An electroless ternary Ni-Sn-P transition layer with high corrosion resistance was applied for acid electroless nickel plating on magnesium alloys. The surface morphologies and microstructure of the traditional alkali...An electroless ternary Ni-Sn-P transition layer with high corrosion resistance was applied for acid electroless nickel plating on magnesium alloys. The surface morphologies and microstructure of the traditional alkaline electroless Ni-P and novel Ni-Sn-P transition layers were compared by SEM and XRD, and the bonding strengths between the transition layers and AZ31 magnesium alloys were tested. The corrosion resistance of the samples was analyzed by porosity test, potentiodynamic polarization, electrochemical impedance spectroscopy（EIS） in acid electroless solution at p H 4.5 and immersion test in 10% HCl. The results indicate that the transition layer is essential for acid electroless plating Ni-P coatings on magnesium alloys. Under the same thin thickness（-6 μm）, the electroless Ni-Sn-P transition layer possesses superior properties to the traditional Ni-P transition layer, including high amorphization, smooth and dense surface without pores, enhanced bonding strength and corrosion resistance. Most importantly, acid electroless Ni-P coatings can be successfully deposited on magnesium alloys by using Ni-Sn-P transition layer.展开更多
Metal-coated fiber Bragg grating（FBG）temperature sensors were prepared via electroless nickel（EN）plating and tin electroplating methods on the surface of normal bare FBG.The surface morphologies of the metal-coate...Metal-coated fiber Bragg grating（FBG）temperature sensors were prepared via electroless nickel（EN）plating and tin electroplating methods on the surface of normal bare FBG.The surface morphologies of the metal-coated layers were observed under a metallographic microscope.The effects of pretreatment sequence,pH value of EN plating solution and current density of electroplating on the performance of the metal-coated layers were analyzed.Meanwhile, the Bragg wavelength shift induced by temperature was monitored by an optical spectrum analyzer.Sensitivity of the metal-coated FBG（MFBG）sensor was almost two times that of normal bare FBG sensor.The measuring temperature of the MFBG sensor could be up to 280℃,which was much better than that of conventional FBG sensor.展开更多
The solder joint strength of Pb/Sn soldering aluminum with electroless layer Sn/Bi and Cu was studied. The results show that the joint shear strength of electroless Sn/Bi on aluminum surface is lower than that of Cu. ...The solder joint strength of Pb/Sn soldering aluminum with electroless layer Sn/Bi and Cu was studied. The results show that the joint shear strength of electroless Sn/Bi on aluminum surface is lower than that of Cu. A Pb-riched region with porosity is formed in region of soldering fillet with electroless Sn/Bi. Both the electroless Sn/Bi layer and Pb-riched layer become thicker, which are the reasons why the shear strength of the solder joint with electroless Sn/Bi on aluminum surface is lower than that of electroless Cu, and the higher the thickness of the electroless Sn/Bi layer is, the lower the shear strength of solder joint is.展开更多
用化学复合镀方法在45钢基体上镀覆Ni P 石墨复合镀层,研究了在不同施镀工艺条件下,对镀层中石墨粒子体积分数的影响,结果表明,当镀液中石墨质量浓度约为2g L、搅拌速度420r min、施镀温度为80℃、镀液的pH值为1时,镀层中石墨的体积... 用化学复合镀方法在45钢基体上镀覆Ni P 石墨复合镀层,研究了在不同施镀工艺条件下,对镀层中石墨粒子体积分数的影响,结果表明,当镀液中石墨质量浓度约为2g L、搅拌速度420r min、施镀温度为80℃、镀液的pH值为1时,镀层中石墨的体积分数达到最高。展开更多
