The rapid solidified process and hot press method were performed to produce three hypereutectic 55%Si-Al, 70%Si-Al and 90%Si-Al alloys for heat dissipation materials. The results show that the atomization is an effect...The rapid solidified process and hot press method were performed to produce three hypereutectic 55%Si-Al, 70%Si-Al and 90%Si-Al alloys for heat dissipation materials. The results show that the atomization is an effective rapid solidified method to produce the Si-Al alloy and the size of atomized Si-Al alloy powder is less than 50 μm. The rapid solidified Si-Al alloy powder were hot pressed at 550 ℃ with the pressure of 700 MPa to obtain the relative densities of 99.4%, 99.2% and 94.4% for 55%Si-Al, 70%Si-Al and 90%Si-Al alloys, respectively. The typical physical properties, such as the thermal conductivity, coefficient of thermal expansion （CTE） and electrical conductivity of rapid solidified Si-Al alloys are acceptable as a heat dissipation material for many semiconductor devices. The 55%Si-Al alloy changes greatly （CTE） with the increase of temperature but obtains a good thermal conductivity. The CTE of 90%Si-Al alloy matches with the silicon very well but its thermal conductivity value is less than 100 W/（m.K）. Therefore, the 70%Si-Al alloy possesses the best comprehensive properties of CTE and thermal conductivity for using as the heat sink materials.展开更多
A novel Si-Al alloy was prepared by spray forming process for electronic packaging. Property measurements on spray-formed Si-Al alloys after hot pressing were carried out. The results indicate that the alloys (Si-(30%...A novel Si-Al alloy was prepared by spray forming process for electronic packaging. Property measurements on spray-formed Si-Al alloys after hot pressing were carried out. The results indicate that the alloys (Si-(30%-40%)Al) have advantageous physical and mechanical characteristics, including low coefficient of thermal expansion (6.9×10-6-8.7×10-6/K), high thermal conductivity (118-127 W/(m·K)), low density (2.421×103-2.465×103 kg/m3), high ultimate flexural strength (180-220 MPa) and Brinell hardness (162261). The alloys are easy to machine to tight tolerances using standard machine tools and they can be electroplated with gold finishes and soldered with Sn-Pb alloy without any difficulty.展开更多
Microstnicture variation of spray-formed Si-30%Al alloy during densification process by hot pressing was studied. The results indicate that the microstnicture of as-deposited preforms is fine and homogenous. The prima...Microstnicture variation of spray-formed Si-30%Al alloy during densification process by hot pressing was studied. The results indicate that the microstnicture of as-deposited preforms is fine and homogenous. The primary silicon phases distributing in aluminium matrix evenly are fine and irregular. Aluminium matrix is divided into two groups: supersaturatedα-Al phase orα-Al phase and Al-Si pseudo-eutectic phase or Al-Si eutectic phase. During hot pressing, the primary silicon and the aluminium matrix realign as follows: the primary silicon fractures at a given compressive stress, the particles congregates in microzone with increasing stress, and the aluminium matrix flows and connects in harness. Al-Si pseudo-eutectic phase turns into Al-Si eutectic phase due to the diffusion of atoms during densification process.展开更多
基金Project (2011) supported by the Hunan Nonferrous Research Funding of Hunan Nonferrous Metals Holding Group Co.,Ltd.,China
文摘The rapid solidified process and hot press method were performed to produce three hypereutectic 55%Si-Al, 70%Si-Al and 90%Si-Al alloys for heat dissipation materials. The results show that the atomization is an effective rapid solidified method to produce the Si-Al alloy and the size of atomized Si-Al alloy powder is less than 50 μm. The rapid solidified Si-Al alloy powder were hot pressed at 550 ℃ with the pressure of 700 MPa to obtain the relative densities of 99.4%, 99.2% and 94.4% for 55%Si-Al, 70%Si-Al and 90%Si-Al alloys, respectively. The typical physical properties, such as the thermal conductivity, coefficient of thermal expansion （CTE） and electrical conductivity of rapid solidified Si-Al alloys are acceptable as a heat dissipation material for many semiconductor devices. The 55%Si-Al alloy changes greatly （CTE） with the increase of temperature but obtains a good thermal conductivity. The CTE of 90%Si-Al alloy matches with the silicon very well but its thermal conductivity value is less than 100 W/（m.K）. Therefore, the 70%Si-Al alloy possesses the best comprehensive properties of CTE and thermal conductivity for using as the heat sink materials.
基金Project(G20000672) supported by the National Basic Research Program of China
文摘A novel Si-Al alloy was prepared by spray forming process for electronic packaging. Property measurements on spray-formed Si-Al alloys after hot pressing were carried out. The results indicate that the alloys (Si-(30%-40%)Al) have advantageous physical and mechanical characteristics, including low coefficient of thermal expansion (6.9×10-6-8.7×10-6/K), high thermal conductivity (118-127 W/(m·K)), low density (2.421×103-2.465×103 kg/m3), high ultimate flexural strength (180-220 MPa) and Brinell hardness (162261). The alloys are easy to machine to tight tolerances using standard machine tools and they can be electroplated with gold finishes and soldered with Sn-Pb alloy without any difficulty.
基金Project(G20000672) supported by the National Basic Research Program of China
文摘Microstnicture variation of spray-formed Si-30%Al alloy during densification process by hot pressing was studied. The results indicate that the microstnicture of as-deposited preforms is fine and homogenous. The primary silicon phases distributing in aluminium matrix evenly are fine and irregular. Aluminium matrix is divided into two groups: supersaturatedα-Al phase orα-Al phase and Al-Si pseudo-eutectic phase or Al-Si eutectic phase. During hot pressing, the primary silicon and the aluminium matrix realign as follows: the primary silicon fractures at a given compressive stress, the particles congregates in microzone with increasing stress, and the aluminium matrix flows and connects in harness. Al-Si pseudo-eutectic phase turns into Al-Si eutectic phase due to the diffusion of atoms during densification process.
