In this paper, we proposed 10 Gb/s transmission using 4-channel polymer waveguides on the optical electronic printed circuit board. It was simulated by the ray tracing method for tolerance study of optical interconnec...In this paper, we proposed 10 Gb/s transmission using 4-channel polymer waveguides on the optical electronic printed circuit board. It was simulated by the ray tracing method for tolerance study of optical interconnection and fabrication. In order for easy fabrication and high position accuracy, the polymer waveguides were forming silver coated 45° reflective mirrors by dicing method and e-beam deposition for 90° light beam turning. The coupling loss was demonstrated in different polishing grit sizes. The optical interconnection in board-embed 4-channel flexible waveguides was demonstrated with a low propagation loss of 0.1 dB/cm and a clear eye diagram at 2.5 Gb/s data rate per channel.展开更多
The (DC-GDPAU) is a DC glow discharge plasma experiment that was designed, established, and operated in the Physics Department at Ain Shams University (Egypt). The aim of this experiment is to study and improve some p...The (DC-GDPAU) is a DC glow discharge plasma experiment that was designed, established, and operated in the Physics Department at Ain Shams University (Egypt). The aim of this experiment is to study and improve some properties of a printed circuit board (PCB) by exposing it to the plasma. The device consists of cylindrical discharge chamber with movable parallel circular copper electrodes (cathode and anode) fixed inside it. The distance between them is 12 cm. This plasma experiment works in a low-pressure range (0.15 - 0.70 Torr) for Ar gas with a maximum DC power supply of 200 W. The Paschen curves and electrical plasma parameters (current, volt, power, resistance) characterized to the plasma have been measured and calculated at each cm between the two electrodes. Besides, the electron temperature and ion density are obtained at different radial distances using a double Langmuir probe. The electron temperature (<em>KT<sub>e</sub></em>) was kept stable in range 6.58 to 10.44 eV;whereas the ion density (<em>ni</em>) was in range from 0.91 × 10<sup>10</sup> cm<sup><span style="white-space:nowrap;">−</span>3</sup> to 1.79 × 10<sup>10</sup> cm<sup><span style="white-space:nowrap;">−</span>3</sup>. A digital optical microscope (800×) was employed to draw a comparison between the pre-and after effect of exposure to plasma on the shaping of the circuit layout. The experimental results show that the electrical conductivity increased after plasma exposure, also an improvement in the adhesion force in the Cu foil surface. A significant increase in the conductivity can be directly related to the position of the sample surfaces as well as to the time of exposure. This shows the importance of the obtained results in developing the PCBs manufacturing that uses in different microelectronics devices like those onboard of space vehicles.展开更多
Printed circuit boards(PCBs)are representative composite materials,and their high-quality drilling machining remains a persistent challenge in the industry.The finishing of the cutting edge of a microdrill is crucial ...Printed circuit boards(PCBs)are representative composite materials,and their high-quality drilling machining remains a persistent challenge in the industry.The finishing of the cutting edge of a microdrill is crucial to drill performance in machining fine-quality holes with a prolonged tool life.The miniature size involving submicron scale geometric dimensions,a complex flute shape,and low fracture toughness makes the cutting edge of microdrills susceptible to breakage and has been the primary limiting factor in edge preparation for microdrills.In this study,a newly developed cutting edge preparation method for microdrills was tested experimentally on electronic printed circuit boards.The proposed method,namely,shear thickening polishing,limited the cutting edge burrs and chipping on the cutting edge,and this in turn transformed the cutting edge’s radius from being sharp to smooth.Moreover,the edge–edge radius could be regulated by adjusting the processing time.PCB drilling experiments were conducted to investigate the influence of different cutting edge radii on wear,hole position accuracy,nail head value,and hole wall roughness.The proposed approach showed 20%enhancement in hole position accuracy,33%reduction in the nail head value,and 19%reduction in hole wall roughness compared with the original microdrill.However,a threshold is needed;without it,excessive shear thickening polishing will result in a blunt edge,which may accelerate the wear of the microdrill.Wear was identified as the primary factor that reduced hole quality.The study indicates that in printed circuit board machining,microdrills should effectively eliminate grinding defects and maintain the sharpness of the cutting edge as much as possible to obtain excellent drilling quality.Overall,shear thickening polishing is a promising method for cutting edge preparation of microdrills.Further research and optimization can lead to additional improvements in microdrill performance and contribute to the continued advancement of printed circuit board manufacturing.展开更多
