSBU)-based computational resources.
文摘Printed circuit boards(PCBs)are representative composite materials,and their high-quality drilling machining remains a persistent challenge in the industry.The finishing of the cutting edge of a microdrill is crucial to drill performance in machining fine-quality holes with a prolonged tool life.The miniature size involving submicron scale geometric dimensions,a complex flute shape,and low fracture toughness makes the cutting edge of microdrills susceptible to breakage and has been the primary limiting factor in edge preparation for microdrills.In this study,a newly developed cutting edge preparation method for microdrills was tested experimentally on electronic printed circuit boards.The proposed method,namely,shear thickening polishing,limited the cutting edge burrs and chipping on the cutting edge,and this in turn transformed the cutting edge’s radius from being sharp to smooth.Moreover,the edge–edge radius could be regulated by adjusting the processing time.PCB drilling experiments were conducted to investigate the influence of different cutting edge radii on wear,hole position accuracy,nail head value,and hole wall roughness.The proposed approach showed 20%enhancement in hole position accuracy,33%reduction in the nail head value,and 19%reduction in hole wall roughness compared with the original microdrill.However,a threshold is needed;without it,excessive shear thickening polishing will result in a blunt edge,which may accelerate the wear of the microdrill.Wear was identified as the primary factor that reduced hole quality.The study indicates that in printed circuit board machining,microdrills should effectively eliminate grinding defects and maintain the sharpness of the cutting edge as much as possible to obtain excellent drilling quality.Overall,shear thickening polishing is a promising method for cutting edge preparation of microdrills.Further research and optimization can lead to additional improvements in microdrill performance and contribute to the continued advancement of printed circuit board manufacturing.
