Investigating the thermal transport properties of materials is of great importance in the field of earth science and for the development of materials under extremely high temperatures and pressures.However,it is an en...Investigating the thermal transport properties of materials is of great importance in the field of earth science and for the development of materials under extremely high temperatures and pressures.However,it is an enormous challenge to characterize the thermal and physical properties of materials using the diamond anvil cell(DAC)platform.In the present study,a steady-state method is used with a DAC and a combination of thermocouple temperature measurement and numerical analysis is performed to calculate the thermal conductivity of the material.To this end,temperature distributions in the DAC under high pressure are analyzed.We propose a three-dimensional radiative-conductive coupled heat transfer model to simulate the temperature field in the main components of the DAC and calculate in situ thermal conductivity under high-temperature and high-pressure conditions.The proposed model is based on the finite volume method.The obtained results show that heat radiation has a great impact on the temperature field of the DAC,so that ignoring the radiation effect leads to large errors in calculating the heat transport properties of materials.Furthermore,the feasibility of studying the thermal conductivity of different materials is discussed through a numerical model combined with locally measured temperature in the DAC.This article is expected to become a reference for accurate measurement of in situ thermal conductivity in DACs at high-temperature and high-pressure conditions.展开更多
The study on soil thermal conductivity (STC) was an important side of research on ground source heat pump technique,geological disposal of high-level radioactive wastes,heat distribution of buried cable. Especially ow...The study on soil thermal conductivity (STC) was an important side of research on ground source heat pump technique,geological disposal of high-level radioactive wastes,heat distribution of buried cable. Especially owing to technical requirement for shallow terrestrial heat recently, it directly influenced the design and solution in engineering problems. The authors measured the STC in the studied area with QTM-D2 and discussed the effect of samples in size, the measurement error between the samples in lab and in site. The results indicate measuring STC by heat pole method with less influence upon the samples in size, and measuring results on the different geometry size approach very much. The STC is fit for the empirical relation between the temperature and TC under the condition of normal temperature. It is significance for understanding STC in northern China and simulation of temperature field.展开更多
In this paper,diamond/CuCr and diamond/CuB composites were prepared using the pressure infiltration method.The physical property measurement system(PPMS)was adopted to evaluate the thermal conductivity of diamond/Cu a...In this paper,diamond/CuCr and diamond/CuB composites were prepared using the pressure infiltration method.The physical property measurement system(PPMS)was adopted to evaluate the thermal conductivity of diamond/Cu and MoCu composites within the range of100–350 K,and a scanning electron microscope(SEM)was utilized to analyze the microstructure and fracture appearance of the materials.The research indicates that the thermal conductivity of diamond/Cu composite within the range of100–350 K is 2.5–3.0 times that of the existing MoCu material,and the low-temperature thermal conductivity of diamond/Cu composite presents an exponential relationship with the temperature.If B element was added to a Cu matrix and a low-temperature binder was used for prefabricated elements,favorable interfacial adhesion,relatively high interfacial thermal conductivity,and favorable low-temperature heat conduction characteristics would be apparent.展开更多
Thermal analysis and low temperature D.C. electrical transport measurements of the conducting polymer Versicon? were carried out between 20 K and 300 K. The material was found to be stable up to 498 K (225°C), wi...Thermal analysis and low temperature D.C. electrical transport measurements of the conducting polymer Versicon? were carried out between 20 K and 300 K. The material was found to be stable up to 498 K (225°C), with a glass transition at 210 K (-63°C), and a crystalline transition at 436 K (163°C). The electrical resistivity data best fitted the Fluctuation Induced Tunneling (FIT) model, suggesting that at low temperatures, the electron transport is by tunneling through thermally modulated barriers. The high temperature data best fitted the thermally activated hopping model, with an activation energy of 0.015 eV, suggesting that the thermally activated hopping may be a parallel transport process to fluctuation induced tunneling, becoming dominant at higher temperatures. From the FIT model the inter-particle distance was estimated to be 12 ?. The electrical transport results were also consistent with the assertion that Versicon? forms spherical aggregates, creating conducting pathways even in an insulating matrix.展开更多
Numerous researches have focused on the physical behavior of an elastic material in the vicinity of a single hole under the assumption that the interaction effects arising from the introduction of multiple holes remai...Numerous researches have focused on the physical behavior of an elastic material in the vicinity of a single hole under the assumption that the interaction effects arising from the introduction of multiple holes remain negligible if the holes are placed sufficiently far from each other.In an effort to understand hole interaction effects on heat conduction and thermal stress,we consider the case when two circular holes are embedded in an infinite elastic material and use complex variable methods together with numerical analysis to obtain solutions describing temperature and elastic fields in the vicinity of the two circular holes.The results indicate that the interaction effects on temperature distribution and stress strongly depend on the relative size of the two holes and the distance placed between them but not on the actual size of the holes.展开更多