The crushing performance of printed circuit board (PCB) was studied on several crushers. The results show that PCB is a material which is difficult to crush. The crushing performance of PCB with disk crusher, especial...The crushing performance of printed circuit board (PCB) was studied on several crushers. The results show that PCB is a material which is difficult to crush. The crushing performance of PCB with disk crusher, especially vibration grinding, which has cut or impact action, excels that of jaw crusher or roller crusher. The PCB scrap is worthwhile to recycle using variety of modern characterization methods. When compared with natural resources, this material stream remains a rich precious metal and nonferrous metals. In PCB scrap, metals account for 47% of the total material composition, in which there exists 19.66% copper, 11.47% iron, 3.93% lead, 300 g/t gold and 510 kg/t silver, etc. In addition, the PCB scrap contains 27% of plastics and 26% of refractory oxides.展开更多
From the background of poor responses of metallic particles in printed circuit board comminution fines to chemical conditioning froth flotation schemes, contrary to expectations based on native metal flotation, surfac...From the background of poor responses of metallic particles in printed circuit board comminution fines to chemical conditioning froth flotation schemes, contrary to expectations based on native metal flotation, surface studies were carried out on samples of these metallic particles in quest for the probable causatives. Auger electron spectroscopy combined with argon beam depth profiling was employed in studying the surface make-up of the metal particles. The composition profiles down to 340 nm surface depth obtained showed that the supposed metallic particles consist of organics, oxides, and various trace alloys different from the bulk material of the particles. The profiles reveal the peculiar surfaces of the particles and the matrix from which the particles were liberated. The study provides insight for better appraisal of the flotation system the sample presents. Implementing chemical conditioning flotation scheme on this sample must carefully consider the peculiar surface make up in contrast to native metal occurrences.展开更多
The recent rapid development of electronics and continual increase of the complexity and variety of electronic circuits (chips, packets, micro- and embedded systems) creates a demand for viable test and diagnostic met...The recent rapid development of electronics and continual increase of the complexity and variety of electronic circuits (chips, packets, micro- and embedded systems) creates a demand for viable test and diagnostic methods. These recent developments have led to a great deal of research interest in electronic diagnostic systems, especially of effective diagnosis methods of detection, localization and identification levels of hard (catastrophic) and soft (parametric) faults in analog circuits. At present, the majority of electronic devices (embedded systems) are designed based on digital circuits;however a lot of them also contain analog components that require more complicated testing techniques. This paper presents a novel, electronic components tester board with inside, outside of circuit under tested. The design is first simulated by using the electronic work-bench software Multisim 11 in order to obtain satisfactory theoretical results for each standalone element of the design. Thereafter, the design is practically implemented and experimentally verified to show agreement with the simulated results.展开更多
文摘In this paper, we proposed 10 Gb/s transmission using 4-channel polymer waveguides on the optical electronic printed circuit board. It was simulated by the ray tracing method for tolerance study of optical interconnection and fabrication. In order for easy fabrication and high position accuracy, the polymer waveguides were forming silver coated 45° reflective mirrors by dicing method and e-beam deposition for 90° light beam turning. The coupling loss was demonstrated in different polishing grit sizes. The optical interconnection in board-embed 4-channel flexible waveguides was demonstrated with a low propagation loss of 0.1 dB/cm and a clear eye diagram at 2.5 Gb/s data rate per channel.
文摘The (DC-GDPAU) is a DC glow discharge plasma experiment that was designed, established, and operated in the Physics Department at Ain Shams University (Egypt). The aim of this experiment is to study and improve some properties of a printed circuit board (PCB) by exposing it to the plasma. The device consists of cylindrical discharge chamber with movable parallel circular copper electrodes (cathode and anode) fixed inside it. The distance between them is 12 cm. This plasma experiment works in a low-pressure range (0.15 - 0.70 Torr) for Ar gas with a maximum DC power supply of 200 W. The Paschen curves and electrical plasma parameters (current, volt, power, resistance) characterized to the plasma have been measured and calculated at each cm between the two electrodes. Besides, the electron temperature and ion density are obtained at different radial distances using a double Langmuir probe. The electron temperature (<em>KT<sub>e</sub></em>) was kept stable in range 6.58 to 10.44 eV;whereas the ion density (<em>ni</em>) was in range from 0.91 × 10<sup>10</sup> cm<sup><span style="white-space:nowrap;">−</span>3</sup> to 1.79 × 10<sup>10</sup> cm<sup><span style="white-space:nowrap;">−</span>3</sup>. A digital optical microscope (800×) was employed to draw a comparison between the pre-and after effect of exposure to plasma on the shaping of the circuit layout. The experimental results show that the electrical conductivity increased after plasma exposure, also an improvement in the adhesion force in the Cu foil surface. A significant increase in the conductivity can be directly related to the position of the sample surfaces as well as to the time of exposure. This shows the importance of the obtained results in developing the PCBs manufacturing that uses in different microelectronics devices like those onboard of space vehicles.