总结自大马士革铜工艺建立以来,电化学工作者利用化学镀技术围绕该工艺而开展的一系列相关研究,介绍了应用化学镀沉积镍三元合金防扩散层和化学镀铜种子层的研究以及离子束沉积法(Ion ized C lus-ter Beam,ICB)形成Pd催化层后的化学镀...总结自大马士革铜工艺建立以来,电化学工作者利用化学镀技术围绕该工艺而开展的一系列相关研究,介绍了应用化学镀沉积镍三元合金防扩散层和化学镀铜种子层的研究以及离子束沉积法(Ion ized C lus-ter Beam,ICB)形成Pd催化层后的化学镀铜技术和超级化学镀铜方法.简要叙述化学镀铜技术在超大规模集成电路中的应用,总结化学镀铜技术的研究进展,并指出了今后的发展方向.展开更多
基金Project(20120407)supported by the Science and Technology Key Development Plan of Jilin Province,China
文摘An electroless ternary Ni-Sn-P transition layer with high corrosion resistance was applied for acid electroless nickel plating on magnesium alloys. The surface morphologies and microstructure of the traditional alkaline electroless Ni-P and novel Ni-Sn-P transition layers were compared by SEM and XRD, and the bonding strengths between the transition layers and AZ31 magnesium alloys were tested. The corrosion resistance of the samples was analyzed by porosity test, potentiodynamic polarization, electrochemical impedance spectroscopy（EIS） in acid electroless solution at p H 4.5 and immersion test in 10% HCl. The results indicate that the transition layer is essential for acid electroless plating Ni-P coatings on magnesium alloys. Under the same thin thickness（-6 μm）, the electroless Ni-Sn-P transition layer possesses superior properties to the traditional Ni-P transition layer, including high amorphization, smooth and dense surface without pores, enhanced bonding strength and corrosion resistance. Most importantly, acid electroless Ni-P coatings can be successfully deposited on magnesium alloys by using Ni-Sn-P transition layer.
基金the National Natural Science Foundation of China(No.60777038).
文摘Metal-coated fiber Bragg grating（FBG）temperature sensors were prepared via electroless nickel（EN）plating and tin electroplating methods on the surface of normal bare FBG.The surface morphologies of the metal-coated layers were observed under a metallographic microscope.The effects of pretreatment sequence,pH value of EN plating solution and current density of electroplating on the performance of the metal-coated layers were analyzed.Meanwhile, the Bragg wavelength shift induced by temperature was monitored by an optical spectrum analyzer.Sensitivity of the metal-coated FBG（MFBG）sensor was almost two times that of normal bare FBG sensor.The measuring temperature of the MFBG sensor could be up to 280℃,which was much better than that of conventional FBG sensor.
文摘The solder joint strength of Pb/Sn soldering aluminum with electroless layer Sn/Bi and Cu was studied. The results show that the joint shear strength of electroless Sn/Bi on aluminum surface is lower than that of Cu. A Pb-riched region with porosity is formed in region of soldering fillet with electroless Sn/Bi. Both the electroless Sn/Bi layer and Pb-riched layer become thicker, which are the reasons why the shear strength of the solder joint with electroless Sn/Bi on aluminum surface is lower than that of electroless Cu, and the higher the thickness of the electroless Sn/Bi layer is, the lower the shear strength of solder joint is.
文摘总结自大马士革铜工艺建立以来,电化学工作者利用化学镀技术围绕该工艺而开展的一系列相关研究,介绍了应用化学镀沉积镍三元合金防扩散层和化学镀铜种子层的研究以及离子束沉积法(Ion ized C lus-ter Beam,ICB)形成Pd催化层后的化学镀铜技术和超级化学镀铜方法.简要叙述化学镀铜技术在超大规模集成电路中的应用,总结化学镀铜技术的研究进展,并指出了今后的发展方向.
文摘利用等离子发射光谱仪、电子能谱仪、X 射线衍射仪、透射电子显微镜等 ,考察引入稀土金属Ce后化学镀Co Fe B合金镀层的化学成分和晶体结构。结果表明 ,随镀液中稀土金属Ce添加量的增加 ,镀层中Ce的含量先增后降 ,在Ce =1 0g/L时达到最大值。Ce的介入使化学镀Co Fe B Ce合金镀层中B含量减少 ,Co和Fe含量增加 ,并使非晶态结构的合金镀层转化为微晶态结构。
