A diode-triggered silicon controlled rectifier (DTSCR) is being developed as an electrostatic discharge (ESD) pro- tection device for low voltage applications. However, DTSCR leaks high current during normal operation...A diode-triggered silicon controlled rectifier (DTSCR) is being developed as an electrostatic discharge (ESD) pro- tection device for low voltage applications. However, DTSCR leaks high current during normal operation due to the Darlington effect of the triggering-assist diode string. In this study, two types of diode string triggered SCRs are designed for low leakage consideration; the modified diode string and composite polysilicon diode string triggered SCRs (MDTSCR & PDTSCR). Com- pared with the conventional DTSCR (CDTSCR), the MDTSCR has a much lower substrate leakage current with a relatively large silicon cost, and the PDTSCR has a much lower substrate leakage current with similar area and shows good leakage performance at a high temperature. Other DTSCR ESD properties are also investigated, especially regarding their layout, triggering voltage and failure current.展开更多
A 1.575 GHz CMOS (complementary metal-oxidesemiconductor transistor) low noise amplifier(LNA) suitable for a low intermediate frequency(IF) global positioning system(GPS) receiver is presented. Considering par...A 1.575 GHz CMOS (complementary metal-oxidesemiconductor transistor) low noise amplifier(LNA) suitable for a low intermediate frequency(IF) global positioning system(GPS) receiver is presented. Considering parasitic effects resulting from bond pad and input electrostatic discharge (ESD) protection diodes, the optimization of the input matching and noise performance is analyzed, and a narrowband inductor model is applied to the circuit design and optimization. Based on the Volterra series, the nonlinearity of the LNA is analyzed and an equation describing input-referred third-order intercept points (IIP3) which indicate the nonlinearity effects is derived; accordingly, the trade-off between the power consumption and linearity is made. The LNA is designed and simulated with TSMC (Taiwan Semiconductor Manufacturing Company) 0. 18 μm radio frequency (RF)technology. Simulation results show that the LNA has a noise figure of only 1.1 dB, - 8. 3 dBm IIP3 with 3 mA current consumption from a 1.8 V voltage supply, and the input impedances match well.展开更多
Electrostatic discharge (ESD) induced parasitic effects have serious impacts on performance of radio frequency (RF) integrated circuits (IC). This paper discusses a comprehensive noise analysis procedure for ESD...Electrostatic discharge (ESD) induced parasitic effects have serious impacts on performance of radio frequency (RF) integrated circuits (IC). This paper discusses a comprehensive noise analysis procedure for ESD protection structures and their negative influences on RF ICs. Noise figures (NFs) of commonly used ESD protection structures and their impacts on a single-chip 5.5 GHz low-noise amplifier (LNA) circuit were depicted. A design example in 0.18 μm SiGe BiCMOS was presented. Measurement results confirm that significant noise degradation occurs in the LNA circuit due to ESD-induced noise effects. A practical design procedure for ESD-protected RF ICs is provided for real-world RF IC optimization.展开更多
基金Project partially supported by the Zhejiang Provincial Nature Science Fund of China (Nos. Y107055 and Y1080546)the Semiconductor Manufacturing International Corp. (SMIC)
文摘A diode-triggered silicon controlled rectifier (DTSCR) is being developed as an electrostatic discharge (ESD) pro- tection device for low voltage applications. However, DTSCR leaks high current during normal operation due to the Darlington effect of the triggering-assist diode string. In this study, two types of diode string triggered SCRs are designed for low leakage consideration; the modified diode string and composite polysilicon diode string triggered SCRs (MDTSCR & PDTSCR). Com- pared with the conventional DTSCR (CDTSCR), the MDTSCR has a much lower substrate leakage current with a relatively large silicon cost, and the PDTSCR has a much lower substrate leakage current with similar area and shows good leakage performance at a high temperature. Other DTSCR ESD properties are also investigated, especially regarding their layout, triggering voltage and failure current.
基金The National High Technology Research and Development Program of China(863Program)(No.2007AA12Z332)
文摘A 1.575 GHz CMOS (complementary metal-oxidesemiconductor transistor) low noise amplifier(LNA) suitable for a low intermediate frequency(IF) global positioning system(GPS) receiver is presented. Considering parasitic effects resulting from bond pad and input electrostatic discharge (ESD) protection diodes, the optimization of the input matching and noise performance is analyzed, and a narrowband inductor model is applied to the circuit design and optimization. Based on the Volterra series, the nonlinearity of the LNA is analyzed and an equation describing input-referred third-order intercept points (IIP3) which indicate the nonlinearity effects is derived; accordingly, the trade-off between the power consumption and linearity is made. The LNA is designed and simulated with TSMC (Taiwan Semiconductor Manufacturing Company) 0. 18 μm radio frequency (RF)technology. Simulation results show that the LNA has a noise figure of only 1.1 dB, - 8. 3 dBm IIP3 with 3 mA current consumption from a 1.8 V voltage supply, and the input impedances match well.
文摘Electrostatic discharge (ESD) induced parasitic effects have serious impacts on performance of radio frequency (RF) integrated circuits (IC). This paper discusses a comprehensive noise analysis procedure for ESD protection structures and their negative influences on RF ICs. Noise figures (NFs) of commonly used ESD protection structures and their impacts on a single-chip 5.5 GHz low-noise amplifier (LNA) circuit were depicted. A design example in 0.18 μm SiGe BiCMOS was presented. Measurement results confirm that significant noise degradation occurs in the LNA circuit due to ESD-induced noise effects. A practical design procedure for ESD-protected RF ICs is provided for real-world RF IC optimization.