基金support from the National Natural Science Foundation of China(Grant No.52175441)the Natural Science Foundation of Zhejiang Province,China(Grant No.LD22E050010)+4 种基金the travel scholarship from the China Scholarship Council(Grant No.202208330333)for secondment of Jiahuan Wang at London South Bank University(LSBU)for working closely with Prof.GoelSaurav Goel would like to acknowledge the funding support from UK Research and Innovation,UKRI(Grant Nos.EP/S036180/1 and EP/T024607/1)the feasibility study awards to LSBU from the UKRI National Interdisciplinary Circular Economy Hub(Grant No.EP/V029746/1)Transforming the Foundation Industries:A Network+(Grant No.EP/V026402/1)the International Exchange Cost Share Award by the Royal Society(Grant No.IEC\NSFC\223536).This work accessed the supercomputing service(Isambard-AI,Bristol,UK)via the Resource Allocation Panel and Kittrick(LSBU)-based computational resources.
文摘Printed circuit boards(PCBs)are representative composite materials,and their high-quality drilling machining remains a persistent challenge in the industry.The finishing of the cutting edge of a microdrill is crucial to drill performance in machining fine-quality holes with a prolonged tool life.The miniature size involving submicron scale geometric dimensions,a complex flute shape,and low fracture toughness makes the cutting edge of microdrills susceptible to breakage and has been the primary limiting factor in edge preparation for microdrills.In this study,a newly developed cutting edge preparation method for microdrills was tested experimentally on electronic printed circuit boards.The proposed method,namely,shear thickening polishing,limited the cutting edge burrs and chipping on the cutting edge,and this in turn transformed the cutting edge’s radius from being sharp to smooth.Moreover,the edge–edge radius could be regulated by adjusting the processing time.PCB drilling experiments were conducted to investigate the influence of different cutting edge radii on wear,hole position accuracy,nail head value,and hole wall roughness.The proposed approach showed 20%enhancement in hole position accuracy,33%reduction in the nail head value,and 19%reduction in hole wall roughness compared with the original microdrill.However,a threshold is needed;without it,excessive shear thickening polishing will result in a blunt edge,which may accelerate the wear of the microdrill.Wear was identified as the primary factor that reduced hole quality.The study indicates that in printed circuit board machining,microdrills should effectively eliminate grinding defects and maintain the sharpness of the cutting edge as much as possible to obtain excellent drilling quality.Overall,shear thickening polishing is a promising method for cutting edge preparation of microdrills.Further research and optimization can lead to additional improvements in microdrill performance and contribute to the continued advancement of printed circuit board manufacturing.
文摘The crushing performance of printed circuit board (PCB) was studied on several crushers. The results show that PCB is a material which is difficult to crush. The crushing performance of PCB with disk crusher, especially vibration grinding, which has cut or impact action, excels that of jaw crusher or roller crusher. The PCB scrap is worthwhile to recycle using variety of modern characterization methods. When compared with natural resources, this material stream remains a rich precious metal and nonferrous metals. In PCB scrap, metals account for 47% of the total material composition, in which there exists 19.66% copper, 11.47% iron, 3.93% lead, 300 g/t gold and 510 kg/t silver, etc. In addition, the PCB scrap contains 27% of plastics and 26% of refractory oxides.
文摘From the background of poor responses of metallic particles in printed circuit board comminution fines to chemical conditioning froth flotation schemes, contrary to expectations based on native metal flotation, surface studies were carried out on samples of these metallic particles in quest for the probable causatives. Auger electron spectroscopy combined with argon beam depth profiling was employed in studying the surface make-up of the metal particles. The composition profiles down to 340 nm surface depth obtained showed that the supposed metallic particles consist of organics, oxides, and various trace alloys different from the bulk material of the particles. The profiles reveal the peculiar surfaces of the particles and the matrix from which the particles were liberated. The study provides insight for better appraisal of the flotation system the sample presents. Implementing chemical conditioning flotation scheme on this sample must carefully consider the peculiar surface make up in contrast to native metal occurrences.
文摘The recent rapid development of electronics and continual increase of the complexity and variety of electronic circuits (chips, packets, micro- and embedded systems) creates a demand for viable test and diagnostic methods. These recent developments have led to a great deal of research interest in electronic diagnostic systems, especially of effective diagnosis methods of detection, localization and identification levels of hard (catastrophic) and soft (parametric) faults in analog circuits. At present, the majority of electronic devices (embedded systems) are designed based on digital circuits;however a lot of them also contain analog components that require more complicated testing techniques. This paper presents a novel, electronic components tester board with inside, outside of circuit under tested. The design is first simulated by using the electronic work-bench software Multisim 11 in order to obtain satisfactory theoretical results for each standalone element of the design. Thereafter, the design is practically implemented and experimentally verified to show agreement with the simulated results.