基金Project supported by the National Key Research and Development Program of China(Grant No.2018YFA0702700)the National Natural Science Foundation of China(Grant Nos.11674404 and 11774126)。
文摘Investigating the thermal transport properties of materials is of great importance in the field of earth science and for the development of materials under extremely high temperatures and pressures.However,it is an enormous challenge to characterize the thermal and physical properties of materials using the diamond anvil cell(DAC)platform.In the present study,a steady-state method is used with a DAC and a combination of thermocouple temperature measurement and numerical analysis is performed to calculate the thermal conductivity of the material.To this end,temperature distributions in the DAC under high pressure are analyzed.We propose a three-dimensional radiative-conductive coupled heat transfer model to simulate the temperature field in the main components of the DAC and calculate in situ thermal conductivity under high-temperature and high-pressure conditions.The proposed model is based on the finite volume method.The obtained results show that heat radiation has a great impact on the temperature field of the DAC,so that ignoring the radiation effect leads to large errors in calculating the heat transport properties of materials.Furthermore,the feasibility of studying the thermal conductivity of different materials is discussed through a numerical model combined with locally measured temperature in the DAC.This article is expected to become a reference for accurate measurement of in situ thermal conductivity in DACs at high-temperature and high-pressure conditions.
文摘The study on soil thermal conductivity (STC) was an important side of research on ground source heat pump technique,geological disposal of high-level radioactive wastes,heat distribution of buried cable. Especially owing to technical requirement for shallow terrestrial heat recently, it directly influenced the design and solution in engineering problems. The authors measured the STC in the studied area with QTM-D2 and discussed the effect of samples in size, the measurement error between the samples in lab and in site. The results indicate measuring STC by heat pole method with less influence upon the samples in size, and measuring results on the different geometry size approach very much. The STC is fit for the empirical relation between the temperature and TC under the condition of normal temperature. It is significance for understanding STC in northern China and simulation of temperature field.
基金supported by the National Natural Science Foundation of China (No. 50971020)
文摘In this paper,diamond/CuCr and diamond/CuB composites were prepared using the pressure infiltration method.The physical property measurement system(PPMS)was adopted to evaluate the thermal conductivity of diamond/Cu and MoCu composites within the range of100–350 K,and a scanning electron microscope(SEM)was utilized to analyze the microstructure and fracture appearance of the materials.The research indicates that the thermal conductivity of diamond/Cu composite within the range of100–350 K is 2.5–3.0 times that of the existing MoCu material,and the low-temperature thermal conductivity of diamond/Cu composite presents an exponential relationship with the temperature.If B element was added to a Cu matrix and a low-temperature binder was used for prefabricated elements,favorable interfacial adhesion,relatively high interfacial thermal conductivity,and favorable low-temperature heat conduction characteristics would be apparent.
文摘Thermal analysis and low temperature D.C. electrical transport measurements of the conducting polymer Versicon? were carried out between 20 K and 300 K. The material was found to be stable up to 498 K (225°C), with a glass transition at 210 K (-63°C), and a crystalline transition at 436 K (163°C). The electrical resistivity data best fitted the Fluctuation Induced Tunneling (FIT) model, suggesting that at low temperatures, the electron transport is by tunneling through thermally modulated barriers. The high temperature data best fitted the thermally activated hopping model, with an activation energy of 0.015 eV, suggesting that the thermally activated hopping may be a parallel transport process to fluctuation induced tunneling, becoming dominant at higher temperatures. From the FIT model the inter-particle distance was estimated to be 12 ?. The electrical transport results were also consistent with the assertion that Versicon? forms spherical aggregates, creating conducting pathways even in an insulating matrix.
基金the National Natural Science Foundation of China(No.11902116)the China Postdoctoral Science Foundation(No.2020M671313)the Natural Sciences and Engineering Research Council of Canada(No.RGPIN 155112)。
文摘Numerous researches have focused on the physical behavior of an elastic material in the vicinity of a single hole under the assumption that the interaction effects arising from the introduction of multiple holes remain negligible if the holes are placed sufficiently far from each other.In an effort to understand hole interaction effects on heat conduction and thermal stress,we consider the case when two circular holes are embedded in an infinite elastic material and use complex variable methods together with numerical analysis to obtain solutions describing temperature and elastic fields in the vicinity of the two circular holes.The results indicate that the interaction effects on temperature distribution and stress strongly depend on the relative size of the two holes and the distance placed between them but not on the actual size of the holes.
