Low field microwave absorption and magnetization process in CoFeNi electroplated wires

Ferromagnetic resonance （FMR）, Ferromagnetic antirresonance （FMAR） and low field magnetoimpedance （MI） are the characteristic features of high frequency losses in applied fields. While some results on FMR and FMAR in CoFeNi electroplated wires were reported earlier, here we present microwave absorption in CuBe wires electroplated by 1 μm FeCoNi magnetic layer at very low fields. These data are comparatively analysed together with longitudinal hysteresis loops in order to reveal the correlation between power absorption and magnetization processes. Microwave studies are made by using the cavity perturbation method at 9.65 GHz for a DC field parallel to the sample axis, and with microwave magnetic field hrf parallel or perpendicular to the wire axis. Two peaks have been observed in all samples, one is due to FMR, and the other is, at very low fields, related to MI. The MI peaks represent minima in power absorption. By comparing with the hysteresis loop we remark the close correspondence between the MI phenomena in the axial mode and the concomitant magnetization process.

Magnetoimpedance of Electroplated Wires with Large Core Diameters

Monolayered Co and trilayered Co/Cu/Co were electroplated on 485 μm-diameter Cu wires using the bath pH 2.5. These wires can be functioned as magnetic sensors owing to their magnetoimpedance （MI） effect. By measuring at four different frequencies （100, 250, 500, and 1000 kHz） and Co thicknesses （2.5, 5.0, 10.0, and 25.0μm）, the MI ratio of electroplated Co on Cu wires tended to increase with increasing Co thickness and frequency of the driving current. The Co/Cu/Co on Cu wires exhibited even higher MI ratio. The magnetic layer also regulated the magnetic inductions and anisotropy regardless of the size of nonmagnetic core. Nevertheless, the diameter of the Cu core had a significant effect on the MI ratio. By comparing with the 47.7 μm-diameter Ag cores electroplated by Co and Co/Cu/Co of the same thickness, the Cu cores with a larger diameter gave rise to a larger MI ratio because their lower electrical resistance enhanced the crossing effect. Substantial MI ratio was observed even in a low frequency regime because the skin effect occurred at a low frequency in the case of electroplated wires with large core diameters.

Research on Cutting Trajectory of Electroplated Diamond Wire Saw

The cutting process of electroplated diamond wire saw was researched on the basis of impulse and vibration machining theories. The different contact states in the cutting process were analyzed by using the finite element method. It shows that the cutting stress is uniformly distributed along the direction of the workpiece width in the steady state. A mathematical equation of sawing trajectory was established by using the superposition principle and the cutting experiment of wire saw to calculate the cutting trajectory. The comparison of the theoretical trajectory with the calculated one indicates that the error is less than 15%. The research results provide a theoretic basis for optimization of the saw's cutting process parameters.

Research on Cutting Force of Ultrasonic Diamond Wire Saw

Based on impulse and vibration machining theories,a mathematical model of cutting force for the electroplated diamond ultrasonic wire saw was established using superposition principle.The differences between the cutting forces with and without ultrasonic effect were analyzed theoretically and experimentally.The results indicate that the cutting force of diamond wire increases along with the spindle speed decrease and the lateral pressure increase.The force in ultrasonic vibration cutting is about 20% to 30% less than that in conventional cutting.Also,the cutting trajectory of single diamond grit in sawing process is simulated,and the reason that the ultrasonic vibration can reduce the cutting force is explained further.